型号
- 型号
- 关键词
C2MOS DIGITAL INTERGRATED CIRCUIT SILICON MONOLITHIC
厂商名称：Toshiba(东芝)
厂商官网：http://toshiba-semicon-storage.com/
下载文档| 型号 | TC40H375P | TC40H375 | TC40H375F |
|---|---|---|---|
| 描述 | C2MOS DIGITAL INTERGRATED CIRCUIT SILICON MONOLITHIC | C2MOS DIGITAL INTERGRATED CIRCUIT SILICON MONOLITHIC | C2MOS DIGITAL INTERGRATED CIRCUIT SILICON MONOLITHIC |
| 是否Rohs认证 | 不符合 | - | 不符合 |
| 厂商名称 | Toshiba(东芝) | - | Toshiba(东芝) |
| 包装说明 | DIP, DIP16,.3 | - | SOP, SOP16,.3 |
| Reach Compliance Code | unknow | - | unknow |
| JESD-30 代码 | R-PDIP-T16 | - | R-PDSO-G16 |
| JESD-609代码 | e0 | - | e0 |
| 负载电容（CL） | 15 pF | - | 15 pF |
| 逻辑集成电路类型 | D LATCH | - | D LATCH |
| 最大I（ol） | 0.0014 A | - | 0.0014 A |
| 位数 | 4 | - | 4 |
| 功能数量 | 1 | - | 1 |
| 端子数量 | 16 | - | 16 |
| 最高工作温度 | 85 °C | - | 85 °C |
| 最低工作温度 | -40 °C | - | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY |
| 封装代码 | DIP | - | SOP |
| 封装等效代码 | DIP16,.3 | - | SOP16,.3 |
| 封装形状 | RECTANGULAR | - | RECTANGULAR |
| 封装形式 | IN-LINE | - | SMALL OUTLINE |
| Prop。Delay @ Nom-Su | 65 ns | - | 65 ns |
| 认证状态 | Not Qualified | - | Not Qualified |
| 表面贴装 | NO | - | YES |
| 技术 | CMOS | - | CMOS |
| 温度等级 | INDUSTRIAL | - | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | - | GULL WING |
| 端子节距 | 2.54 mm | - | 1.27 mm |
| 端子位置 | DUAL | - | DUAL |
| Base Number Matches | 1 | - | 1 |
