TA 33
www.vishay.com
Vishay Sfernice
Wirebondable Dual Value Thin Film Chip Resistor Networks,
Center Tap
FEATURES
• Center tap feature
• Resistor material: Self-passivating
Tantalum nitride
• Silicon substrate for good power dissipation
• Wirebondable
• Material categorization:
for definitions of compliance please see
www.vishay.com/doc?99912
Actual Size
DESIGN SUPPORT TOOLS
Models
Available
click logo to get started
SCHEMATIC
R
T
R
1
R
2
These tantalum chips combine excellent stability 0.07 %
(2000 h, rated power at +70 °C) with great power handling
capacity. Two bonding pads per termination allow greater
flexibility in hybrid layout design.
R
T
= R
1
+ R
2
with R
1
= R
2
Standard
STANDARD ELECTRICAL SPECIFICATIONS
MODEL
TA 33
SIZE
0303
RESISTANCE
RANGE
(1)
50 to 1M
POWER RATING
P
70 °C
W
0.125
ABSOLUTE
TOLERANCE
±%
0.5, 1, 2
RATIO
TOLERANCE
±%
0.1, 0.5
ABSOLUTE
TCR
(2)
± ppm/°C
50, 100
RATIO
TCR
± ppm/°C
5
Notes
(1)
(R =
R
+
R
)
T
1
2
(2)
± 100 ppm/°C, ± 50 ppm/°C on request at -55 °C to +155 °C
PERFORMANCES
TEST
Ohmic value: Ratio
Stability
Limiting voltage
Noise
Thermal EMF
Shelf life stability
SPECIFICATIONS
1/1 standard (unequal values: please consult)
± 0.07 % typical, ± 0.1 maximum
50 V
DC
on
R
T
< - 35 dB typical
0.01 μV/°C
100 ppm
1 year at +25 °C
MIL-STD-202 method 308
2000 h at +70 °C under Pn
CONDITIONS
Operating temperature
range
Rated Power in %
CLIMATIC SPECIFICATIONS
-55 °C to +155 °C
DERATING
100
80
60
40
20
0
Storage temperature range
-55 °C to +155 °C
0
25
50
75
100
125
150
175
Ambient Temperature in °C
Revision: 25-Jan-18
Document Number: 60066
1
For technical questions, contact:
sferthinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
TA 33
www.vishay.com
DIMENSIONS
DIMENSION
B
Bonding Pad Area
D
Vishay Sfernice
INCHES
0.033 ± 0.004
0.033 ± 0.004
0.01 to 0.015
0.006
0.004
0.006
MILLIMETERS
0.855 ± 0.10
0.855 ± 0.10
0.25 to 0.40
0.15
0.10
0.15
A
B
C
A
E
D
E
C
F
F
MECHANICAL SPECIFICATIONS
Resistive element
Substrate material
Passivation
Bonding pads
Tantalum nitride
Silicon
Self passivation
Aluminum, gold on request
GLOBAL PART NUMBER INFORMATION
New Global Part Numbering: TA33-5K2F25KD0099 (preferred part number format)
T
A
3
3
-
5
K
2
F
2
5
K
D
0
0
9
9
GLOBAL MODEL
R
1
VALUE
Decimal
R, K, or M
ABS. TOLERANCE
D
= ± 0.5 %
F
= ± 1.0 %
G
= ± 2.0 %
R
2
VALUE
Decimal
R, K, or M
RAT. TOLERANCE
B
= ± 0.1 %
D
= ± 0.5 %
OPTION
Leave blank
if no option
Revision: 25-Jan-18
Document Number: 60066
2
For technical questions, contact:
sferthinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
Legal Disclaimer Notice
www.vishay.com
Vishay
Disclaimer
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
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“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
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particular product with the properties described in the product specification is suitable for use in a particular application.
Parameters provided in datasheets and / or specifications may vary in different applications and performance may vary over
time. All operating parameters, including typical parameters, must be validated for each customer application by the customer’s
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including but not limited to the warranty expressed therein.
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Revision: 08-Feb-17
1
Document Number: 91000
