型号
- 型号
- 关键词
IC 4M X 1 FAST PAGE DRAM, 60 ns, PDIP18, 0.300 INCH, PLASTIC, DIP-18, Dynamic RAM
厂商名称：Toshiba(东芝)
厂商官网：http://toshiba-semicon-storage.com/
下载文档| 型号 | TC514100APL-60 | TC514100AJL-60 | TC514100ASJL-60 | TC514100AZL-60 |
|---|---|---|---|---|
| 描述 | IC 4M X 1 FAST PAGE DRAM, 60 ns, PDIP18, 0.300 INCH, PLASTIC, DIP-18, Dynamic RAM | IC 4M X 1 FAST PAGE DRAM, 60 ns, PDSO20, 0.350 INCH, PLASTIC, SOJ-26/20, Dynamic RAM | IC 4M X 1 FAST PAGE DRAM, 60 ns, PDSO20, 0.300 INCH, PLASTIC, SOJ-26/20, Dynamic RAM | IC 4M X 1 FAST PAGE DRAM, 60 ns, PZIP20, 0.400 INCH, PLASTIC, ZIP-20, Dynamic RAM |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Toshiba(东芝) | Toshiba(东芝) | Toshiba(东芝) | Toshiba(东芝) |
| 零件包装代码 | DIP | SOJ | SOJ | ZIP |
| 包装说明 | DIP, | SOJ, | SOJ, | ZIP, |
| 针数 | 18 | 20 | 20 | 20 |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 |
| 访问模式 | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE |
| 最长访问时间 | 60 ns | 60 ns | 60 ns | 60 ns |
| 其他特性 | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY; CAS BEFORE RAS; HIDDEN; BATTERY BACKUP REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
| JESD-30 代码 | R-PDIP-T18 | R-PDSO-J20 | R-PDSO-J20 | R-PZIP-T20 |
| JESD-609代码 | e0 | e0 | e0 | e0 |
| 长度 | 22 mm | 17.15 mm | 17.15 mm | 25.8 mm |
| 内存密度 | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit |
| 内存集成电路类型 | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM |
| 内存宽度 | 1 | 1 | 1 | 1 |
| 功能数量 | 1 | 1 | 1 | 1 |
| 端口数量 | 1 | 1 | 1 | 1 |
| 端子数量 | 18 | 20 | 20 | 20 |
| 字数 | 4194304 words | 4194304 words | 4194304 words | 4194304 words |
| 字数代码 | 4000000 | 4000000 | 4000000 | 4000000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 4MX1 | 4MX1 | 4MX1 | 4MX1 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | SOJ | SOJ | ZIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 刷新周期 | 1024 | 1024 | 1024 | 1024 |
| 座面最大高度 | 4.4 mm | 3.75 mm | 3.75 mm | 10.16 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | YES | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | J BEND | J BEND | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | ZIG-ZAG |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 7.62 mm | 8.89 mm | 7.7 mm | - |
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