TDA9910
12-bit, up to 80 Msample/s, Analog-to-Digital Converter (ADC)
direct/ultra high IF sampling
Rev. 04 — 12 June 2007
Product data sheet
1. General description
The TDA9910 is a 12-bit Analog-to-Digital Converter (ADC) optimized for direct Input
Frequency (IF) sampling, and supporting the most demanding use conditions in ultra high
IF radio transceivers for cellular infrastructure and other applications such as wireless
access system, optical networking and fixed telecommunication. Thanks to its broadband
input capabilities, the TDA9910 is ideal for single and multiple carriers data conversion.
Operating at a maximum sampling rate of 80 Msample/s, analog input signals are
converted into 12-bit binary coded digital words. All static digital inputs are CMOS
compatible. All output signals are LVCMOS compatible. The TDA9910 offers the most
possible flexible acquisition control system thanks to its programmable Complete
Conversion Signal (CCS) that allows to adjust the delay of the acquisition clock.
Thanks to its internal front-end buffer, the TDA9910 offers the lowest input capacitance
(< 1 pF) and therefore the highest flexibility in front-end aliasing filter strategy.
2. Features
I
12-bit resolution
I
90 dB SFDR; 71 dB SNR (f
i
= 225 MHz;
f
CLK
= 80 Msample/s; B = 5 MHz)
I
High-speed sampling rate up to 80 Msample/s
I
Programmable acquisition output clock (complete
conversion signal)
I
Single 5 V power supply
I
Binary or two’s-complement LVCMOS outputs
I
Only 2 clock cycles latency
I
HTQFP48 package
I
Differential input with 375 MHz bandwidth
I
70 dB SFDR; 66.5 dB SNR (f
i
= 175 MHz;
f
CLK
= 80 Msample/s; B = Nyquist)
I
Internal front-end buffer (input capacitance <1 pF)
I
Full-scale controllable from 1.5 V to 2 V (p-p);
continuous scale
I
3.3 V LVCMOS compatible digital outputs
I
CMOS compatible static digital inputs
I
Industrial temperature range from
−40 °C
to +85
°C
3. Applications
I
I
I
I
I
2.5G and 3G cellular base infrastructure radio transceivers
Wireless access systems
Fixed telecommunication
Optical networking
Wireless Local Area Network (WLAN) infrastructure
NXP Semiconductors
TDA9910
12-bit, up to 80 Msample/s, Analog-to-Digital Converter (ADC)
4. Ordering information
Table 1.
Ordering information
Sampling frequency
(Msample/s)
80
Package
Name
HTQFP48
Description
plastic thermal enhanced thin quad flat package;
48 leads; body 7
×
7
×
1 mm; exposed die pad
Version
SOT545-2
Type number
TDA9910HW/8/C1
5. Block diagram
CLK
CLKN
TDA9910
CLOCK DRIVER
2
DEL0 to
DEL1
CCS
12
LATCH
12
D0 to D11
OTC
front-end
buffer
IN
INN
TRACK
AND
HOLD
RESISTOR
LADDERS
ADC
CORE
U/I
FSIN
V
CCO
LATCH
IR
FSOUT
VREF
REFERENCE
CMADC
REFERENCE
OUTPUTS
ENABLE
001aaa511
CMADC
DEC
CE_N
Fig 1. Block diagram
TDA9910_4
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 04 — 12 June 2007
2 of 21
NXP Semiconductors
TDA9910
12-bit, up to 80 Msample/s, Analog-to-Digital Converter (ADC)
6. Pinning information
6.1 Pinning
41 V
CCD1(5V0)
47 V
CCA1(5V0)
45 V
CCA1(5V0)
44 V
CCA2(5V0)
42 DGND1
38 DGND1
48 AGND1
46 AGND1
43 AGND2
39 CLKN
n.c.
AGND1
IN
CMADC
INN
AGND1
DEC
n.c.
FSOUT
37 CCS
36 D0
35 D1
34 D2
33 D3
32 D4
31 D5
30 D6
29 D7
28 D8
27 D9
26 D10
25 D11
IR 24
001aaa512
1
2
3
4
5
6
7
8
9
DGND
TDA9910HW
FSIN 10
n.c. 11
n.c. 12
n.c. 13
DEL1 14
DEL0 15
V
CCD2(5V0)
16
DGND2 17
CE_N 18
OTC 19
OGND 20
V
CCO(3V3)
21
40 CLK
OGND 22
Fig 2. Pin configuration
6.2 Pin description
Table 2.
Symbol
n.c.
AGND1
IN
CMADC
INN
AGND1
DEC
n.c.
FSOUT
FSIN
n.c.
n.c.
n.c.
DEL1
TDA9910_4
Pin description
Pin
1
2
3
4
5
6
7
8
9
10
11
12
13
14
Type
[1]
-
G
I
O
I
G
I/O
-
O
I
-
-
-
I
Description
not connected
analog ground 1
analog input voltage
regulator common mode ADC output
complementary analog input voltage
analog ground 1
decoupling node
not connected
full-scale reference voltage output
full-scale reference voltage input
not connected
not connected
not connected
complete conversion signal delay input 1
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 04 — 12 June 2007
V
CCO(3V3)
23
3 of 21
NXP Semiconductors
TDA9910
12-bit, up to 80 Msample/s, Analog-to-Digital Converter (ADC)
Pin description
…continued
Pin
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
Type
[1]
I
P
G
I
I
G
P
G
P
O
O
O
O
O
O
O
O
O
O
O
O
O
O
G
I
I
P
G
G
P
P
G
P
G
Description
complete conversion signal delay input 0
digital supply voltage 2 (5.0 V)
digital ground 2
chip enable input (CMOS level; active LOW)
control input for two’s complement output (active HIGH)
data output ground
data output supply voltage (3.3 V)
data output ground
data output supply voltage (3.3 V)
in-range output
data output bit 11 (MSB)
data output bit 10
data output bit 9
data output bit 8
data output bit 7
data output bit 6
data output bit 5
data output bit 4
data output bit 3
data output bit 2
data output bit 1
data output bit 0 (LSB)
complete conversion signal output
digital ground 1
complementary clock input
clock input
digital supply voltage 1 (5.0 V)
digital ground 1
analog ground 2
analog supply voltage 2 (5.0 V)
analog supply voltage 1 (5.0 V)
analog ground 1
analog supply voltage 1 (5.0 V)
analog ground 1
digital ground
Table 2.
Symbol
DEL0
V
CCD2(5V0)
DGND2
CE_N
OTC
OGND
V
CCO(3V3)
OGND
V
CCO(3V3)
IR
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
CCS
DGND1
CLKN
CLK
V
CCD1(5V0)
DGND1
AGND2
V
CCA2(5V0)
V
CCA1(5V0)
AGND1
V
CCA1(5V0)
AGND1
DGND
exposed G
die pad
[1]
P: power supply; G: ground; I: input; O: output.
TDA9910_4
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 04 — 12 June 2007
4 of 21
NXP Semiconductors
TDA9910
12-bit, up to 80 Msample/s, Analog-to-Digital Converter (ADC)
7. Limiting values
Table 3.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
V
CCA
V
CCD
V
CCO
∆V
CC
Parameter
analog supply voltage
digital supply voltage
output supply voltage
supply voltage difference
V
CCA
−
V
CCD
V
CCD
−
V
CCO
V
CCA
−
V
CCO
V
i(IN)
, V
i(INN)
input voltage
V
CLK
, V
CLKN
input voltage for differential
clock drive
I
O
T
stg
T
amb
T
j
[1]
[2]
Conditions
[1]
[1]
[2]
Min
−0.5
−0.5
−0.5
−1.0
−1.0
−1.0
Max
+7.0
+7.0
+5.0
+1.0
+4.0
+4.0
V
CCA
+ 1
V
CCD
+ 1
10
+150
+85
150
Unit
V
V
V
V
V
V
V
V
mA
°C
°C
°C
referenced to AGND
referenced to DGND
0
0
-
−55
−40
-
output current
storage temperature
ambient temperature
junction temperature
The supply voltages V
CCA
and V
CCD
may have any value between
−0.5
V and +7.0 V provided that the
supply voltage differences
∆V
CC
are respected.
The supply voltage V
CCO
may have any value between
−0.5
V and +5.0 V provided that the supply voltage
differences
∆V
CC
are respected.
8. Thermal characteristics
Table 4.
Symbol
R
th(j-a)
R
th(j-c)
[1]
Thermal characteristics
Parameter
thermal resistance from junction to ambient
thermal resistance from junction to case
Conditions
[1]
[1]
Typ
36.2
14.3
Unit
K/W
K/W
In compliance with JEDEC test board, in free air.
TDA9910_4
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 04 — 12 June 2007
5 of 21
