Note: Availability of features may vary between processor SKUs.
Debug Headers
40-pin multipurpose flat cable connector
Use in combination with DB-40 debug module
providing BIOS POST code LED, BMC access, SPI BIOS flashing, power test points,
debug LEDs
60-pin XDP header for ICE debug of CPU/chipset on break out board
GPU Feature Support
7th generation Intel® graphics core architecture with four execution units
supporting two independent displays
3D graphics hardware acceleration
Supports for DirectX11, OCL 1.1, OGL ES Halt/2.0/1.1, OGL 3.2
Video decode hardware acceleration including support for H.264, MPEG2, MVC,
VC-1, WMV9 and VP8 formats
Video encode hardware acceleration including support for H.264, MPEG2 and
MVC formats
Memory
Single channel non-ECC 1333/1066 MHz soldered DDR3L memory up to 4GB
(2GB or 4GB)
Embedded BIOS
AMI EFI with CMOS backup in 8MB SPI BIOS
Digital Display Interface
One DDI channel supporting DisplayPort/HDMI/DVI
Cache
Primary 32 KB, 8-way L1 instruction cache and 24 KB, 6-way L1 write-back data
cache
2MB for E3845, N2930 and J1900
1MB for E3827, E3826, E3825 and E3805
512K for E3815
LVDS/eDP
Single channel 18/24-bit LVDS
(BOM option support for 24-bit EDID panel)
eDP support (build option)
●
Audio
Chipset
Intel
®
HD Audio integrated in SOC
Expansion Busses
3 PCI Express x1 Gen2 (AB): Ianes 0/1/2;
optional PCIe x4 (lose GbE)
LPC bus, SMBus (system), I2C (user)
Supports: Voltage/Current monitoring, Power sequence debug support, AT/ATX
mode control, Logistics and Forensic information, Flat Panel Control, General
Purpose I2C, Watchdog Timer
Audio Codec
Located on carrier miniBASE-10R
SEMA Board Controller
●
Ethernet
Intel
®
MAC/PHY: Intel
®
i210LM (MAC/PHY) Ethernet controller
Interface: 10/100/1000 GbE connection
Note: “Build option” indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product.
Be aware that part numbers for SKUs with “build options” will need to be created and may cause production lead times.
Specifications
●
I/O Interfaces
USB: 1x USB 3.0 (USB 0) 3x USB 2.0 (USB 1,2,3) and 1x USB 2.0 client (USB 7)
SATA: Two SATA 3 Gb/s ports
Serial: 2 UART ports COM 0/1 (COM 0 support console redirection)
eMMC: Optional soldered on module bootable eMMC flash storage
8G to 32 GB
SD: Optional, SD support multiplexed over GPIO pins
eMMC and SD functions may vary between OS
GPIO: 4 GPO and 4 GPI
●
Mechanical and Environmental
Form Factor: PICMG COM.0: Rev 2.1 Type 10
Dimension: Mini size: 84 mm x 55 mm
Operating Temperature
Standard: 0°C to +60°C
Extreme Rugged: -40 to +85°C (build option, Atom™ E38xx series only)
Humidity
5-90% RH operating, non-condensing
5-95% RH storage (and operating with conformal coating)
●
Super I/O
On carrier if needed (standard support for W83627DHG-P)
Shock and Vibration
IEC 60068-2-64 and IEC-60068-2-27
MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table
214-I, Condition D
●
Power
Standard Input: ATX = 12V±5% / 5Vsb ±5% or AT = 12V±5%
Management: ACPI 4.0 compliant, Smart Battery support
Power States: C0, C1, C1E, C4, C6
S0, S3, S4, S5 (Wake on USB S3/S4, WOL S3/S4/S5
ECO mode: Supports deep S5 (ECO mode) for power saving
HALT
Thermal Stress, Vibration Stress, Thermal Shock and Combined Test
●
Operating Systems
Standard Support
Windows 7/8 32/64-bit, Linux 32/64-bit
Extended Support (BSP)
WES7/8, Linux, VxWorks 32/64-bit, WEC7 32-bit
Note: “Build option” indicates an alternative BOM configuration to support additional or alternative functions that are not available on the standard product.
Be aware that part numbers for SKUs with “build options” will need to be created and may cause production lead times.
Functional Diagram
eDP (optional)
LVDS
eDP to LVDS
RTL2132
DDI2
4 lanes
1x USB 1.1/2.0/3.0 (port 0)
3x USB 1.1/2.0 (port 1~3)
1x USB 1.1/2.0 client (port 7)
I1
eDP 1 lane
Intel
®
Atom™
E3845
E3827
E3826
E3825
E3815
E3805 (No GFX)
2~4 GB DDR3L
non ECC
Soldered
Intel
®
Celeron
®
3 PCIe x1 Gen2
(port 0~2)
PCIe x1
alternative
route
N2930
J1900
GbE
i210
PCIe x1 Gen2
(port 3)
“Baytrail”
On break-out board
60-pin
XDP
2x SATA 3Gb/s
(port 0/1)
HD Audio
2 UART (Tx/Rx)
LPC Bus
8/16/32 GB
eMMC
SD/MMC port 0 (optional)
4x GP0, 4x GPI
SMBus
GP I C
DDC I
2
C
SPI_CS#
2
PCA9535
GPIO
SEMA
BMC
SPI0
BIOS
LM73
to CPU
SPI
Ordering Information
●
Accessories
Heat Spreaders
●
nanoX-BT-E3845-2G
COM Express
®
Mini Size Type 10 with Intel
®
Atom™ E3845
at 1.91 GHz and 2GB non ECC DDR3L
nanoX-BT-E3827-2G
COM Express
®
Mini Size Type 10 with Intel
®
Atom™ E3827
at 1.75 GHz and 2GB non ECC DDR3L
nanoX-BT-E3826-2G
COM Express
®
Mini Size Type 10 with Intel
®
Atom™ E3826
at 1.46 GHz and 2GB non ECC DDR3L
nanoX-BT-E3825-2G
COM Express
®
Mini Size Type 10 with Intel
®
Atom™ E3825
at 1.33 GHz and 2GB non ECC DDR3L
nanoX-BT-E3815-2G
COM Express
®
Mini Size Type 10 with Intel
®
Atom™ E3815
at 1.46 GHz and 2GB non ECC DDR3L
nanoX-BT-E3805-2G
COM Express Mini Size Type 10 with Intel
®
Atom™ E3805
at 1.33 GHz and 2GB non ECC DDR3L
nanoX-BT-N2930-2G
COM Express Mini Size Type 10 with Intel
®
Celeron
®
N2930
at 1.83 GHz and 2GB non ECC DDR3L
nanoX-BT-J1900-2G
COM Express
®
Mini Size Type 10 with Intel
®
Celeron
®
J1900
at 2.00 GHz and 2GB non ECC DDR3L
●
HTS-nXBT-B
Heatspreader for nanoX-BT with threaded standoffs for bottom
mounting
HTS-nXBT-BT
Heatspreader for nanoX-BT with through hole standoffs for top
mounting
●
●
●
Passive Heatsinks
●
●
THS-nXBT-B
Low profile heatsink for nanoX-BT with threaded standoffs for
bottom mounting
THS-nXBT-BT
Low profile heatsink for nanoX-BT with through hole standoffs
for top mounting
THSM-nXBT-B
High profile heatsink for nanoX-BT with threaded standoffs for
bottom mounting
●
●
●
●
●
Starter Kit
●
COM Express Type 10 Starter Kit Plus
COM Express formfactor starter kit with miniBase-10R carrier
board, power supply, and accessory kit
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