Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
1. Zener voltage is measured with a pulse test current I
Z
at an ambient temperature of 25°C.
*Include SZ-prefix devices where applicable.
www.onsemi.com
3
MM5ZxxxT1G Series, SZMM5ZxxxT1G Series
PACKAGE DIMENSIONS
SOD−523
CASE 502
ISSUE E
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH.
MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PRO-
TRUSIONS, OR GATE BURRS.
DIM
A
b
c
D
E
H
E
L
L2
MILLIMETERS
MIN
NOM
MAX
0.50
0.60
0.70
0.25
0.30
0.35
0.07
0.14
0.20
1.10
1.20
1.30
0.70
0.80
0.90
1.50
1.60
1.70
0.30 REF
0.15
0.20
0.25
−X−
D
−Y−
E
2X
b
0.08
1
M
2
X Y
TOP VIEW
A
STYLE 1:
PIN 1. CATHODE (POLARITY BAND)
2. ANODE
c
H
E
SIDE VIEW
2X
RECOMMENDED
SOLDERING FOOTPRINT*
L
2X
1.80
2X
0.48
0.40
2X
L2
PACKAGE
OUTLINE
DIMENSION: MILLIMETERS
BOTTOM VIEW
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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