PLETRONICS
THD4 Series
THD4 Series
TCXO /
/
TCVCXO
TCXO TCVCXO
Features
Applications
SONET / SDH / DWDM
Test & Measurement
Telecom Transmission & Switching Equipment
Base Stations / Picocell
Wireless Communication Equipment
Pletronics’ THD4 Series Temperature Compensated
Crystal Oscillator
Optional Voltage Control Function
Low Power / Fast Warm Up
CMOS Output
2.8V to 3.3V nominal Supply Voltage
See table for developed Frequencies
THD4
3.2 x 5.0 x 1.50 mm
LCC Ceramic Package
Electrical Characteristics
Parameter
Frequency Range
2
Min
8.192
-
-
-40
2.8
-
-
-
0.5
0
Typ
-
±0.5
-
-
-
4.0
5.0
7.0
-
-
-
±8.0
Max
40.0
-
± 2.0
+85
3.3
-
± 0.2
± 0.2
2.5
±12.0
CMOS
Unit
MHz
ppm
ppm
°C
Volts
mA
ppm
ppm
Volts
ppm
Condition
(Consult factory for other options)
See table below for developed frequencies
(f
max
- f
min
) / 2
Vcontrol 1.50 volts nominal if used when V
CC
> 3.0 volts
Referenced to the value 25°C ± 2°C
Widest range available
± 5%
13 MHz
26 MHz
40 MHz
Load: 15 pF, V
CC
± 5%
Frequency Stability vs. Temperature
2
Frequency Initial Calibration
Operating Temperature Range
2
Supply Voltage
1, 2
V
CC
Supply Current I
CC
Frequency Stability vs. Supply
Frequency Stability vs. Load
Vcontrol Range
Frequency Pullability
2
Output Waveform
Duty Cycle
Output V
HIGH
Output V
LOW
Output T
RISE
and T
FALL
Startup Time
Long Term Stability (Aging)
Phase Noise
100 Hz
1 kHz
10 kHz
100 kHz
Load: 15 pF, V
CC
± 5%
Load: 15 pF, V
CC
± 5%
1.50 volts nominal for V
CC
Positive Slope
40
90
-
-
-
-
50
-
-
-
-
-
-120
-134
-144
-145
-
60
-
10
6.5
10.0
±1.0
%
%Vdd
%Vdd
nS
mS
ppm
Load: 15 pF
Vth: T
R
and T
F
10% and 90% of amplitude
Vth: D.C. 50% of amplitude
Within ± 2.0 ppm of final frequency
Per year at 25°C ± 2°C
-
-
dBc/Hz
25°C ± 2°C at 26.0 MHz
Storage Temperature Range
1
2
-55
+95
°C
Note:
Place a 10nF power supply bypass capacitor next to device for correct operation
Specified by part number.
The following is a list of developed frequencies. Consult factory for other options.
8.192M, 9.60M, 9.72M, 10.00M, 12.80M, 13.00M, 16.384M,
19.20M, 19.44M, 20.00M, 25.60M, 26.00M, 40.00M only
Product information is current as of publication date. The product conforms to specifications per the terms of the Pletronics standard warranty.
Production processing does not necessarily include testing of all parameters.
Aug 27, 2019 Rev. E
Pg 1
Copyright © 2019, Pletronics Inc.
19013 36th Ave. W, Lynnwood, WA 98036 USA
www.pletronics.com
425-776-1880
PLETRONICS
THD4 Series
THD4 Series
TCXO /
/
TCVCXO
TCXO TCVCXO
Part Number
(Possible Options shown)
Series
Model
V
CC
Supply Voltage
1
Lowest
Highest
Operating Temperature Stability
1, 2
Lowest
Highest
(ppm)
Pullability
1
(ppm)
Frequency
(MHz)
THD4
031
035
G
A
= +10
o
C
B
= +5
o
C
C
= +0
o
C
D
= -5
o
C
E
= -10
o
C
F
= -15
o
C
G
= -20
o
C
H
= -25
o
C
J
= -30
o
C
K
= -35
o
C
L
= -40
o
C
K
A
= +40
o
C
B
= +45
o
C
C
= +50
o
C
D
= +55
o
C
E
= +60
o
C
F
= +65
o
C
G
= +70
o
C
H
= +75
o
C
J
= +80
o
C
K
= +85
o
C
015
008
-19.44M
10 - 40 MHz
005
= ± 0.5
010
= ± 1.0
015
= ± 1.5
020
= ± 2.0
025
= ± 2.5
000
= TCXO
005
= ± 5
008
= ± 8
031
= 3.1 for 3.3 volts nominal
029
= 2.9 for 3.0 volts nominal
027
= 2.7 for 2.8 volts nominal
035
= 3.5 for 3.3 volts nominal
031
= 3.1 for 3.0 volts nominal
029
= 2.9 for 2.8 volts nominal
Developed:
8.192M, 9.60M,
9.72M, 10.00M,
12.80M, 13.00M,
16.384M, 19.20M,
19.44M, 20.00M,
25.60M, 26.00M,
40.00M
1
2
Contact Factory for non-standard specifications
Not all stabilities are available with all operating temperature ranges. Contact Factory for exact combinations available.
Device Marking
YMD
FFFF.zzz
YMD
FFFF zzz
OR
PLEzzzzz
YMD
P zzzzzz
YMD
FFFF
= Crystal Frequency in MHz (See
Note below)
zzz
= Internal factory codes
P or PLE = Pletronics
YMD
= Date code (may appear in any one of the locations shown)
Note: Output Frequency may be half the Crystal Frequency marking, depending on requirements.
Specifications such as part number, frequency stability, supply voltage and operating temperature range, etc. are not identified from marking.
External packaging labels and packing list will correctly identify the ordered Pletronics part number.
Codes for Date Code YMD (Year Month Day)
Code
Year
Code 1
Day
1
8
2018
2
2
3
3
9
2019
4
4
5
5
0
2020
6
6
7
7
1
2021
8
8
9
9
2
2022
A
10
B
11
Code
Month
C
12
D
13
A
JAN
E
14
B
FEB
F
15
G
16
C
MAR
H
17
D
APR
J
18
K
19
E
MAY
L
20
F
JUN
M
21
N
22
G
JUL
P
23
H
AUG
R
24
T
25
J
SEP
U
26
K
OCT
V
27
L
NOV
W
28
X
29
M
DEC
Y
30
Z
31
Package Labeling
Tape and Reel available for quantities of 250 to 1000 per reel, cut tape for < 250. 16mm tape, 8mm pitch.
P/N Label is 1" x 2.6" (25.4mm x 66.7mm)
Font is Courier New
Bar code is 39-Full ASCII
RoHs Label is 1" x 2.6" (25.4mm x 66.7mm)
Font is Arial
Pletronics Inc. certifies this device is in accordance with the RoHS 3 (2015/863) and WEEE 2 (2012/19/EU) directives.
Pletronics Inc. guarantees the device does not contain the following: Cadmium, Hexavalent Chromium, Lead, Mercury, PBB’s, PBDE’s
Weight of the Device: 0.10 grams
Moisture Sensitivity Level: 1 As defined in J-STD-020D
Second Level Interconnect code: e4
Product information is current as of publication date. The product conforms to specifications per the terms of the Pletronics standard warranty.
Production processing does not necessarily include testing of all parameters.
Aug 27, 2019 Rev. E
Pg 2
Copyright © 2019, Pletronics Inc.
19013 36th Ave. W, Lynnwood, WA 98036 USA
www.pletronics.com
425-776-1880
PLETRONICS
THD4 Series
THD4 Series
TCXO /
/
TCVCXO
TCXO TCVCXO
Mechanical Dimensions
A
B
C
D
1
E
1
F
1
G
1
H
1
J
1
Inches
mm
0.197 ± 0.008 5.00 ± 0.20
0.126 ± 0.008 3.20 ± 0.20
0.059 max
0.055
0.031
0.043
0.102
0.020C
0.008R
1.50 max
1.40
0.80
1.10
2.60
0.50C
0.20R
1
Typical dimensions
Pad Layout
mm shown (Top View)
Disclaimer: Recommended layout shown.
Adjust pad layout as needed for individual
process requirements.
Solder mask required, as shown.
(Not to Scale)
Contacts (pads):
Gold 11.8 to 39.4 µinches (0.3 to 1.0 µm) over Nickel 50 to 350 µinches (1.27 to 8.89 µm)
Layout
Pad Function
1
2
3
4
-
Vcontrol Input
Ground (GND)
Output
V
CC
Supply Voltage
N.C.
CMOS
Connect an appropriate 10nF power supply bypass capacitor as close as possible
All other pads on the bottom shall not be connected.
These are internally connected for the TCXO compensation process
All connection points in the designated region have solder mask cover to avoid any electrical connections
(top view shown)
Note
If this function is not specified, recommend connecting this pad to ground. EFC (Electronic Frequency Control).
For Optimum Jitter Performance, Pletronics recommends:
$
$
$
$
$
A ground plane under the device
Do not route large transient signals (both current and voltage) under the device
Do not place near a large magnetic field such as a high frequency switching power supply
Do not place near piezoelectric buzzers or mechanical fans
Minimize air flow across the device
Product information is current as of publication date. The product conforms to specifications per the terms of the Pletronics standard warranty.
Production processing does not necessarily include testing of all parameters.
Aug 27, 2019 Rev. E
Pg 3
Copyright © 2019, Pletronics Inc.
19013 36th Ave. W, Lynnwood, WA 98036 USA
www.pletronics.com
425-776-1880
PLETRONICS
THD4 Series
THD4 Series
TCXO /
/
TCVCXO
TCXO TCVCXO
Electrical Test /Load Circuit
Environmental / ESD Ratings
Reliability: Environmental Compliance
Parameter
Mechanical Shock
Vibration
Solderability
Thermal Shock
JESD22-B104
JESD22-B103
IPC J-STD-002
MIL-STD-883 Method 1011, Condition A
ESD Rating
Model
Human Body Model
Charged Device Model
Machine Model
Condition
Min. Voltage
2000V
500V
200V
Condition
JESD22-A114
JESD 22-C101
JESD22-A115
Absolute Maximum Ratings
Parameter
Thermal Characteristics:
The maximum die or junction temperature is 155
o
C
The thermal resistance junction to board is 30 to 50
o
C/Watt depending on the solder
pads, ground plane and construction of the PCB.
V
CC
Supply Voltage
Vi
Io
Input Voltage
Output Current
Unit
-0.6V to +6V
-0.6V to V
CC
+ 0.6V
-10mA to +10mA
Product information is current as of publication date. The product conforms to specifications per the terms of the Pletronics standard warranty.
Production processing does not necessarily include testing of all parameters.
Aug 27, 2019 Rev. E
Pg 4
Copyright © 2019, Pletronics Inc.
19013 36th Ave. W, Lynnwood, WA 98036 USA
www.pletronics.com
425-776-1880
PLETRONICS
THD4 Series
THD4 Series
TCXO /
/
TCVCXO
TCXO TCVCXO
Reflow Cycle
The part may be reflowed 2 times without degradation
(typical for lead free processing).
Tape and Reel
Tape Constant Dimensions Table 1
Tape
Size
8mm
12mm
16mm
24mm
1.5
+0.1
-0.0
Do
D1
min
1.0
1.5
1.5
1.5
1.75
±0.1
4.0
±0.1
E1
Po
P2
2.0
±0.05
0.6
2.0
±0.1
0.6
0.1
S1
min
T
max
T1
max
Tape Variable Dimensions Table 2
Tape
Size
16mm
B1
max
12.1
E2
min
14.25
F
7.5
±0.1
P1
8.0
±0.1
T2
max
8.0
W
max
16.3
Ao, Bo &
Ko
Note 1
Dimensions in mm
Drawing Not to scale
Note 1: Embossed cavity to conform to EIA– 481-B
Reel Dimensions (may vary) Table 3
A
Reel
Size
7
10
13
Inches
7.0
10.0
13.0
mm
177.8
254.0
330.2
Inches
2.50
4.00
3.75
B
mm
63.5
101.6
95.3
C
mm
13.0
+0.5
-0.2
D
mm
Tape size +0.4
+2.0
-0.0
Product information is current as of publication date. The product conforms to specifications per the terms of the Pletronics standard warranty.
Production processing does not necessarily include testing of all parameters.
Aug 27, 2019 Rev. E
Pg 5
Copyright © 2019, Pletronics Inc.
19013 36th Ave. W, Lynnwood, WA 98036 USA
www.pletronics.com
425-776-1880
stm32/stm8
