型号
- 型号
- 关键词
| 型号 | TL16C550DIPFBG4 | TL16C550DIPFBRG4 | TL16C550DIZQSR | TL16C550DRHBG4 | TL16C550DZQSR |
|---|---|---|---|---|---|
| 描述 | UART Interface IC Asynch Comm Element | Asynchronous Communications Element With Autoflow Control 48-TQFP -40 to 85 | Asynchronous Communications Element With Autoflow Control 24-BGA MICROSTAR JUNIOR -40 to 85 | Asynchronous Communications Element With Autoflow Control 32-VQFN 0 to 70 | UART Interface IC Asynch Comm Element |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 零件包装代码 | QFP | QFP | BGA | QFN | BGA |
| 包装说明 | GREEN, PLASTIC, TQFP-48 | GREEN, PLASTIC, TQFP-48 | VFBGA, BGA24,5X5,20 | HVQCCN, LCC32,.2SQ,20 | VFBGA, BGA24,5X5,20 |
| 针数 | 48 | 48 | 24 | 32 | 24 |
| Reach Compliance Code | unknow | compli | compli | compli | compli |
| 其他特性 | ALSO OPERATES AT 2.5V/3.3V SUPPLY | ALSO OPERATES AT 2.5V/3.3V SUPPLY | ALSO OPERATES AT 2.5V/3.3V SUPPLY | ALSO OPERATES AT 2.5V/3.3V SUPPLY | ALSO OPERATES AT 2.5V/3.3V SUPPLY |
| 地址总线宽度 | 3 | 3 | 3 | 3 | 3 |
| 边界扫描 | NO | NO | NO | NO | NO |
| 最大时钟频率 | 24 MHz | 24 MHz | 24 MHz | 24 MHz | 24 MHz |
| 通信协议 | ASYNC, BIT | ASYNC, BIT | ASYNC, BIT | ASYNC, BIT | ASYNC, BIT |
| 最大数据传输速率 | 0.1875 MBps | 0.1875 MBps | 0.1875 MBps | 0.1875 MBps | 0.1875 MBps |
| 外部数据总线宽度 | 8 | 8 | 8 | 8 | 8 |
| JESD-30 代码 | S-PQFP-G48 | S-PQFP-G48 | S-PBGA-B24 | S-PQCC-N32 | S-PBGA-B24 |
| JESD-609代码 | e4 | e4 | e1 | e4 | e1 |
| 长度 | 7 mm | 7 mm | 3 mm | 5 mm | 3 mm |
| 低功率模式 | NO | NO | NO | NO | NO |
| 湿度敏感等级 | 2 | 2 | 1 | 2 | 1 |
| 串行 I/O 数 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 48 | 48 | 24 | 32 | 24 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 70 °C | 70 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | - | - |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TFQFP | TFQFP | VFBGA | HVQCCN | VFBGA |
| 封装等效代码 | TQFP48,.35SQ | TQFP48,.35SQ | BGA24,5X5,20 | LCC32,.2SQ,20 | BGA24,5X5,20 |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | FLATPACK, THIN PROFILE, FINE PITCH | FLATPACK, THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | 260 |
| 电源 | 2.5/5 V | 2.5/5 V | 2.5/5 V | 2.5/5 V | 2.5/5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.2 mm | 1.2 mm | 1 mm | 1 mm | 1 mm |
| 最大供电电压 | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Tin/Silver/Copper (Sn/Ag/Cu) | Nickel/Palladium/Gold (Ni/Pd/Au) | Tin/Silver/Copper (Sn/Ag/Cu) |
| 端子形式 | GULL WING | GULL WING | BALL | NO LEAD | BALL |
| 端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
| 端子位置 | QUAD | QUAD | BOTTOM | QUAD | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 7 mm | 7 mm | 3 mm | 5 mm | 3 mm |
| uPs/uCs/外围集成电路类型 | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
| 是否无铅 | 不含铅 | - | 不含铅 | - | 不含铅 |
| Brand Name | - | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Factory Lead Time | - | - | 1 week | 1 week | 1 week |
