STPS5L25
Low drop power Schottky rectifier
Features
2
■
■
Very low forward voltage drop for less power
dissipation and reduced heatsink
Optimized conduction/reverse losses trade-off
which means the highest efficiency in the
applications
High power surface mount miniature package
Avalanche capability specified
3
4 (TAB)
4
■
■
2
3
Description
Single Schottky rectifier suited to switched mode
power supplies and high frequency DC to DC
converters.
This device is especially intended for use as a
rectifier at the secondary of 3.3 V SMPS units.
1
NC
DPAK
Table 1.
Device summary
I
F(AV)
V
RRM
T
j
(max)
V
F
(max)
5A
25 V
150 °C
0.35 V
April 2008
Rev 6
1/7
www.st.com
7
Characteristics
STPS5L25
1
Table 2.
Symbol
V
RRM
I
F(RMS)
I
F(AV)
I
FSM
I
RRM
I
RSM
P
ARM
T
stg
T
j
dV/dt
1.
dPtot
---------------
dTj
Characteristics
Absolute ratings (limiting values)
Parameter
Repetitive peak reverse voltage
RMS forward current
Average forward current
Surge non repetitive forward current
Repetitive peak reverse current
Non repetitive peak reverse current
Repetitive peak avalanche power
Storage temperature range
Maximum operating junction temperature
Critical rate of rise of reverse voltage
(1)
Value
25
7
T
C
= 145 °C
δ
= 0.5
t
p
= 10 ms sinusoidal
t
p
= 2 µs square F = 1 kHz
t
p
= 100 µs square
t
p
= 1 µs Tj = 25 °C
5
75
1
2
3000
-65 to + 150
150
10000
Unit
V
A
A
A
A
A
W
°C
°C
V/µs
1
<
--------------------------
condition to avoid thermal runaway for a diode on its own heatsink
Rth
(
j
–
a
)
Table 3.
Symbol
R
th(j-c)
Thermal resistance
Parameter
Junction to case
Value
2.5
Unit
°C/W
Table 4.
Symbol
I
R
(1)
Static electrical characteristics
Parameter
Reverse leakage current
Test Conditions
T
j
= 25 °C
T
j
= 125 °C
T
j
= 25 °C
Min.
Typ.
Max.
350
Unit
µA
mA
V
R
= V
RRM
I
F
= 5 A
I
F
= 5 A
I
F
= 10 A
I
F
= 10 A
55
115
0.47
V
F(
1.
)
Forward voltage drop
T
j
= 125 °C
T
j
= 25 °C
T
j
= 125 °C
0.31
0.35
V
0.59
0.41
0.50
1. Pulse test: tp = 380 µs,
δ
< 2%
2/7
STPS5L25
Characteristics
Figure 1.
PF(av)(W)
2.5
2.0
1.5
1.0
Average forward power dissipation Figure 2.
versus average forward current
6
δ
= 0.1
δ
= 0.05
δ
= 0.2
δ
= 0.5
Average forward current versus
ambient temperature (δ = 0.5)
IF(av)(A)
Rth(j-a)=Rth(j-c)
5
4
δ
=1
3
T
Rth(j-a)=70°C/W
2
T
0.5
IF(av) (A)
0.0
0
1
2
3
4
δ
=tp/T
tp
1
5
6
0
δ
=tp/T
tp
Tamb(°C)
50
75
100
125
150
0
25
Figure 3.
Normalized avalanche power
derating versus pulse duration
Figure 4.
Normalized avalanche power
derating versus junction
temperature
P
ARM
(t
p
)
P
ARM
(1µs)
1
1.2
1
P
ARM
(t
p
)
P
ARM
(25°C)
0.1
0.8
0.6
0.01
0.4
0.2
0.001
0.01
0.1
1
t
p
(µs)
10
100
1000
T
j
(°C)
0
0
25
50
75
100
125
150
Figure 5.
Non repetitive surge peak forward
current versus overload duration
(maximum values)
Figure 6.
Relative variation of thermal
impedance junction to case
versus pulse duration
100
80
60
40
IM(A)
1.0
0.8
Tc=25°C
Tc=75°C
Zth(j-c)/Rth(j-c)
0.6
0.4
δ
= 0.5
δ
= 0.2
Tc=100°C
T
20
0
1E-3
I
M
t
0.2
δ
=0.5
Single pulse
δ
= 0.1
t(s)
1E-2
1E-1
1E+0
tp(s)
0.0
1.0E-4
1.0E-3
1.0E-2
δ
=tp/T
tp
1.0E-1
1.0E+0
3/7
Characteristics
STPS5L25
Figure 7.
Reverse leakage current versus
reverse voltage applied (typical
values)
Figure 8.
Junction capacitance versus
reverse voltage applied (typical
values)
3E+2
1E+2
1E+1
1E+0
1E-1
IR(mA)
Tj=150°C
C(pF)
2000
F=1MHz
Tj=25°C
Tj=125°C
1000
500
Tj=25°C
1E-2
VR(V)
1E-3
0
5
10
15
20
25
200
VR(V)
100
1
2
5
10
20
30
Figure 9.
Forward voltage drop versus
forward current (maximum values)
Figure 10. Thermal resistance junction to
ambient versus copper surface
under tab (Epoxy printed circuit
board FR4, copper thickness:
35 µm)
Rth(j-a) (°C/W)
100
100.0
IFM(A)
Typical values
Tj=150°C
80
Tj=125°C
10.0
60
40
1.0
Tj=25°C
20
VFM(V)
0
0.1
0.0
0
2
4
6
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
8
10
12
S(Cu) (cm²)
14
16
18
20
4/7
STPS5L25
Package Information
2
Package Information
●
Epoxy meets UL94, V0
In order to meet environmental requirements, ST offers these devices in ECOPACK
®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at
www.st.com.
Figure 11. DPAK dimensions
Dimensions
Ref
Millimeters
Min.
A
E
B2
L2
C2
A
Inches
Min.
0.086
0.035
0.001
0.025
0.204
0.017
0.018
0.236
0.251
0.173
0.368
Max.
0.094
0.043
0.009
0.035
0.212
0.023
0.023
0.244
0.259
0.181
0.397
Max.
2.40
1.10
0.23
0.90
5.40
0.60
0.60
6.20
6.60
4.60
10.10
2.20
0.90
0.003
0.64
5.20
0.45
0.48
6.00
6.40
4.40
9.35
A1
A2
B
D
B2
C
C2
H
L4
B
G
A1
R
R
C
D
E
A2
0.60 MIN.
G
H
V2
L2
L4
V2
0.80 typ.
0.60
0°
1.00
8°
0.031 typ.
0.023
0°
0.039
8°
Figure 12. Foot print dimensions (in millimeters)
6.7
3
3
1.6
2.3
6.7
2.3
1.6
5/7
