首页 > 器件类别 > 热门应用 > 无线/射频/通信

TDA18250HN-C1518

Tuners CABLE SILICON TUNER

器件类别:热门应用    无线/射频/通信   

厂商名称:NXP(恩智浦)

厂商官网:https://www.nxp.com

下载文档
TDA18250HN-C1518 在线购买

供应商:

器件:TDA18250HN-C1518

价格:-

最低购买:-

库存:点击查看

点击购买

器件参数
参数名称
属性值
产品种类
Product Category
Tuners
制造商
Manufacturer
NXP(恩智浦)
RoHS
Details
系列
Packaging
Reel
工厂包装数量
Factory Pack Quantity
4000
单位重量
Unit Weight
0.004780 oz
文档预览
TDA18250AHN
Cable silicon tuner
Rev. 1 — 10 July 2013
Product short data sheet
1. General description
The TDA18250A is a silicon tuner designed specifically for worldwide cable and terrestrial
digital Set Top Boxes (STB).
The TDA18250A ensures a low system cost by saving external components such as:
Low-Noise Amplifiers
Surface Acoustic Wave (SAW) filters
RF splitter
Moreover, thanks to its 8 kV ESD capability, EIA/JESD22-A114 (HBM), on the RF
input pin and the loop-through pin, the application level ESD protection can be
reduced.
The TDA18250A silicon tuner meets current and future digital cable and terrestrial TV
reception with:
Low-power consumption
High linearity
Very low noise figure (3.8 dB typical)
High immunity to wireless interferers (WLAN, LTE and GSM)
The TDA18250A ensures ease of use with:
Easy on-board integration
Efficient and effective PCB design
Reduced external components
Integrated Zero Power Loop-Through (ZPLT)
2. Features and benefits
Single 3.3 V supply voltage
RF frequency coverage up to 1 GHz
Flexible low IF output from 3 MHz to 7.5 MHz to ease the matching with various
demodulators
RoHS compliant
I
2
C-bus interface compatible with 3.3 V microcontrollers
Strong Immunity to wireless interferers (WLAN, GSM, LTE)
Multi-reference clock frequency compliant:16 MHz, 24 MHz, 25 MHz, 27 MHz and
30 MHz
Crystal oscillator output buffer to drive demodulator, SoC or slave tuner
Slave Tuner Output (STO), integrated splitter for dual tuner applications
NXP Semiconductors
TDA18250AHN
Cable silicon tuner
Fully integrated oscillators
LT output, both in active and Zero Power Loop-Through mode (ZPLT)
Fully integrated IF and RF selectivity; eliminating the need for external SAW filters
Single-ended RF input (no need for external balun)
Enhanced ESD protection (8 kV HBM) on RF_IN and ZPLT pins
Alignment free
Excellent return loss compatible with cable requirements
Integrated RSSI function, readable through I
2
C-bus
Integrated temperature sensor
Integrated gain control
3. Quick reference data
Table 1.
Symbol
f
RF
NF
tun
Quick reference data
Parameter
RF frequency
tuner noise figure
Conditions
RF input frequency
range
75
;
maximum gain
f
RF
< 862 MHz
f
RF
862 MHz
jit
image
P
i(max)
P
phase jitter
image rejection
maximum input
power
power dissipation
integrated from 250 Hz
to 4 MHz
IF = 5 MHz, RF (image)
level
60 dBV
single channel
-
-
-
-
115
-
3.8
4.5
0.4
62
-
0.740
-
-
0.6
-
-
-
dB
dB
Degree
dB
dBV
W
Min
42
Typ
-
Max
1002
Unit
MHz
4. Ordering information
Table 2.
Ordering information
Package
Name
Description
Version
Type number
TDA18250AHN/C1 HVQFN32 plastic thermal enhanced very thin quad flat package; SOT617-3
no leads; 32 terminals; body 5
5
0.85 mm
TDA18250AHN_SDS
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product short data sheet
Rev. 1 — 10 July 2013
2 of 8
NXP Semiconductors
TDA18250AHN
Cable silicon tuner
5. Block diagram
8 kV
ESD
AGC1
AGC2
RF
selectivity
mixer
IF
selectivity
IF
AGC
23
24
RF_IN
2
IFO_P
IFO_N
VIFAGC
ZPLT
LEVEL
CONTROL
LEVEL
CONTROL
26
ZPLT
3
8 kV
ESD
STO
GPO1
4
31
15
GPO2
25
I
2
C-BUS
INTERFACE
SYNTHESIZER
CRYSTAL OSCILLATOR
16 - 30 MHz
BUFFER
14
TDA18250AHN
XTO_P
XTO_N
16
AS
21
SCL
20
SDA
13
XTAL_P
12
aaa-003342
XTAL_N
Fig 1.
Block diagram
6. Limiting values
Table 3.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
V
CC
V
I
V
ESD
supply voltage
input voltage
electrostatic discharge
voltage
V
CC
< 3.3 V
V
CC
> 3.3 V
EIA/JESD22-A114 (HBM)
EIA/JESD22-A114 (HBM);
pins RF_IN and ZPLT
EIA/JESD22-C101-C (FCDM)
[1]
It withstands class IV of JEDEC standard.
[1]
Conditions
Min
0.3
0.3
0.3
2
8
1
Max
+3.60
+3.6
-
-
-
Unit
V
V
kV
kV
kV
V
CC
+ 0.3 V
TDA18250AHN_SDS
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product short data sheet
Rev. 1 — 10 July 2013
3 of 8
NXP Semiconductors
TDA18250AHN
Cable silicon tuner
7. Abbreviations
Table 4.
Acronym
AGC
ESD
FCDM
GPO
HBM
IC
IF
JEDEC
LT
LTE
PCB
RF
RoHS
RSSI
SAW
SCL
SDA
SoC
STB
STO
WLAN
Xtal
ZPLT
Abbreviations
Description
Automatic Gain Control
ElectroStatic Discharge
Field Charge Device Model
General Purpose Outputs
Human Body Model
Integrated Circuit
Intermediate Frequency
Joint Electron Device Engineering Council
Loop-Through
Long-Term Evolution
Printed-Circuit Board
Radio Frequency
Restriction of Hazardous Substances
Received Signal Strength Indicator
Surface Acoustic Wave
Serial CLock
Serial DAta
System on Chip
Set Top Box
Slave Tuner Output
Wireless Local Area Network
Crystal
Zero Power Loop-Trough
8. Revision history
Table 5.
Revision history
Release date
20130710
Data sheet status
Product short data sheet
Change notice
-
Supersedes
-
Document ID
TDA18250AHN_SDS v.1
TDA18250AHN_SDS
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product short data sheet
Rev. 1 — 10 July 2013
4 of 8
NXP Semiconductors
TDA18250AHN
Cable silicon tuner
9. Legal information
9.1
Data sheet status
Product status
[3]
Development
Qualification
Production
Definition
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Document status
[1][2]
Objective [short] data sheet
Preliminary [short] data sheet
Product [short] data sheet
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL
http://www.nxp.com.
9.2
Definitions
Draft —
The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet —
A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification —
The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
Suitability for use —
NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications —
Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values —
Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale —
NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at
http://www.nxp.com/profile/terms,
unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license —
Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
© NXP B.V. 2013. All rights reserved.
9.3
Disclaimers
Limited warranty and liability —
Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the
Terms and conditions of commercial sale
of NXP Semiconductors.
Right to make changes —
NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
TDA18250AHN_SDS
All information provided in this document is subject to legal disclaimers.
Product short data sheet
Rev. 1 — 10 July 2013
5 of 8
查看更多>
热门器件
热门资源推荐
器件捷径:
00 01 02 03 04 05 06 07 08 09 0A 0C 0F 0J 0L 0M 0R 0S 0T 0Z 10 11 12 13 14 15 16 17 18 19 1A 1B 1C 1D 1E 1F 1H 1K 1M 1N 1P 1S 1T 1V 1X 1Z 20 21 22 23 24 25 26 27 28 29 2A 2B 2C 2D 2E 2F 2G 2K 2M 2N 2P 2Q 2R 2S 2T 2W 2Z 30 31 32 33 34 35 36 37 38 39 3A 3B 3C 3D 3E 3F 3G 3H 3J 3K 3L 3M 3N 3P 3R 3S 3T 3V 40 41 42 43 44 45 46 47 48 49 4A 4B 4C 4D 4M 4N 4P 4S 4T 50 51 52 53 54 55 56 57 58 59 5A 5B 5C 5E 5G 5H 5K 5M 5N 5P 5S 5T 5V 60 61 62 63 64 65 66 67 68 69 6A 6C 6E 6F 6M 6N 6P 6R 6S 6T 70 71 72 73 74 75 76 77 78 79 7A 7B 7C 7M 7N 7P 7Q 7V 7W 7X 80 81 82 83 84 85 86 87 88 89 8A 8D 8E 8L 8N 8P 8S 8T 8W 8Y 8Z 90 91 92 93 94 95 96 97 98 99 9A 9B 9C 9D 9F 9G 9H 9L 9S 9T 9W
需要登录后才可以下载。
登录取消