ADC Subsystem, 4-Bit, 1 Func, Parallel, 4 Bits Access, Bipolar, PDIP16,
厂商名称:Raytheon Company
厂商官网:https://www.raytheon.com/
下载文档型号 | TDC1044N9C | TDC1044B9V | TDC1044B9C |
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描述 | ADC Subsystem, 4-Bit, 1 Func, Parallel, 4 Bits Access, Bipolar, PDIP16, | ADC Subsystem, 4-Bit, 1 Func, Parallel, 4 Bits Access, Bipolar, CDIP16, | ADC Subsystem, 4-Bit, 1 Func, Parallel, 4 Bits Access, Bipolar, CDIP16, |
是否Rohs认证 | 不符合 | 不符合 | 不符合 |
Reach Compliance Code | unknow | unknown | unknown |
最小模拟输入电压 | -1 V | -1 V | -1 V |
转换器类型 | ADC SUBSYSTEM | ADC SUBSYSTEM | ADC SUBSYSTEM |
JESD-30 代码 | R-PDIP-T16 | R-GDIP-T16 | R-GDIP-T16 |
JESD-609代码 | e0 | e0 | e0 |
最大线性误差 (EL) | 1.6% | 1.6% | 1.6% |
标称负供电电压 | -5.2 V | -5.2 V | -5.2 V |
位数 | 4 | 4 | 4 |
功能数量 | 1 | 1 | 1 |
端子数量 | 16 | 16 | 16 |
最高工作温度 | 70 °C | 125 °C | 70 °C |
输出位码 | BINARY, 2\'S COMPLEMENT BINARY, COMPLEMENTARY BINARY, COMPLEMENTARY 2\'S COMPLEMENT | BINARY, 2'S COMPLEMENT BINARY, COMPLEMENTARY BINARY, COMPLEMENTARY 2'S COMPLEMENT | BINARY, 2'S COMPLEMENT BINARY, COMPLEMENTARY BINARY, COMPLEMENTARY 2'S COMPLEMENT |
输出格式 | PARALLEL, 4 BITS | PARALLEL, 4 BITS | PARALLEL, 4 BITS |
封装主体材料 | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
封装代码 | DIP | DIP | DIP |
封装等效代码 | DIP16,.3 | DIP16,.3 | DIP16,.3 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | IN-LINE | IN-LINE |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
电源 | 5,-5.2 V | 5,-5.2 V | 5,-5.2 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified |
采样速率 | 25 MHz | 25 MHz | 25 MHz |
采样并保持/跟踪并保持 | SAMPLE | SAMPLE | SAMPLE |
最大压摆率 | 50 mA | 65 mA | 50 mA |
标称供电电压 | 5 V | 5 V | 5 V |
表面贴装 | NO | NO | NO |
技术 | BIPOLAR | BIPOLAR | BIPOLAR |
温度等级 | COMMERCIAL | MILITARY | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
端子节距 | 2.54 mm | 2.54 mm | 2.54 mm |
端子位置 | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
Base Number Matches | - | 1 | 1 |