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TLC2272AMFKB

DUAL OP-AMP, 1500 uV OFFSET-MAX, 2.25 MHz BAND WIDTH, CQCC20, CERAMIC, LCC-20

器件类别:模拟混合信号IC    放大器电路   

厂商名称:Rochester Electronics

厂商官网:https://www.rocelec.com/

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器件参数
参数名称
属性值
是否无铅
含铅
是否Rohs认证
不符合
厂商名称
Rochester Electronics
零件包装代码
QLCC
包装说明
QCCN,
针数
20
Reach Compliance Code
unknown
放大器类型
OPERATIONAL AMPLIFIER
最大平均偏置电流 (IIB)
0.0008 µA
标称共模抑制比
80 dB
最大输入失调电压
1500 µV
JESD-30 代码
S-CQCC-N20
长度
8.89 mm
湿度敏感等级
NOT SPECIFIED
负供电电压上限
-8 V
标称负供电电压 (Vsup)
-5 V
功能数量
2
端子数量
20
最高工作温度
125 °C
最低工作温度
-55 °C
封装主体材料
CERAMIC, METAL-SEALED COFIRED
封装代码
QCCN
封装形状
SQUARE
封装形式
CHIP CARRIER
峰值回流温度(摄氏度)
NOT SPECIFIED
座面最大高度
2.03 mm
标称压摆率
3.6 V/us
供电电压上限
8 V
标称供电电压 (Vsup)
5 V
表面贴装
YES
技术
CMOS
温度等级
MILITARY
端子面层
NOT SPECIFIED
端子形式
NO LEAD
端子节距
1.27 mm
端子位置
QUAD
处于峰值回流温度下的最长时间
NOT SPECIFIED
标称均一增益带宽
2250 kHz
宽度
8.89 mm
文档预览
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TLC227x, TLC227xA
Advanced LinCMOS RAIL TO RAIL
OPERATIONAL AMPLIFIERS
SLOS190G − FEBRUARY 1997 − REVISED MAY 2004
D
D
D
D
D
D
D
Output Swing Includes Both Supply Rails
Low Noise . . . 9 nV/√Hz Typ at f = 1 kHz
Low Input Bias Current . . . 1 pA Typ
Fully Specified for Both Single-Supply and
Split-Supply Operation
Common-Mode Input Voltage Range
Includes Negative Rail
High-Gain Bandwidth . . . 2.2 MHz Typ
High Slew Rate . . . 3.6 V/µs Typ
D
Low Input Offset Voltage
D
D
D
950
µV
Max at T
A
= 25°C
Macromodel Included
Performance Upgrades for the TS272,
TS274, TLC272, and TLC274
Available in Q-Temp Automotive
HighRel Automotive Applications
Configuration Control / Print Support
Qualification to Automotive Standards
description
The TLC2272 and TLC2274 are dual and
quadruple operational amplifiers from Texas
Instruments. Both devices exhibit rail-to-rail
output performance for increased dynamic range
in single- or split-supply applications. The
TLC227x family offers 2 MHz of bandwidth and
3 V/µs of slew rate for higher speed applications.
These devices offer comparable ac performance
while having better noise, input offset voltage, and
power dissipation than existing CMOS
operational amplifiers. The TLC227x has a noise
voltage of 9 nV/√Hz, two times lower than
competitive solutions.
MAXIMUM PEAK-TO-PEAK OUTPUT VOLTAGE
vs
SUPPLY VOLTAGE
V O(PP)
V(OPP) − Maximum Peak-to-Peak Output Voltage − V
16
TA = 25°C
14
12
IO =
±
50
µA
10
IO =
±
500
µA
8
The TLC227x, exhibiting high input impedance
and low noise, is excellent for small-signal
6
conditioning for high-impedance sources, such as
piezoelectric transducers. Because of the micro-
4
power dissipation levels, these devices work well
16
4
6
8
10
12
14
in hand-held monitoring and remote-sensing
|VDD
±
| − Supply Voltage − V
applications. In addition, the rail-to-rail output
feature, with single- or split-supplies, makes this
family a great choice when interfacing with analog-to-digital converters (ADCs). For precision applications, the
TLC227xA family is available with a maximum input offset voltage of 950
µV.
This family is fully characterized
at 5 V and
±
5 V.
The TLC2272/4 also makes great upgrades to the TLC272/4 or TS272/4 in standard designs. They offer
increased output dynamic range, lower noise voltage, and lower input offset voltage. This enhanced feature set
allows them to be used in a wider range of applications. For applications that require higher output drive and
wider input voltage range, see the TLV2432 and TLV2442 devices.
If the design requires single amplifiers, see the TLV2211/21/31 family. These devices are single rail-to-rail
operational amplifiers in the SOT-23 package. Their small size and low power consumption, make them ideal
for high density, battery-powered equipment.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Advanced LinCMOS is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
On products compliant to MIL PRF 38535, all parameters are tested
unless otherwise noted. On all other products, production
processing does not necessarily include testing of all parameters.
Copyright
2004, Texas Instruments Incorporated
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
1
SLOS190G − FEBRUARY 1997 − REVISED MAY 2004
TLC227x, TLC227xA
Advanced LinCMOS RAIL TO RAIL
OPERATIONAL AMPLIFIERS
TLC2272 AVAILABLE OPTIONS
PACKAGED DEVICES
TA
VIOmax
At 25°C
950
µV
2.5 mV
950
µV
2.5 mV
−40°C to 125°C
950
µV
2.5 mV
950
µV
2.5 mV
SMALL
OUTLINE†
(D)
TLC2272ACD
TLC2272CD
TLC2272AID
TLC2272ID
TLC2272AQD
TLC2272QD
TLC2272AMD
TLC2272MD
CERAMIC
LCC
(FK)
TLC2272AMFK
TLC2272MFK
CERAMIC
DIP
(JG)
TLC2272AMJG
TLC2272MJG
PLASTIC DIP
(P)
TLC2272ACP
TLC2272CP
TLC2272AIP
TLC2272IP
TLC2272AMP
TLC2272MP
TSSOP‡
(PW)
TLC2272ACPW
TLC2272CPW
TLC2272IPW
TLC2272AQPW
TLC2272QPW
CERAMIC
FLAT PACK
(U)
TLC2272AMU
TLC2272MU
0°C to 70°C
−55°C to 125°C
† The D packages are available taped and reeled. Add R suffix to the device type (e.g., TLC2272CDR).
‡ The PW package is available taped and reeled. Add R suffix to the device type (e.g., TLC2272PWR).
§ Chips are tested at 25°C.
TLC2274 AVAILABLE OPTIONS
PACKAGED DEVICES
TA
VIOmax
AT 25°C
950
µV
2.5 mV
950
µV
2.5 mV
−40°C to 125°C
950
µV
2.5 mV
950
µV
2.5 mV
SMALL
OUTLINE†
(D)
TLC2274ACD
TLC2274CD
TLC2274AID
TLC2274ID
TLC2274AQD
TLC2274QD
TLC2274AMD
TLC2274MD
CERAMIC
LCC
(FK)
TLC2274AMFK
TLC2274MFK
CERAMIC
DIP
(J)
TLC2274AMJ
TLC2274MJ
PLASTIC
DIP
(N)
TLC2274ACN
TLC2274CN
TLC2274AIN
TLC2274IN
TLC2274AMN
TLC2274MN
TSSOP‡
(PW)
TLC2274ACPW
TLC2274CPW
TLC2274AIPW
TLC2274IPW
CERAMIC
FLAT PACK
(W)
TLC2274AMW
TLC2274MW
0°C to 70°C
−55°C to 125°C
† The D packages are available taped and reeled. Add R suffix to device type (e.g., TLC2274CDR).
‡ The PW package is available taped and reeled.
§ Chips are tested at 25°C.
2
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
TLC227x, TLC227xA
Advanced LinCMOS RAIL TO RAIL
OPERATIONAL AMPLIFIERS
SLOS190G − FEBRUARY 1997 − REVISED MAY 2004
1OUT
1IN −
1IN +
V
DD −
/GND
1
2
3
4
8
7
6
5
V
DD +
2OUT
2IN −
2IN +
TLC2272
FK PACKAGE
(TOP VIEW)
1OUT
1IN −
1IN +
V
DD +
2IN +
2IN −
2OUT
1
2
3
4
5
6
7
14
13
12
11
10
9
8
4OUT
4IN −
4IN +
V
DD −
3IN +
3IN −
3OUT
1IN +
NC
V
DD +
NC
2IN +
4
5
6
7
8
3 2 1 20 19
18
17
16
15
14
9 10 11 12 13
1IN −
1OUT
NC
4OUT
4IN −
4IN +
NC
V
DD −
NC
3IN +
2IN −
2OUT
NC
3OUT
3IN −
TLC2272
D, JG, P, OR PW PACKAGE
(TOP VIEW)
TLC2274
D, J, N, PW, OR W PACKAGE
(TOP VIEW)
TLC2274
FK PACKAGE
(TOP VIEW)
NC
1OUT
NC
V
DD+
NC
NC
1 IN−
NC
1 IN+
NC
4
5
6
7
8
3 2 1 20 19
18
17
16
15
14
9 10 11 12 13
NC
2 OUT
NC
2 IN−
NC
TLC2272
U PACKAGE
(TOP VIEW)
NC − No internal connection
NC
V
DD−
/GND
NC
2 IN+
NC
NC
1 OUT
1 IN−
1 IN+
V
DD−
/GND
1
2
3
4
5
10
9
8
7
6
NC
V
DD+
2 OUT
2 IN−
2 IN+
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
3
SLOS190G − FEBRUARY 1997 − REVISED MAY 2004
TLC227x, TLC227xA
Advanced LinCMOS RAIL TO RAIL
OPERATIONAL AMPLIFIERS
equivalent schematic (each amplifier)
VDD +
Q3
Q6
Q9
Q12
Q14
Q16
IN +
C1
IN −
Q1
Q4
Q13
Q15
Q17
R5
OUT
D1
Q2
R3
Q5
R4
Q7
Q8
Q10
Q11
R1
R2
VDD−
ACTUAL DEVICE COMPONENT COUNT†
COMPONENT
Transistors
Resistors
Diodes
TLC2272
38
26
9
TLC2274
76
52
18
Capacitors
3
6
† Includes both amplifiers and all ESD, bias, and trim circuitry
4
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
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