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TKC-HTC-2512LF-3M57-F

Fixed Resistor, Metal Glaze/thick Film, 0.75W, 3570000ohm, 500V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 2512, CHIP, LEAD FREE

器件类别:无源元件    电阻器   

厂商名称:TT Electronics plc

厂商官网:http://www.ttelectronics.com/

器件标准:

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器件参数
参数名称
属性值
是否无铅
不含铅
是否Rohs认证
符合
厂商名称
TT Electronics plc
包装说明
SMT, 2512
Reach Compliance Code
compliant
ECCN代码
EAR99
构造
Chip
JESD-609代码
e3
制造商序列号
HTC
安装特点
SURFACE MOUNT
端子数量
2
最高工作温度
200 °C
最低工作温度
-55 °C
封装高度
0.8 mm
封装长度
6.5 mm
封装形状
RECTANGULAR PACKAGE
封装形式
SMT
封装宽度
3.2 mm
额定功率耗散 (P)
0.75 W
额定温度
150 °C
电阻
3570000 Ω
电阻器类型
FIXED RESISTOR
系列
HTC
尺寸代码
2512
表面贴装
YES
技术
METAL GLAZE/THICK FILM
温度系数
100 ppm/°C
端子面层
Matte Tin (Sn) - with Nickel (Ni) barrier
端子形状
WRAPAROUND
容差
1%
工作电压
500 V
Base Number Matches
1
文档预览
gh Temperature
High Temperature
hick Film Chip Resistors
Excellent high temperature stability
eration to
·
200°C
High Temperature
HTC Series
Thick
Film Chip Resistors
Thick
Film Chip Resistors
C Series
Operation to 200°C
·
·
·
·
Thick Film Chip Resistors
High Temperature
Improved working
ellent high temperature stability
voltage ratings
HTC Series
Pb-free
ratings
oved working voltage
wrap-around terminations
HTC Series
Standard chip sizes available from 1206 to 2512
Operation to 200°C
ree wrap-around terminations
Operation to 200°C
Excellent high temperature stability
dard chip sizes available from 1206 to 2512
Excellent high temperature stability
Improved working voltage ratings
Improved working voltage ratings
Pb-free wrap-around terminations
Pb-free wrap-around terminations
Standard chip sizes available from 1206 to 2512
Standard chip sizes available from 1206 to 2512
ctrical Data
Electrical Data
acteristic
Electrical Data
Characteristic
Characteristic
Resistance Range
Resistance Range
150°C Power Rating
150°C Power Rating
1206
1206
1206
2010
1
to 10M
2010
±1%, ±5%
2512
2512
2512
2010
stance Range
1
±1%, ±5%
10
1
to
to
to 10M
±1%, ±5%
1M ±0.5%, ±5%, ±1%
10M
C Power Rating
200mW
200V
10 to 1M ±0.5%, ±5%, ±1%
10 to 1M ±0.5%, ±5%, ±1%
200mW
200mW
200V
200V
500mW
400V
500mW
500mW
750mW
750mW
750mW
Voltage Rating
Voltage Rating
Max
Max Voltage Rating
400V
400V
± 100ppm/°C
± 100ppm/°C
± 100ppm/°C
-55°C
-55°C to
to +200°C
+200°C
500V
500V
500V
Absolute TCR
olute TCR
Absolute TCR
Operating Temperature
80mm
2
80mm
2
Operating
ating Temperature
Temperature
-55°C to +200°C
200mm
2
200mm
2
300mm
2
300mm
2
Trace Area
1
Pad/Trace Area
1
Pad/Trace Area
1
Termination
Termination
80mm
2
Wrap-around Pb-free with leach resistant Ni barrier
Wrap-around Pb-free with leach resistant Ni barrier
200mm
2
300mm
2
mination
Note
1
: Recommended minimum pad and adjacent trace area
Wrap-around
for rated power on
FR4 PCB.
for each termination
Note
1
: Recommended minimum pad and adjacent trace area for each termination for
Pb-free with
PCB.
rated power on
FR4
leach
resistant Ni barrier
ecommended minimum pad and adjacent trace area for each termination for rated power on
FR4 PCB.
Environmental Data
Environmental Data
vironmental Data
Test
Test
Load Life
Load Life
High Temperature Exposure
High Temperature Exposure
Method
Method
MIL-STD-202 Method 108
MIL-STD-202 Method 108
(Rated Power for 1000hrs
150°C)
(Rated
Method
1000hrs @
@ 150°C)
Power for
1000 hours
200°C
1000 hours @
@ 200°C
Specification
Specification
Maximum
2
Maximum
2
Typical
Typical
Specification
1.00%
0.25%
1.00%
0.25%
Maximum
2
1.00%
1.00%
Typical
0.20%
0.20%
0.10%
0.25%
0.10%
0.25%
0.25%
0.20%
0.05%
0.05%
Life
Short Time Overload
Short Time Overload
MIL-STD-202 Method 108
MIL-PRF-55342H
MIL-PRF-55342H
(6.25X rated power
5secs)
(Rated Power for
rated power
@
for 5secs)
(6.25X
1000hrs
for
150°C)
MIL-STD-202
200°C
106G
1000
MIL-STD-202 Method 106G
hours @
Method
1.00%
1.00%
1.00%
1.00%
1.00%
1.00%
0.25%
0.25%
Moisture Resistance
Moisture Resistance
Temperature Exposure
Thermal Shock
Thermal Shock
Resistance to Soldering Heat
t Time Overload
Resistance to Soldering Heat
MIL-PRF-55342H
MIL-STD-202 Method 210F
MIL-STD-202 Method 210F
(6.25X rated power for 5secs)
MIL-STD-202 Method 208
MIL-STD-202 Method 106G
(245°C, 5 seconds)
MIL-STD-202 Method 107G Condition
MIL-STD-202 Method 107G Condition B
B
1.00%
0.25%
0.25%
0.10%
0.05%
0.05%
Solderability
ture Resistance
Solderability
2
2
MIL-STD-202 Method 208
(245°C, 5 seconds)
>95% Coverage
1.00%
Coverage
0.25%
>95%
Note
0.01 added for all resistance values <10.
mal Shock
Note
:
:
0.01 added for all resistance values <10.
MIL-STD-202 Method 107G Condition B
0.25%
0.25%
0.05%
0.05%
A subsidiary of
A subsidiary of
TTelectronics plc
TTelectronics plc
HTC Series Issue July
HTC Series Issue July 2009
2009
General Note
General Note
Heat
stance to Soldering
right
to make changes in
in product specification without notice
liability.
MIL-STD-202 Method 210F
IRC reserves the
IRC reserves the right
to make changes
product specification without notice or
or liability.
information is subject to IRC’s own data and
considered accurate at time of
of going to print.
General Note
All information is subject to IRC’s own data and is
is considered accurate at time
going to print.
erability
MIL-STD-202 Method 208
All information
992
7900 •
Facsimile: 361 992
own data
Website:
considered accurate at time of going to print.
is subject to
Facsimile: 361 992 3377 •
and is
www.irctt.com
TT electronics’
3377 •
Website: www.irctt.com
Telephone: 361
Telephone: 361 992
7900
(245°C, 5 seconds)
TT electronics reserves the right
Advanced Film Division
to make changes in product specification without notice or liability.
4222 South Staples Street
Corpus Christi Texas 78411 USA
Advanced Film Division
4222 South Staples Street •
• Corpus Christi Texas 78411 USA
www.bitechnologies.com www.irctt.com www.welwyn-tt.com
>95% Coverage
©
all resistance
plc
0.01 added for
TT electronics
values <10.
09. 11
High Temperature
High Temperature
High Temperature
Thick Film Chip Resistors
Thick Film Chip Resistors
Thick Film Chip Resistors
HTC Series
Physical Data
Physical Data
A
A
W
W
T
T
B
B
High Reliability
High Reliability
Resistance Element
Resistance Element
C
C
L
L
Overglaze
Overglaze
(Stability Enhancer)
(Stability Enhancer)
Protective Overcoat
Protective Overcoat
Sn Plating
Sn Plating
Ni Barrier Layer
Ni Barrier Layer
Alumina Substrate
Alumina Substrate
Conductor
Conductor
Part Type
Part Type
1206
1206
2010
2010
2512
2512
L (mm)
L (mm)
3.2±0.4
3.2±0.4
5.1±0.3
5.1±0.3
6.5±0.3
6.5±0.3
W (mm)
W (mm)
1.6±0.2
1.6±0.2
2.5±0.2
2.5±0.2
3.2±0.2
3.2±0.2
T max (mm)
T max (mm)
0.7
0.7
0.8
0.8
0.8
0.8
A (mm)
A (mm)
0.4±0.15
0.4±0.15
0.6±0.25
0.6±0.25
0.6±0.25
0.6±0.25
B min (mm)
B min (mm)
0.4±0.2
0.4±0.2
0.6±0.3
0.6±0.3
0.6±0.3
0.6±0.3
C (mm)
C (mm)
1.7
1.7
3.0
3.0
4.4
4.4
Weight (grams)
Weight (grams)
0.020
0.020
0.036
0.036
0.055
0.055
Construction:
Construction:
Thick film resistor material, overglaze and organic protection are screen printed on a 96% alumina substrate. Wrap-around
Thick film resistor material, overglaze and organic protection are screen printed on a 96% alumina substrate. Wrap-around
terminations have an electroplated Ni barrier and pure Sn matte finish, ensuring excellent `leach´ resistance properties and
terminations have an electroplated Ni barrier and pure Sn matte finish, ensuring excellent `leach´ resistance properties and
solderability.
solderability.
Marking:
Marking:
Components are not marked. Reels are marked with type, value, tolerance, date code and quantity.
Components are not marked. Reels are marked with type, value, tolerance, date code and quantity.
Solvent resistance:
Solvent resistance:
The body protection is resistant to all normal industrial cleaning solvents suitable for printed circuits.
The body protection is resistant to all normal industrial cleaning solvents suitable for printed circuits.
Power Derating Data
Power Derating Data
% Of Rated PP ower
% Of Rated ower
100
100
Ordering Data
Ordering Data
Prefix
Prefix
Chip Type
Chip Type
HTC (High Temperature Chip)
HTC (High Temperature Chip)
TKC - HTC - 2512LF - 100R - F
TKC - HTC - 2512LF - 100R - F
Chip Size and Termination
Chip Size and Termination
1206LF = 100% Tin (pb-free) termination
50
50
1206LF = 100% Tin (pb-free) termination
2010LF
2010LF = 100% Tin (pb-free) termination
2512LF
2512LF = 100% Tin (pb-free) termination
Resistance Value (4 Digit Code)
Resistance Value (4 Digit Code)
Ex. 1R00 = 1; 100R = 100; 10K0 =10K; 1M50 = 1.5M
10
10
Ex. 1R00 = 1; 100R = 100; 10K0 =10K; 1M50 = 1.5M
Temperature in °C
Temperature in °C
150°
150°
200°
200°
Tolerance Code
Tolerance Code
J = ±5%; F = ±1%; D = ±0.5%
J = ±5%; F = ±1%; D = ±0.5%
For additional information or to discuss your specific requirements,
For additional information or to
Team using the contact details below.
please contact our Applications
discuss your specific requirements,
please contact our Applications Team using the contact details below.
Advanced Film Division
• 4222 South Staples Street • Corpus Christi Texas 78411 USA
Advanced Film
7900 • Facsimile:
South Staples
• Website: www.irctt.com
Telephone: 361 992
Division
• 4222
361 992 3377
Street • Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
HTC Series Issue July 2009
HTC Series Issue July 2009
General Note
TT electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT electronics’ own data and is considered accurate at time of going to print.
www.bitechnologies.com www.irctt.com www.welwyn-tt.com
© TT electronics plc
09. 11
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