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TDA1308T/N2/N,115

0.04 W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO8
0.04 W, 2 通道, 音频放大器, PDSO8

器件类别：模拟混合信号IC    消费电路   

厂商名称：NXP(恩智浦)

厂商官网：https://www.nxp.com

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参数 预览 参数对比
器件参数
参数名称
属性值
Source Url Status Check Date
2013-06-14 00:00:00
Brand Name
NXP Semiconduc
是否Rohs认证
不符合
厂商名称
NXP(恩智浦)
零件包装代码
SOIC
包装说明
3.90 MM, PLASTIC, MS-012, SOT-96-1, SOP-8
针数
8
制造商包装代码
SOT96-1
Reach Compliance Code
unknow
其他特性
IT CAN ALSO OPERATE WITH SINGLE 3V TO 7V SUPPLY
标称带宽
20 kHz
商用集成电路类型
AUDIO AMPLIFIER
谐波失真
0.3%
JESD-30 代码
R-PDSO-G8
长度
4.9 mm
信道数量
2
功能数量
1
端子数量
8
最高工作温度
85 °C
最低工作温度
-40 °C
标称输出功率
0.04 W
封装主体材料
PLASTIC/EPOXY
封装代码
SOP
封装等效代码
SOP8,.25
封装形状
RECTANGULAR
封装形式
SMALL OUTLINE
电源
5 V
认证状态
Not Qualified
座面最大高度
1.75 mm
最大压摆率
5 mA
最大供电电压 (Vsup)
3.5 V
最小供电电压 (Vsup)
1.5 V
表面贴装
YES
技术
CMOS
温度等级
INDUSTRIAL
端子形式
GULL WING
端子节距
1.27 mm
端子位置
DUAL
宽度
3.9 mm
文档预览
TDA1308; TDA1308A
Class-AB stereo headphone driver
Rev. 04 — 25 January 2007
Product data sheet
1. General description
The TDA1308; TDA1308A is an integrated class-AB stereo headphone driver contained in
an SO8, DIP8 or a TSSOP8 plastic package. The TDA1308AUK is available in an 8 bump
wafer level chip-size package (WLCSP8). The device is fabricated in a 1
µm
Complementary Metal Oxide Semiconductor (CMOS) process and has been primarily
developed for portable digital audio applications.
The difference between the TDA1308 and the TDA1308A is that the TDA1308A can be
used at low supply voltages.
2. Features
I
I
I
I
I
I
Wide temperature range
No switch ON/OFF clicks
Excellent power supply ripple rejection
Low power consumption
Short-circuit resistant
High performance
N
High signal-to-noise ratio
N
High slew rate
N
Low distortion
I
Large output voltage swing
3. Quick reference data
Table 1.
Quick reference data
V
DD
= 5 V; V
SS
= 0 V; T
amb
= 25
°
C; f
i
= 1 kHz; R
L
= 32
Ω
; unless otherwise specified.
Symbol
V
DD
Parameter
supply voltage
Conditions
TDA1308
single supply
dual supply
TDA1308A
single supply
dual supply
V
SS
I
DD
negative supply
voltage
supply current
TDA1308; dual supply
TDA1308A; dual supply
no load
2.4
1.2
−1.5
−1.2
-
5.0
2.5
−2.5
−2.5
3
7.0
3.5
−3.5
−3.5
5
V
V
V
V
mA
3.0
1.5
5.0
2.5
7.0
3.5
V
V
Min
Typ
Max
Unit
NXP Semiconductors
TDA1308; TDA1308A
Class-AB stereo headphone driver
Table 1.
Quick reference data
…continued
V
DD
= 5 V; V
SS
= 0 V; T
amb
= 25
°
C; f
i
= 1 kHz; R
L
= 32
Ω
; unless otherwise specified.
Symbol
P
tot
P
o
(THD + N)/S
Parameter
total power
dissipation
maximum output
power
total harmonic
distortion plus
noise-to-signal
ratio
Conditions
no load
(THD + N)/S < 0.1 %
[1]
Min
-
-
-
-
-
-
-
100
-
Typ
15
40
0.03
−70
−92
−52
−101
110
70
105
90
-
Max
25
80
0.06
−65
−89
−40
-
-
-
-
-
+85
Unit
mW
mW
%
dB
dB
dB
dB
dB
dB
dB
dB
°C
[1]
[1]
R
L
= 5 kΩ
R
L
= 5 kΩ
R
L
= 5 kΩ
[2]
[3]
S/N
α
cs
PSRR
T
amb
signal-to-noise
ratio
channel
separation
power supply
ripple rejection
ambient
temperature
R
L
= 5 kΩ
f
i
= 100 Hz;
V
ripple(p-p)
= 100 mV
[1]
-
-
−40
[1]
[2]
[3]
V
DD
= 5 V; V
O(p-p)
= 3.5 V (at 0 dB).
V
DD
= 2.4 V; V
O(p-p)
= 1.62 V (at
−4.8
dBV); for TDA1308A only.
V
DD
= 2.4 V; V
O(p-p)
= 1.19 V (at
−7.96
dBV); for TDA1308A only.
4. Ordering information
Table 2.
Ordering information
Package
Name
TDA1308
TDA1308T
TDA1308AT
TDA1308AUK
TDA1308TT
DIP8
SO8
SO8
WLCSP8
TSSOP8
Description
plastic dual in-line package; 8 leads (300 mil)
plastic small outline package; 8 leads; body width
3.9 mm
plastic small outline package; 8 leads; body width
3.9 mm
wafer level chip-size package; 8 bumps;
0.61
×
0.84
×
0.38 mm
plastic thin shrink small outline package; 8 leads;
body width 3 mm
Version
SOT97-1
SOT96-1
SOT96-1
TDA1308AUK
SOT505-1
Type number
TDA1308_A_4
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 04 — 25 January 2007
2 of 19
NXP Semiconductors
TDA1308; TDA1308A
Class-AB stereo headphone driver
5. Block diagram
OUTA
INA(neg)
INA(pos)
1
2
3
TDA1308(A)
8
V
DD
7
6
5
OUTB
INB(neg)
INB(pos)
V
SS
4
mka779
Fig 1. Block diagram
6. Pinning information
6.1 Pinning
bump A1
index area
1
A
TDA1308AUK
2
3
B
TDA1308(A)
OUTA
INA(neg)
INA(pos)
V
SS
1
2
3
4
001aaf782
C
8
7
6
5
V
DD
OUTB
INB(neg)
INB(pos)
D
E
001aaf800
Transparent top view
Fig 2. Pin configuration TDA1308(A)
Fig 3. Pin configuration TDA1308AUK
6.2 Pin description
Table 3.
Symbol
OUTA
INA(neg)
INA(pos)
V
SS
INB(pos)
Pin description TDA1308(A)
Pin
1
2
3
4
5
Description
output A
inverting input A
non-inverting input A
negative supply
non-inverting input B
TDA1308_A_4
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 04 — 25 January 2007
3 of 19
NXP Semiconductors
TDA1308; TDA1308A
Class-AB stereo headphone driver
Pin description TDA1308(A)
…continued
Pin
6
7
8
Description
inverting input B
output B
positive supply
Table 3.
Symbol
INB(neg)
OUTB
V
DD
Table 4.
Symbol
OUTA
V
SS
INA(pos)
OUTB
INA(neg)
INB(neg)
V
DD
INB(pos)
Pin description TDA1308AUK
Pin
A1
A3
B2
C1
C3
D2
E1
E3
Description
output A
negative supply
non-inverting input A
output B
inverting input A
inverting input B
positive supply
non-inverting input B
7. Internal circuitry
V
DD
I
1
INA/B(pos)
M1
M2
A1
M3
INA/B(neg)
OUTA/B
Cm
M4
D1
D2
D3
D4
M5
A2
M6
V
SS
mka781
Fig 4. Equivalent schematic diagram
TDA1308_A_4
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 04 — 25 January 2007
4 of 19
NXP Semiconductors
TDA1308; TDA1308A
Class-AB stereo headphone driver
8. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
V
DD
t
SC(O)
T
stg
T
amb
V
esd
supply voltage
output short-circuit duration T
amb
= 25
°C;
P
tot
= 1 W
storage temperature
ambient temperature
electrostatic discharge
voltage
HBM
MM
[1]
[2]
Conditions
Min
0
20
−65
−40
−2
−200
Max
8.0
-
+150
+85
+2
+200
Unit
V
s
°C
°C
kV
V
[1]
[2]
Human body model (HBM): C = 100 pF; R = 1500
Ω;
3 pulses positive plus 3 pulses negative.
Machine model (MM): C = 200 pF; L = 0.5 mH; R = 0
Ω;
3 pulses positive plus 3 pulses negative.
9. Thermal characteristics
Table 6.
Symbol
R
th(j-a)
Thermal characteristics
Parameter
thermal resistance from junction
to ambient
DIP8
SO8
TSSOP8
WLCSP8
109
210
220
1000
K/W
K/W
K/W
K/W
Conditions
Typ
Unit
TDA1308_A_4
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 04 — 25 January 2007
5 of 19
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参数对比
与TDA1308T/N2/N,115相近的元器件有：TDA1308T/N2/N,112、TDA1308T/N2/G,115、TDA1308T/N2/G,112、TDA1308T/N1/N,115、TDA1308T/N1,115、TDA1308T、TDA1308A、TDA1308TT。描述及对比如下：
型号 TDA1308T/N2/N,115 TDA1308T/N2/N,112 TDA1308T/N2/G,115 TDA1308T/N2/G,112 TDA1308T/N1/N,115 TDA1308T/N1,115 TDA1308T TDA1308A TDA1308TT
描述 0.04 W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO8 0.04 W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO8 0.04 W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO8 0.04 W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO8 0.04 W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO8 0.04 W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO8 Class AB stereo headphone driver Class AB stereo headphone driver Class AB stereo headphone driver
Source Url Status Check Date 2013-06-14 00:00:00 2013-06-14 00:00:00 2013-06-14 00:00:00 2013-06-14 00:00:00 2013-06-14 00:00:00 2013-06-14 00:00:00 - - -
Brand Name NXP Semiconduc NXP Semiconduc NXP Semiconduc NXP Semiconduc NXP Semiconduc NXP Semiconduc - - -
是否Rohs认证 不符合 不符合 符合 符合 不符合 - 符合 - 符合
厂商名称 NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) NXP(恩智浦) - - - NXP(恩智浦)
零件包装代码 SOIC SOIC SOIC SOIC SOIC SOIC SOIC - SOIC
包装说明 3.90 MM, PLASTIC, MS-012, SOT-96-1, SOP-8 3.90 MM, PLASTIC, MS-012, SOT-96-1, SOP-8 3.90 MM, PLASTIC, MS-012, SOT-96-1, SOP-8 3.90 MM, PLASTIC, MS-012, SOT-96-1, SOP-8 3.90 MM, PLASTIC, MS-012, SOT-96-1, SOP-8 PLASTIC, SO-8 SOP, SOP8,.25 - TSSOP, TSSOP8,.19
针数 8 8 8 8 8 8 8 - 8
制造商包装代码 SOT96-1 SOT96-1 SOT96-1 SOT96-1 SOT96-1 SOT96-1 - - -
Reach Compliance Code unknow unknow unknow unknow unknow unknow compli - compli
其他特性 IT CAN ALSO OPERATE WITH SINGLE 3V TO 7V SUPPLY IT CAN ALSO OPERATE WITH SINGLE 3V TO 7V SUPPLY IT CAN ALSO OPERATE WITH SINGLE 3V TO 7V SUPPLY IT CAN ALSO OPERATE WITH SINGLE 3V TO 7V SUPPLY IT CAN ALSO OPERATE WITH SINGLE 3V TO 7V SUPPLY - IT CAN ALSO OPERATE WITH SINGLE 3V TO 7V SUPPLY - IT CAN ALSO OPERATE WITH SINGLE 3V TO 7V SUPPLY
标称带宽 20 kHz 20 kHz 20 kHz 20 kHz 20 kHz - 20 kHz - 20 kHz
商用集成电路类型 AUDIO AMPLIFIER AUDIO AMPLIFIER AUDIO AMPLIFIER AUDIO AMPLIFIER AUDIO AMPLIFIER AUDIO AMPLIFIER AUDIO AMPLIFIER - AUDIO AMPLIFIER
谐波失真 0.3% 0.3% 0.3% 0.3% 0.3% - 0.3% - -
JESD-30 代码 R-PDSO-G8 R-PDSO-G8 R-PDSO-G8 R-PDSO-G8 R-PDSO-G8 R-PDSO-G8 R-PDSO-G8 - S-PDSO-G8
长度 4.9 mm 4.9 mm 4.9 mm 4.9 mm 4.9 mm 4.9 mm 4.9 mm - 3 mm
信道数量 2 2 2 2 2 2 2 - 2
功能数量 1 1 1 1 1 - 1 - 1
端子数量 8 8 8 8 8 8 8 - 8
最高工作温度 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C - 85 °C
最低工作温度 -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C - -40 °C
标称输出功率 0.04 W 0.04 W 0.04 W 0.04 W 0.04 W 0.06 W 0.04 W - 0.04 W
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY
封装代码 SOP SOP SOP SOP SOP SOP SOP - TSSOP
封装等效代码 SOP8,.25 SOP8,.25 SOP8,.25 SOP8,.25 SOP8,.25 SOP8,.25 SOP8,.25 - TSSOP8,.19
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR - SQUARE
封装形式 SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE - SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
电源 5 V 5 V 5 V 5 V 5 V 5 V +-2.5/5 V - +-2.5/5 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified - Not Qualified
座面最大高度 1.75 mm 1.75 mm 1.75 mm 1.75 mm 1.75 mm 1.75 mm 1.75 mm - 1.1 mm
最大压摆率 5 mA 5 mA 5 mA 5 mA 5 mA 5 mA 5 mA - 5 mA
最大供电电压 (Vsup) 3.5 V 3.5 V 3.5 V 3.5 V 3.5 V 3.5 V 3.5 V - 3.5 V
最小供电电压 (Vsup) 1.5 V 1.5 V 1.5 V 1.5 V 1.5 V 1.5 V 1.5 V - 1.5 V
表面贴装 YES YES YES YES YES YES YES - YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS - CMOS
温度等级 INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL - INDUSTRIAL
端子形式 GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING - GULL WING
端子节距 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm - 0.65 mm
端子位置 DUAL DUAL DUAL DUAL DUAL DUAL DUAL - DUAL
宽度 3.9 mm 3.9 mm 3.9 mm 3.9 mm 3.9 mm 3.9 mm 3.9 mm - 3 mm
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