TC58CYG2S0HRAIG,TC58CYG2S0HRAIG pdf中文资料,TC58CYG2S0HRAIG引脚图,TC58CYG2S0HRAIG电路-Datasheet-电子工程世界

文档预览

TC58CYG2S0HxAIx

TOSHIBA

Serial Interface NAND

Technical Data Sheet

Rev. 1.1

2016 – 11 – 08

TOSHIBA

Storage & Electronic Devices Solutions

Memory Division

2016-11-08C

TC58CYG2S0HxAIx

CONTENTS

1.1.

1.2.

1.3.

2.1.

2.2.

2.3.

2.4.

2.5.

2.6.

3.1.

3.2.

3.3.

3.4.

3.5.

3.6.

3.7.

3.8.

3.9.

4.1.

4.2.

4.2.1.

4.2.2.

4.2.3.

4.2.4.

4.3.

4.4.

4.4.1.

4.4.2.

4.4.3.

4.5.

4.6.

4.7.

4.8.

4.9.

4.9.1.

4.9.2.

4.10.

4.11.

4.11.1.

4.12.

4.13.

4.14.

4.15.

4.16.

4.16.1.

4.16.2.

4.16.3.

4.16.4.

4.16.5.

5.1.

5.2.

6.1.

6.2.

Introduction .............................................................................................................................................. 4

General Description ................................................................................................................................. 4

Definitions and Abbreviations ................................................................................................................. 4

Features.................................................................................................................................................... 5

Memory Organization .............................................................................................................................. 6

Pin Descriptions ....................................................................................................................................... 6

Pin Assignment (Top View) ...................................................................................................................... 6

Block Diagram .......................................................................................................................................... 7

Cell Layout ............................................................................................................................................... 7

Addressing ................................................................................................................................................ 8

Valid Blocks .............................................................................................................................................. 8

Physical Interface..................................................................................................................................... 9

Absolute Maximum Rating ...................................................................................................................... 9

Capacitance .............................................................................................................................................. 9

Recommended DC Operating Conditions ............................................................................................... 9

Signal Timing ......................................................................................................................................... 10

AC Characteristics ................................................................................................................................. 12

DC Operating Characteristics ............................................................................................................... 12

Programming, Reading and Erasing Characteristics........................................................................... 13

Power ON/OFF Sequence ...................................................................................................................... 13

AC Test Condition .................................................................................................................................. 13

Command Description and Device Operation....................................................................................... 14

Command Set ......................................................................................................................................... 14

Page Read Operation ............................................................................................................................. 15

Read Cell Array (13h) ............................................................................................................................ 15

Read Buffer (03h or 0Bh) ....................................................................................................................... 16

Read Buffer x2 (3Bh).............................................................................................................................. 17

Read Buffer x4 (6Bh).............................................................................................................................. 18

Page Read Operation - High Speed Mode ............................................................................................. 18

Page Program Operation ....................................................................................................................... 19

Program Load (02h) ............................................................................................................................... 19

Program Execute (10h) .......................................................................................................................... 20

Program Load Random Data (84h) ....................................................................................................... 21

Internal Data Move Operation .............................................................................................................. 21

Block Erase (D8h) .................................................................................................................................. 22

Reset (FFh or FEh) ................................................................................................................................ 23

Write Enable (06h) / Write Disable (04h) .............................................................................................. 24

Set Feature (1Fh) / Get Feature (0Fh) .................................................................................................. 25

Set Feature (1Fh) ................................................................................................................................... 27

Get Feature (0Fh) .................................................................................................................................. 27

Block Lock Operation ............................................................................................................................. 28

Block Protection Operation (One Time Program)................................................................................. 28

Protect Execute (2Ah) ............................................................................................................................ 29

Parameter Page Read Operation........................................................................................................... 30

Read ID (9Fh) ......................................................................................................................................... 31

Unique ID Read Operation .................................................................................................................... 31

Bad Block Inhibit ................................................................................................................................... 31

Internal ECC .......................................................................................................................................... 32

ECC Switch ............................................................................................................................................ 32

ECC Status ............................................................................................................................................. 32

ECC Bit Flip Count Detection ............................................................................................................... 32

ECC Bit Flip Count Report.................................................................................................................... 33

ECC Maximum Bit Flip Count Report .................................................................................................. 34

Package Information .............................................................................................................................. 35

WSON8 (P-WSON8-0608-1.27-003) ...................................................................................................... 35

SOP16 (P-SOP16-1111-1.27-001) ........................................................................................................... 35

Application Notes ................................................................................................................................... 36

Prohibition of Unspecified Commands .................................................................................................. 36

Restriction of Commands while in the Busy State ............................................................................... 36

2016-11-08C

TC58CYG2S0HxAIx

6.3.

Addressing for Page Program Operation .............................................................................................. 36

6.4.

Several programming Cycles on the Same Page (Partial Page Program) ........................................... 36

6.5.

Power Off Timing ................................................................................................................................... 37

6.6.

Invalid Blocks ......................................................................................................................................... 37

6.7.

Failure Phenomena ................................................................................................................................ 38

6.8.

Reliability Guidance .............................................................................................................................. 39

Revision History ..................................................................................................................................... 40

RESTRICTIONS ON PRODUCT USE .................................................................................................................... 41

2016-11-08C

TC58CYG2S0HxAIx

LIST of FIGURES

Figure 1. WSON8 Pin Assignment (Top View) .......................................................................................................... 6

Figure 2. SOP16 Pin Assignment (Top View) ............................................................................................................ 6

Figure 3. Block Diagram ............................................................................................................................................ 7

Figure 4. Cell Layout .................................................................................................................................................. 7

Figure 5. Addressing................................................................................................................................................... 8

Figure 6. SPI Timing ................................................................................................................................................ 10

Figure 7. Serial Input Timing .................................................................................................................................. 10

Figure 8. Serial Output Timing ............................................................................................................................... 10

Figure 9. Hold Timing .............................................................................................................................................. 11

Figure 10. WP Timing (Example) ............................................................................................................................ 11

Figure 11. Power ON/OFF Sequence ....................................................................................................................... 13

Figure 12. Page Read from Cell Array to Buffer ..................................................................................................... 15

Figure 13. Page Read from Buffer Timing .............................................................................................................. 16

Figure 14. Page Read from Buffer x2 Timing.......................................................................................................... 17

Figure 15. Page Read from Buffer x4 Timing.......................................................................................................... 18

Figure 16. Program Load ......................................................................................................................................... 19

Figure 17. Program Execute Timing........................................................................................................................ 20

Figure 18. Program Load Random Data Timing..................................................................................................... 21

Figure 19. Block Erase Timing ................................................................................................................................ 22

Figure 20. Reset Timing ........................................................................................................................................... 23

Figure 21. Write Enable ........................................................................................................................................... 24

Figure 22. Write Disable Timing.............................................................................................................................. 24

Figure 23. Set Feature Timing ................................................................................................................................. 27

Figure 24. Get Feature Timing ................................................................................................................................ 27

Figure 25. Protect Execute Timing .......................................................................................................................... 29

Figure 26. Read ID Timing....................................................................................................................................... 31

LIST of TABLES

Table 1

Table 2

Table 3

Table 4

Table 5

Table 6

Table 7

Table 8

Table 9

Table 10

Table 11

Table 12

Table 13

Table 14

Table 15

Table 16

Table 17

Table 18

Table 19

Table 20

Table 21

Table 22

Table 23

Table 24

Table 25

Table 26

Table 27

Table 28

Pin Descriptions .......................................................................................................................................... 6

Valid Blocks ................................................................................................................................................. 8

Absolute Maximum Rating ......................................................................................................................... 9

Capacitance (T

OPR

= 25℃, f = 1MHz)......................................................................................................... 9

Recommended DC Operating Condition .................................................................................................... 9

AC Characteristics (T

OPR

= -40 to 85℃, VCC = 1.7 to 1.95V) ................................................................. 12

DC & Operating Characteristics (T

OPR

= -40 to 85℃, VCC = 1.7 to 1.95V) ........................................... 12

Programming, Reading and Erasing Characteristics (T

OPR

= -40 to 85℃, VCC = 1.7 to 1.95V)........... 13

Power on Timing ....................................................................................................................................... 13

AC Test Condition ................................................................................................................................... 13

Command Set .......................................................................................................................................... 14

Feature Table .......................................................................................................................................... 25

Feature Table - A0h Address Description .............................................................................................. 25

Feature Table - B0h Address Description .............................................................................................. 26

Feature Table - C0h Address Description .............................................................................................. 26

Block Lock Setting .................................................................................................................................. 28

Block Protection Setting ......................................................................................................................... 28

Block Number for Block Protection ........................................................................................................ 28

Parameter Page....................................................................................................................................... 30

ID Table ................................................................................................................................................... 31

Page Assignment ..................................................................................................................................... 32

Definition of 528 bytes Data Pair ........................................................................................................... 32

Bit Flip Count Detection Setting (BFD) ................................................................................................ 32

Bit Flip Count Detection Status (BFS) (Feature Table - 20h Address Description) ............................ 33

Bit Flip Count Report for Sector 0 (BFR) .............................................................................................. 33

Sector Definition (BFR) .......................................................................................................................... 34

Maximum Bit Flip Count (MBF) ............................................................................................................ 34

Maximum Bit Flip Count Sector (MFS) ................................................................................................. 34

2016-11-08C

TC58CYG2S0HxAIx

1. Introduction

1.1. General Description

The TC58CYG2S0HxAIx is a serial interface NAND Flash for embedded applications which supports the SPI

interface.

The TC58CYG2S0HxAIx is organized as (4096 + 128) bytes

64 pages

2048 blocks. The device has a 4224

byte data buffer which allows program and read data to be transferred between the buffer and the memory cell

array in 4224-byte increments. The Erase Operation is implemented in a single block unit (256 Kbytes + 8 Kbytes:

4224 bytes

64 pages). The device has the high speed mode for sequential Page Read Operation. When high

speed mode is enabled, the average of tR is shortened.

The TC58CYG2S0HxAIx has ECC logic on the chip and 8bit read errors for each (512 bytes + 16 bytes) can be

corrected. The internal ECC logic has detailed bit flip count report.

1.2. Definitions and Abbreviations

SPI

Serial Peripheral Interface.

Address

The address is comprised of a column address (CA) with 13bits and a row address (RA) with 17bits. The row

address identifies the page and block to be accessed. The column address identifies the byte within a page to access.

Column

The byte location within the page.

Row

Refer to the block and page to be accessed.

Sector

The 512 bytes unit in a page.

Page

The smallest addressable unit for the Read and the Program operations.

Block

Consists of multiple pages and is the smallest addressable unit for the Erase Operation.

Data Buffer

Buffer used to transfer data to and from the cell array.

Cell Array

Memory cell of NAND flash

Device

The packaged NAND unit.

2016-11-08C

型号	TC58CYG2S0HRAIG	TC58CYG2S0HQAIE
描述	NAND闪存 1.8V 4Gb 24nm Serial NAND	NAND闪存 4Gb 1.8V SLC NAND闪存 Serial
厂商名称	Toshiba(东芝)	Toshiba(东芝)
产品种类	NAND闪存	NAND闪存
系列	TC58CY	TC58CY
封装	Tray	Tray
存储类型	NAND	NAND
产品	NAND Flash	NAND Flash
工厂包装数量	480	168

{wanyeye}助人者天助，进来下: wanyeye：您好，我有个串口的问题想请教您，您能给我留个联系方式吗？或则您加我也...; yzb19860411 嵌入式系统

VSC8486数据手册和参考设计: 现在想做一个10GE的网络传输模块，想着采用VITESSE公司的VSC8486这款芯片，但这款芯片的...; jiajie270 模拟电子

元芳，你对此电路有何看法？（7-终结）: 元芳，你对此电路有何看法？（7-终结）元芳：大人，听说玉渊潭的樱花开的正好，不知...; okhxyyo 模拟与混合信号

网友正在移植mpy到 Nucleo-32: https://forum.micropython.org/viewtopic.php?t=5...; dcexpert MicroPython开源版块

谈谈FPGA工程师: 谈谈FPGA工程师最近发现好多熟悉用Altera或者Xilinx的工程师不大原意接受其他的FPGA...; 1ying FPGA/CPLD

求一个at89s52单片机的看门狗参考程序: 求一个at89s52的看门狗参考程序学习学习，百度上的多是stc的，希望能是简单一些的一个完整程序，...; wh8010jky 51单片机

一加手机体验店关闭内幕:投入产出不匹配

历时一年半，一加手机最终还是完全回归线上渠道。2016年08月20日，一加手机正式宣布，位于北京、上海两地的一加手机旗舰店（自营店）将正式关闭。这也是2015年11月以来，一加手机陆续关闭全国45家由OPPO代理的线下体验店后进一步撤离线下。此次两家最后的旗舰店关闭，也意味着一加手机在国内的线下自营渠道不复存在。位于北京、上海两地的一加手机旗舰店（自营店）将正式关闭　　今年以来，...[详细]
倪飞：努比亚正处于转型期 100%全面屏3-5年或将出现

新浪科技讯 10月12日晚间消息，努比亚今日在秋季发布会上发布旗下首款四摄产品Z17 miniS和首款全面屏产品Z17S。努比亚智能手机总经理倪飞在接受采访时表示，Z17S已经实现了全面屏的无边框，未来将会继续推出技术和体验上升级的全面屏产品。他预测，未来3-5年内将出现100%屏占比的真正全面屏产品。全面屏带来换机需求 3-5年出现100%全面屏努比亚首款全面屏产品Z17S售价29...[详细]
超360Wh/kg锂电池量产在即！前段设备“升阶”

数据显示，2023年中国锂电池出货量达886GWh，创历史新高;2024年一季度，出货量200GWh，同比增长18%，呈现出规模大、增长快之趋势。业界预计，2024年全年中国锂电池出货量有望逼近1TWh。　　电池中国观察到，动力锂电池领域，目前可量产的电芯能量密度最高超过360Wh/kg，在高能量密度电芯制造体系下，正负极浆料、电解液(质)都朝着高固含量的方向发展，随之往往需要升级原有产线设...[详细]
报告称中国智能网联汽车市场将有望领跑全球创新前沿

最新研究报告称，当前全球智能网联汽车行业正在蓬勃发展，预计智能网联汽车技术的年销售额将从2017年的472亿欧元上升至2022年的1400亿欧元。中国智能网联汽车市场将有望领跑全球创新前沿。普华永道25日发布的中国《2016年智能网联汽车消费者调查》显示，中国购买者非常渴望拥有自动驾驶汽车(超过85%)，这表明大多数消费者对于汽车科技的信任度很高，对于驾驶方...[详细]
Coeur CST 高电流连接系统

独一无二的浮动设计支持插针与插座间的无损伤接插 Molex 提供创新的 Coeur CST高电流互连系统，具有独特的新浮子设计，可调整不对齐的插针与插座之间的距离，方便PCB与PCB、PCB与母线棒，或母线棒与母线棒之间的接插，而在此过程中并无过度应力对插座造成损害。 Molex 全球产品经理Jeff Gaumer 表示： “当连接两个刚性PCB板或母线棒时，插针与插座很难完全...[详细]
OPPO要自研芯片？中国区总裁回应

近日，有媒体爆料，OPPO正在研发独立图像处理芯片（ISP）。早在2019年10月OPPO就成立了芯片技术委员会，还把芯片自研命名：“马里亚纳计划”，在2020年10月还申请了OPPO M1商标。此前有网友爆料，OPPO“马里亚纳计划”所产出的首个项目成果即将公开，但并非是最为期待的手机SOC芯片。可以说，结合这一系列曝光的信息，OPPO M1很可能就是自研ISP芯片的名称。 7月初，OP...[详细]
优派7系列投影机闪“亮”登场

全球视讯领导品牌美国优派（ViewSonic）公司正式推出光舰投影机的7系列新品PJD7325和PJD7525W，以高达4000流明的高亮度，为商用、中大型会议室用户、娱乐场所和商场等提供明亮清晰的全新视讯体验。长期以来，投影环境对于投影机所呈现的视讯效果至关重要。在明亮的环境中，惨白的投影画面令人不忍直视，于是，用户不得不在明亮通透的空间安装遮光窗帘，创造一个黑暗的环境，只为呈现出最佳...[详细]
奢华的Vertu手机命悬一线？个中原因值得深思

　　说到 Vertu 这个牌子，相信很多机友都知道这是奢侈手机品牌，一款机子售价以万元作为单位，数十万的机型更是不少。 Vertu 凭借着每一部都是英国纯手工打造，确保达到每部手机达到工艺标准、奢华的材料及真人Siri服务一直在高端手机市场占有一席之地。下面就随手机便携小编一起来了解一下相关内容吧。　　但近日据国外媒体报道，奢侈品牌智能手机制造商 Vertu 公司员工称，该公司从上周三...[详细]
三星控制全球三分之二DRAM市场，中国企业无法超越

前两天，三星电子发布公告显示，第一季度营收为60.56万亿韩元(约561亿美元)，同比增长19.8%;营业利润为15.64万亿韩元(约145亿美元)，同比增长58%。而值得关注的是，在这15.64万亿韩元的利润中，绝大部分来自于芯片业务，三星芯片业务第一季度实现营业利润11.6万亿韩元，达到手机业务的3倍。从这个角度来看，三星已经不是传统意义上人们认识中的智能手机厂商，而是一家标准的半导体...[详细]
一文看尽苹果WWDC 2018：史上最“软”发布会

　　5日凌晨，苹果 WWDC 2018大会在加利福尼亚圣何塞的McEnery会议中心如期召开。这场苹果开发者必备的朝圣之旅依然火爆，离开场还有半个多小时，就有不少已经买票但来晚的参会人员无法进入了。下面就随手机便携小编一起来了解一下相关内容吧。　　蒂姆·库克身着与以往相同的休闲套装，再次站到了聚光灯下。虽然期待的硬件没出现让人有些失望，但还是诚意满满的为大家带来了四大平台——iO...[详细]
我国3C电子工业机器人的成熟还在艰苦卓绝的努力

从市场规模上来看，3C产业是仅次于汽车产业的大市场，我国是3C制造业大国，全球大约70%以上的产品均由中国进行制造和装配，3C产业的工业机器人可以有力的降低人力成本、提高工作效率、并降低成本。根据相关调研显示，在后端的组装、、环节，目前综合水平不到15%，自动化率还有很大的提升空间，且未来几年将成为各大企业重点关注的领域。长尾市场中，本体和集成商融合组成“本体集成商” 中国有汽...[详细]
Texas Instruments LMX2594 宽带PLLatinum RF合成器在贸泽开售轻松同

专注于新产品引入 (NPI) 并提供极丰富产品类型的业界顶级半导体和电子元器件分销商贸泽电子(Mouser Electronics) 即日起供应Texas Instruments (TI)的LMX2594宽带PLLatinum™ 射频(RF) 合成器。LMX2594属于TI的PLLatinum系列，可以轻松同步所有板载PLL的输出，为多输入/多输出(MIMO)、波束成形和其他应用节约设计时间。 ...[详细]
D/A转换器与单片机接口电路图

D/A转换器与单片机接口电路图（单缓冲工作方式）适用于只有一路模拟量输出，或有几路模拟量输出但并不要求同步的系统,电路中芯片有 DAC0832 ...[详细]
数字万用表查看二极管的确诊办法

用数字万用表的二极管挡位丈量二极管。测二极管时，运用万用表的二极管的挡位。若将红表笔接二极管阳（正）极，黑表笔接二极管阴（负）极，则二极管处于正偏，万用表有必定数值闪现。若将红表笔接二极管阴极，黑表笔接二极管阳极，二极管处于反偏，万用表高位闪现为“1”或很大的数值，此刻阐明二极管是好的。在丈量时若两次的数值均很小，挨近于零，阐明二极管内部短路；若正反两次测得的数值均很大或高位均为“1”，则阐明二...[详细]
三相变频器接220v能不能调试

三相变频器是一种将交流电转换为可变频率的交流电的电力电子设备，广泛应用于工业自动化、电机驱动等领域。在实际应用中，三相变频器的输入电压通常为380V或220V。本文将详细介绍三相变频器接220V的调试方法和注意事项。一、三相变频器的基本原理 1.1 三相交流电的概念三相交流电是由三个频率相同、相位互差120度的正弦波组成的交流电。三相交流电具有功率密度高、传输效率高、稳定性好等优点，广泛...[详细]