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TIBPAL20R6-5CNT

OT PLD, 7ns, TTL, PDIP24, PLASTIC, DIP-24

器件类别:可编程逻辑器件    可编程逻辑   

厂商名称:Rochester Electronics

厂商官网:https://www.rocelec.com/

器件标准:  

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器件参数
参数名称
属性值
是否无铅
不含铅
是否Rohs认证
符合
厂商名称
Rochester Electronics
零件包装代码
DIP
包装说明
DIP,
针数
24
Reach Compliance Code
unknown
其他特性
REGISTER PRELOAD; POWER-UP RESET
最大时钟频率
111 MHz
JESD-30 代码
R-PDIP-T24
JESD-609代码
e4
长度
31.64 mm
专用输入次数
12
I/O 线路数量
2
端子数量
24
最高工作温度
75 °C
最低工作温度
组织
12 DEDICATED INPUTS, 2 I/O
输出函数
MIXED
封装主体材料
PLASTIC/EPOXY
封装代码
DIP
封装形状
RECTANGULAR
封装形式
IN-LINE
峰值回流温度(摄氏度)
NOT SPECIFIED
可编程逻辑类型
OT PLD
传播延迟
7 ns
认证状态
Not Qualified
座面最大高度
5.08 mm
最大供电电压
5.25 V
最小供电电压
4.75 V
标称供电电压
5 V
表面贴装
NO
技术
TTL
温度等级
COMMERCIAL EXTENDED
端子面层
NICKEL PALLADIUM GOLD
端子形式
THROUGH-HOLE
端子节距
2.54 mm
端子位置
DUAL
处于峰值回流温度下的最长时间
NOT SPECIFIED
宽度
7.62 mm
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OBSOLETE - No Longer Available
TIBPAL20L8-5C, TIBPAL20R4-5C, TIBPAL20R6-5C, TIBPAL20R8-5C
TIBPAL20L8-7M, TIBPAL20R4-7M, TIBPAL20R6-7M, TIBPAL20R8-7M
HIGH-PERFORMANCE
IMPACT-X
PAL
®
CIRCUITS
High-Performance Operation:
f
max
(no feedback)
TIBPAL20R’ -5C Series . . . 125 MHz Min
TIBPAL20R’ -7M Series . . . 100 MHz Min
f
max
(internal feedback)
TIBPAL20R’ -5C Series . . . 125 MHz Min
TIBPAL20R’ -7M Series . . . 100 MHz Min
f
max
(external feedback)
TIBPAL20R’ -5C Series . . . 117 MHz Min
TIBPAL20R’ -7M Series . . . 74 MHz Min
Propagation Delay
TIBPAL20L8-5C Series . . . 5 ns Max
TIBPAL20L8-7M Series . . . 7 ns Max
TIBPAL20R’ -5C Series
(CLK-to-Q) . . . 4 ns Max
TIBPAL20R’ -7M Series
(CLK-to-Q) . . . 6.5 ns Max
Functionally Equivalent, but Faster Than,
Existing 24-Pin PLDs
Preload Capability on Output Registers
Simplifies Testing
Power-Up Clear on Registered Devices (All
Register Outputs are Set Low, but Voltage
Levels at the Output Pins Go High)
Package Options Include Both Plastic and
Ceramic Chip Carriers in Addition to Plastic
and Ceramic DIPs
Security Fuse Prevents Duplication
DEVICE
PAL20L8
PAL20R4
PAL20R6
PAL20R8
I
INPUTS
14
12
12
12
3-STATE
O OUTPUTS
2
0
0
0
REGISTERED
Q OUTPUTS
0
4 (3-state buffers)
6 (3-state buffers)
8 (3-state buffers)
I/O
PORT
S
6
4
2
0
SRPS010F – D3353, OCTOBER 1989 – REVISED SEPTEMBER 1992
TIBPAL20L8’
C SUFFIX . . . JT OR NT PACKAGE
M SUFFIX . . . JT PACKAGE
(TOP VIEW)
I
I
I
I
I
I
I
I
I
I
I
GND
1
2
3
4
5
6
7
8
9
10
11
12
24
23
22
21
20
19
18
17
16
15
14
13
V
CC
I
O
I/O
I/O
I/O
I/O
I/O
I/O
O
I
I
TIBPAL20L8’
C SUFFIX . . . FN PACKAGE
M SUFFIX . . . FK PACKAGE
(TOP VIEW)
I
I
I
NC
I
I
I
5
6
7
8
9
10
I
I
I
NC
V
CC
I
O
4
3 2 1 28 27 26
25
24
23
22
21
20
11
19
12 13 14 15 16 17 18
I/O
I/O
I/O
NC
I/O
I/O
I/O
description
NC
No internal connection
Pin assignments in operating mode
These programmable array logic devices feature high speed and functional equivalency when compared with
currently available devices. These IMPACT-X™ circuits combine the latest Advanced Low-Power Schottky
technology with proven titanium-tungsten fuses to provide reliable, high-performance substitutes for
conventional TTL logic. Their easy programmability allows for quick design of custom functions and typically
results in a more compact circuit board.
The TIBPAL20’ C series is characterized from 0°C to 75°C. The TIBPAL20’ M series is characterized for
operation over the full military temperature range of –55°C to 125°C.
These devices are covered by U.S. Patent 4,410,987.
IMPACT-X is a trademark of Texas Instruments Incorporated.
PAL is a registered trademark of Advanced Micro Devices Inc.
This document contains information on products in more than one
phase of development. The status of each device is indicated on the
page(s) specifying its electrical characteristics.
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
I
I
GND
NC
I
I
O
Copyright
©
1992, Texas Instruments Incorporated
1
OBSOLETE - No Longer Available
SRPS010F – D3353, OCTOBER 1989 – REVISED SEPTEMBER 1992
TIBPAL20R4-5C, TIBPAL20R6-5C, TIBPAL20R8-5C
TIBPAL20R4-7M, TIBPAL20R6-7M, TIBPAL20R8-7M
HIGH-PERFORMANCE
IMPACT-X
PAL
®
CIRCUITS
TIBPAL20R4’
C SUFFIX . . . JT OR NT PACKAGE
M SUFFIX . . . JT PACKAGE
(TOP VIEW)
CLK
I
I
I
I
I
I
I
I
I
I
GND
1
2
3
4
5
6
7
8
9
10
11
12
24
23
22
21
20
19
18
17
16
15
14
13
VCC
I
I/O
I/O
Q
Q
Q
Q
I/O
I/O
I
OE
TIBPAL20R4’
C SUFFIX . . . FN PACKAGE
M SUFFIX . . . FK PACKAGE
(TOP VIEW)
VCC
I
I/O
I/O
Q
Q
NC
Q
Q
I/O
VCC
I
I/O
Q
Q
Q
NC
Q
Q
Q
VCC
I
Q
Q
Q
Q
NC
Q
Q
Q
OE
I
Q
OE
I
I/O
OE
I
I/O
I
I
CLK
NC
I
I
I
NC
I
I
I
I
I
I
NC
I
I
I
I
I
I
NC
I
I
I
NC
POST OFFICE BOX 655303
4 3 2 1 28 27 26
25
5
24
6
23
7
22
8
9
21
10
20
11
19
12 13 14 15 16 17 18
I
I
GND
NC
TIBPAL20R6’
C SUFFIX . . . JT OR NT PACKAGE
M SUFFIX . . . JT PACKAGE
(TOP VIEW)
CLK
I
I
I
I
I
I
I
I
I
I
GND
1
2
3
4
5
6
7
8
9
10
11
12
24
23
22
21
20
19
18
17
16
15
14
13
VCC
I
I/O
Q
Q
Q
Q
Q
Q
I/O
I
OE
TIBPAL20R6’
C SUFFIX . . . FN PACKAGE
M SUFFIX . . . FK PACKAGE
(TOP VIEW)
I
I
CLK
NC
4 3 2 1 28 27 26
25
5
24
6
23
7
8
22
9
21
10
20
11
19
12 13 14 15 16 17 18
I
I
GND
NC
TIBPAL20R8’
C SUFFIX . . . JT OR NT PACKAGE
M SUFFIX . . . JT PACKAGE
(TOP VIEW)
CLK
I
I
I
I
I
I
I
I
I
I
GND
1
2
3
4
5
6
7
8
9
10
11
12
24
23
22
21
20
19
18
17
16
15
14
13
VCC
I
Q
Q
Q
Q
Q
Q
Q
Q
I
OE
TIBPAL20R8’
C SUFFIX . . . FN PACKAGE
M SUFFIX . . . FK PACKAGE
(TOP VIEW)
I
I
CLK
NC
4 3 2 1 28 27 26
25
5
24
6
7
23
8
22
21
9
20
10
11
19
12 13 14 15 16 17 18
I
I
GND
NC
Pin assignments in operating mode
No internal connection
2
DALLAS, TEXAS 75265
OBSOLETE - No Longer Available
TIBPAL20L8-5C, TIBPAL20R4-5C
TIBPAL20L8-7M, TIBPAL20R4-7M
HIGH-PERFORMANCE
IMPACT-X
PAL
®
CIRCUITS
functional block diagrams (positive logic)
TIBPAL20L8’
&
40 X 64
EN
1
SRPS010F – D3353, OCTOBER 1989 – REVISED SEPTEMBER 1992
7
7
O
O
I/O
I/O
I/O
I/O
I/O
I/O
20 x
I
14
20
7
7
6
20
7
7
7
7
6
TIBPAL20R4’
OE
CLK
&
40 X 64
8
8
8
20
8
4
4
20
7
7
7
7
4
4
EN
1
I/O
I/O
I/O
I/O
Q
1
EN 2
C1
I=0 2
1D
Q
Q
Q
20 x
I
12
denotes fused inputs
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
3
OBSOLETE - No Longer Available
SRPS010F – D3353, OCTOBER 1989 – REVISED SEPTEMBER 1992
TIBPAL20R6-5C, TIBPAL20R8-5C
TIBPAL20R6-7M, TIBPAL20R8-7M
HIGH-PERFORMANCE
IMPACT-X
PAL
®
CIRCUITS
functional block diagrams (positive logic)
TIBPAL20R6’
OE
CLK
&
40 X 64
8
8
8
20
8
6
8
2
20
8
EN
1
Q
Q
Q
1
EN 2
C1
I=0 2
1D
Q
Q
Q
20 x
I
12
7
7
2
6
I/O
I/O
TIBPAL20R8’
OE
CLK
&
40 X 64
8
8
8
20
8
8
8
20
8
8
8
Q
Q
Q
Q
Q
1
EN 2
C1
I=0 2
1D
Q
Q
Q
20 x
I
12
8
denotes fused inputs
4
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
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参数对比
与TIBPAL20R6-5CNT相近的元器件有:TIBPAL20R6-5CFN、TIBPAL20R8-7MFKB、TIBPAL20R8-5CNT、TIBPAL20R4-5CNT、TIBPAL20L8-5CNT、TIBPAL20L8-5CFN。描述及对比如下:
型号 TIBPAL20R6-5CNT TIBPAL20R6-5CFN TIBPAL20R8-7MFKB TIBPAL20R8-5CNT TIBPAL20R4-5CNT TIBPAL20L8-5CNT TIBPAL20L8-5CFN
描述 OT PLD, 7ns, TTL, PDIP24, PLASTIC, DIP-24 OT PLD, 7ns, TTL, PQCC28, PLASTIC, LCC-28 OT PLD, 10ns, TTL, CQCC28, CERAMIC, LCC-28 OT PLD, 7ns, TTL, PDIP24, PLASTIC, DIP-24 OT PLD, 7ns, TTL, PDIP24, PLASTIC, DIP-24 OT PLD, 7ns, TTL, PDIP24, PLASTIC, DIP-24 OT PLD, 7ns, TTL, PQCC28, PLASTIC, LCC-28
是否无铅 不含铅 含铅 不含铅 含铅 含铅 不含铅 含铅
厂商名称 Rochester Electronics Rochester Electronics Rochester Electronics Rochester Electronics Rochester Electronics Rochester Electronics Rochester Electronics
零件包装代码 DIP QLCC QLCC DIP DIP DIP QLCC
包装说明 DIP, QCCJ, CERAMIC, LCC-28 DIP, DIP, DIP, QCCJ,
针数 24 28 28 24 24 24 28
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown
其他特性 REGISTER PRELOAD; POWER-UP RESET REGISTER PRELOAD; POWER-UP RESET REGISTER PRELOAD; POWER-UP RESET REGISTER PRELOAD; POWER-UP RESET REGISTER PRELOAD; POWER-UP RESET REGISTER PRELOAD; POWER-UP RESET REGISTER PRELOAD; POWER-UP RESET
最大时钟频率 111 MHz 117 MHz 74 MHz 111 MHz 111 MHz 111 MHz 74 MHz
JESD-30 代码 R-PDIP-T24 S-PQCC-J28 S-CQCC-N28 R-PDIP-T24 R-PDIP-T24 R-PDIP-T24 S-PQCC-J28
长度 31.64 mm 11.5062 mm 11.43 mm 31.64 mm 31.64 mm 31.64 mm 11.5062 mm
专用输入次数 12 12 12 12 12 14 14
I/O 线路数量 2 2 - - 4 6 6
端子数量 24 28 28 24 24 24 28
最高工作温度 75 °C 75 °C 125 °C 75 °C 75 °C 75 °C 75 °C
组织 12 DEDICATED INPUTS, 2 I/O 12 DEDICATED INPUTS, 2 I/O 12 DEDICATED INPUTS, 0 I/O 12 DEDICATED INPUTS, 0 I/O 12 DEDICATED INPUTS, 4 I/O 14 DEDICATED INPUTS, 6 I/O 14 DEDICATED INPUTS, 6 I/O
输出函数 MIXED MIXED REGISTERED REGISTERED MIXED COMBINATORIAL COMBINATORIAL
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 DIP QCCJ QCCN DIP DIP DIP QCCJ
封装形状 RECTANGULAR SQUARE SQUARE RECTANGULAR RECTANGULAR RECTANGULAR SQUARE
封装形式 IN-LINE CHIP CARRIER CHIP CARRIER IN-LINE IN-LINE IN-LINE CHIP CARRIER
峰值回流温度(摄氏度) NOT SPECIFIED 220 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED 220
可编程逻辑类型 OT PLD OT PLD OT PLD OT PLD OT PLD OT PLD OT PLD
传播延迟 7 ns 7 ns 10 ns 7 ns 7 ns 7 ns 7 ns
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 5.08 mm 4.57 mm 2.03 mm 5.08 mm 5.08 mm 5.08 mm 4.57 mm
最大供电电压 5.25 V 5.25 V 5.5 V 5.25 V 5.25 V 5.25 V 5.25 V
最小供电电压 4.75 V 4.75 V 4.5 V 4.75 V 4.75 V 4.75 V 4.75 V
标称供电电压 5 V 5 V 5 V 5 V 5 V 5 V 5 V
表面贴装 NO YES YES NO NO NO YES
技术 TTL TTL TTL TTL TTL TTL TTL
温度等级 COMMERCIAL EXTENDED COMMERCIAL EXTENDED MILITARY COMMERCIAL EXTENDED COMMERCIAL EXTENDED COMMERCIAL EXTENDED COMMERCIAL EXTENDED
端子形式 THROUGH-HOLE J BEND NO LEAD THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE J BEND
端子节距 2.54 mm 1.27 mm 1.27 mm 2.54 mm 2.54 mm 2.54 mm 1.27 mm
端子位置 DUAL QUAD QUAD DUAL DUAL DUAL QUAD
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
宽度 7.62 mm 11.5062 mm 11.43 mm 7.62 mm 7.62 mm 7.62 mm 11.5062 mm
是否Rohs认证 符合 不符合 不符合 不符合 不符合 - 不符合
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