TAS5630B

TAS5630B Analog input 300W Stereo class D amplifier with integrated feedback

器件类别：半导体模拟混合信号IC

厂商名称：Texas Instruments(德州仪器)

厂商官网：http://www.ti.com.cn/

器件标准： Rohs认证

敬请期待

器件参数

参数名称

属性值

Audio input type

Analog Input

Power to parallel bridge tied load(Max)(W)

400

Speaker channels(Max)

Output power(W)

300

Iq(Max)(mA)

11.5

PSRR(dB)

Architecture

Class-D

Rating

Catalog

Power stage supply(Max)(V)

52.5

Sampling rate(Max)(kHz)

Approx. price(US$)

8.87 | 1ku

Power stage supply(Min)(V)

THD + N @ 1 kHz(%)

0.03

Control interface

Hardware

SNR(dB)

100

Analog supply(Min)(V)

10.8

Closed/open loop

Closed

Iq(Typ)(mA)

13.3

Operating temperature range(C)

0 to 70

Analog supply(Max)(V)

13.2

Load(Min)(ohms)

参数对比

与TAS5630B相近的元器件有：HPA01202BDKDR、TAS5630BPHDR。描述及对比如下：

型号	TAS5630B	HPA01202BDKDR	TAS5630BPHDR
描述	TAS5630B Analog input 300W Stereo class D amplifier with integrated feedback	Analog input 300W Stereo class D amplifier with integrated feedback 44-HSSOP 0 to 70
Brand Name	-	Texas Instruments	Texas Instruments
是否无铅	-	不含铅	不含铅
是否Rohs认证	-	符合	符合
包装说明	-	HSSOP,	HTQFP,
Reach Compliance Code	-	compliant	compliant
商用集成电路类型	-	AUDIO AMPLIFIER	AUDIO AMPLIFIER
JESD-30 代码	-	R-PDSO-G44	S-PQFP-G64
JESD-609代码	-	e4	e4
长度	-	15.9 mm	14 mm
湿度敏感等级	-	4	4
信道数量	-	4	4
功能数量	-	1	1
端子数量	-	44	64
最高工作温度	-	70 °C	70 °C
标称输出功率	-	300 W	300 W
封装主体材料	-	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	-	HSSOP	HTQFP
封装形状	-	RECTANGULAR	SQUARE
封装形式	-	SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH	FLATPACK, HEAT SINK/SLUG, THIN PROFILE
座面最大高度	-	3.6 mm	1.2 mm
最大供电电压 (Vsup)	-	13.2 V	13.2 V
最小供电电压 (Vsup)	-	10.8 V	10.8 V
表面贴装	-	YES	YES
温度等级	-	COMMERCIAL	COMMERCIAL
端子面层	-	Nickel/Palladium/Gold (Ni/Pd/Au)	Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式	-	GULL WING	GULL WING
端子节距	-	0.65 mm	0.8 mm
端子位置	-	DUAL	QUAD
宽度	-	11 mm	14 mm