Package Details
TLM2D3D6 Case
Mechanical Drawing
Lead Code:
1) Cathode
2) Anode
Part Marking:
Single Character Alpha/Numeric Code
Mounting Pad Geometry
(Dimensions in mm)
R0 (5-May 2011)
w w w. c e n t r a l s e m i . c o m
Package Details
TLM2D3D6 Case
Tape Dimensions and Orientation
(Dimensions in mm)
Tape Width: 8mm
Devices are taped in
accordance with
Electronic Industries
Association Standard
EIA-481-1-A
Direction of Unreeling
Packaging Base
7” Reel
=
8,000 pcs.
Reel Labeling Information
Each reel is labeled with the following information:
Central Part Number, Customer Part Number, Purchase Order Number,
Quantity, Lot Number, Date Code, Ship Date and Marking Code.
Reel Packing Information
Reel
Size
Reels per
Box
(Maximum)
9
18
40
108
Parts per
Box
(Maximum)
72,000
144,000
320,000
864,000
Box Dimensions
INCH
9x9x5
9x9x9
21x9x9
27x9x17
CM
23x23x13
23x23x23
53x23x23
69x23x43
Shipping Weight (Max.)
LB
3
6
13
34
KG
2
3
6
16
7”
Ordering Information
•
For devices taped and reeled on 7” reels, add TR suffix to part number.
•
All SMDs are available in small quantities for prototype and manual placement applications.
R0 (5-May 2011)
w w w. c e n t r a l s e m i . c o m
Material Composition Specification
TLM2D3D6 Case
Device average mass
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
144 µg
Fluctuation margin
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
+/-10%
Component
active device
bond wire
Material
doped Si
gold
Material
(%wt)
6.92%
0.28%
(µg)
10
0.4
Substance CAS No.
Si
Au
Cu
Sn
7440-21-3
7440-57-5
7440-50-8
7440-31-5
7440-66-6
7440-47-3
7440-22-4
Proprietary
Substance
(%wt)
6.92%
0.28%
27.23%
0.07%
0.07%
0.07%
1.94%
0.83%
52.97%
4.67%
1.56%
0.19%
2.93%
0.25%
0.01%
0.01%
(µg)
10
0.4
39.33
0.1
0.1
0.1
2.8
1.2
76.5
6.75
2.25
0.27
4.23
0.36
0.01
0.01
(ppm)
69,247
2,770
272,350
692
692
692
19,389
8,310
529,742
46,742
15,581
1,870
29,292
2,493
69
69
leadframe
Cu alloy
27.44%
39.63
Zn
Cr
Ag
die attach
silver epoxy
2.77%
4
epoxy resin
silica (fused) 60676-86-0
epoxy resin
29690-82-2
9003-35-4
1333-86-4
1309-42-8
7440-02-0
7440-05-3
7440-57-5
encapsulation*
EMC GREEN
62.32%
90
phenol resin
carbon black
metal
hydroxide
Ni
plating
Ni/Pd/Au
0.26%
0.38
Pd
Au
*EMC GREEN molding compound is Halogen-Free.
Disclaimer
The information provided in this Material Composition data sheet is, to the best of our knowledge, correct. However, there is no
guarantee to completeness or accuracy, as some information is derived from data sources outside the company.
R1 (3-June 2011)
w w w. c e n t r a l s e m i . c o m
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