D ts e t
aa h e
R c e t r lc r nc
o h se Ee to is
Ma u a t r dCo o e t
n fc u e
mp n n s
R c e tr b a d d c mp n ns ae
o h se rn e
o oet r
ma ua trd u ig ete dewaes
n fcue sn i r i/ fr
h
p rh s d f m te oiia s p l r
uc a e r
o h r n l u pi s
g
e
o R c e tr waes rce td f m
r o h se
fr e rae r
o
te oiia I. Al rce t n ae
h
r nl P
g
l e rai s r
o
d n wi tea p o a o teOC
o e t h p rv l f h
h
M.
P r aetse u igoiia fcoy
at r e td sn r n la tr
s
g
ts p o rmso R c e tr e eo e
e t rga
r o h se d v lp d
ts s lt n t g aa te p o u t
e t oui s o u rne
o
rd c
me t o e c e teOC d t s e t
es r x e d h
M aa h e.
Qu l yOv riw
ai
t
e ve
• IO- 0 1
S 90
•A 92 cr ct n
S 1 0 et ai
i
o
• Qu l e Ma ua trr Ls (
ai d
n fcues it QML MI- R -
) LP F
385
53
•C a sQ Mitr
ls
lay
i
•C a sVS a eL v l
ls
p c ee
• Qu l e S p l r Ls o D sr uos( L )
ai d u pi s it f it b tr QS D
e
i
•R c e trsacic l u pir oD A a d
o h se i
r ia s p l t L n
t
e
me t aln u t a dD A sa d r s
es lid sr n L tn ad .
y
R c e tr lcrnc , L i c mmi e t
o h se Ee t is L C s o
o
tdo
t
s p ligp o u t ta s t f c so r x e t-
u pyn rd cs h t ai y u tme e p ca
s
t n fr u lya daee u loto eoiial
i s o q ai n r q a t h s r n l
o
t
g
y
s p l db id sr ma ua trr.
u pi
e yn ut
y n fcues
T eoiia ma ua trr d ts e t c o a yn ti d c me t e e t tep r r n e
h r n l n fcue’ aa h e a c mp n ig hs o u n r cs h ef ma c
g
s
o
a ds e ic t n o teR c e tr n fcue v rino ti d vc . o h se Ee t n
n p c ai s f h o h se ma ua trd eso f hs e ie R c e tr lcr -
o
o
isg aa te tep r r n eo i s mio d co p o u t t teoiia OE s e ic -
c u rne s h ef ma c ft e c n u tr rd cs o h r n l M p c a
o
s
g
t n .T pc lv le aefr eee c p r o e o l. eti mii m o ma i m rt g
i s ‘y ia’ au s r o rfrn e up s s ny C r n nmu
o
a
r xmu ai s
n
ma b b s do p o u t h rceiain d sg , i lt n o s mpetsig
y e a e n rd c c aa tr t , e in smuai , r a l e t .
z o
o
n
© 2 1 R cetr l t n s LC Al i t R sre 0 1 2 1
0 3 ohs E cr i , L . lRg s eevd 7 1 0 3
e e oc
h
T l r m r, l s v iw wrcl . m
o e n oe p ae it w . e c o
a
e
s
o ec
TLV226x, TLV226xA
Advanced LinCMOS™ RAIL-TO-RAIL
OPERATIONAL AMPLIFIERS
SLOS186A – FEBRUARY 1997 – REVISED JULY 1999
D
D
D
D
D
D
Output Swing Includes Both Supply Rails
Low Noise . . . 12 nV/√Hz Typ at f = 1 kHz
Low Input Bias Current . . . 1 pA Typ
Fully Specified for Both Single-Supply and
Split-Supply Operation
Low Power . . . 500
µA
Max
Common-Mode Input Voltage Range
Includes Negative Rail
D
D
D
D
Low Input Offset Voltage
950
µV
Max at T
A
= 25°C (TLV226xA)
Wide Supply Voltage Range
2.7 V to 8 V
Macromodel Included
Available in Q-Temp Automotive
HighRel Automotive Applications
Configuration Control / Print Support
Qualification to Automotive Standards
HIGH-LEVEL OUTPUT VOLTAGE
vs
HIGH-LEVEL OUTPUT CURRENT
4
VDD = 3 V
3.5
description
The TLV2262 and TLV2264 are dual and quad low
voltage operational amplifiers from Texas Instru-
ments. Both devices exhibit rail-to-rail output
performance for increased dynamic range in
single or split supply applications. The TLV226x
family offers a compromise between the micro-
power TLV225x and the ac performance of the
TLC227x. It has low supply current for battery-
powered applications, while still having adequate
ac performance for applications that demand it.
This family is fully characterized at 3 V and 5 V and
is optimized for low-voltage applications. The
noise performance has been dramatically im-
proved over previous generations of CMOS
amplifiers. Figure 1 depicts the low level of noise
voltage for this CMOS amplifier, which has only
200
µA
(typ) of supply current per amplifier.
VOH – High-Level Output Voltage – V
3
2.5
TA = 125°C
2
TA = 25°C
1.5
1
0.5
TA = 85°C
TA = – 40°C
TA = – 55°C
0
The TLV226x, exhibiting high input impedance
0
500
1000
1500
2000
and low noise, are excellent for small-signal
| IOH | – High-Level Output Current –
µ
A
conditioning for high-impedance sources, such as
Figure 1
piezoelectric transducers. Because of the micro-
power dissipation levels combined with 3-V
operation, these devices work well in hand-held monitoring and remote-sensing applications. In addition, the
rail-to-rail output feature with single or split supplies makes this family a great choice when interfacing with
analog-to-digital converters (ADCs). For precision applications, the TLV226xA family is available and has a
maximum input offset voltage of 950
µV.
The TLV2262/4 also makes great upgrades to the TLV2332/4 in standard designs. They offer increased output
dynamic range, lower noise voltage and lower input offset voltage. This enhanced feature set allows them to
be used in a wider range of applications. For applications that require higher output drive and wider input voltage
range, see the TLV2432 and TLV2442 devices. If your design requires single amplifiers, please see the
TLV2211/21/31 family. These devices are single rail-to-rail operational amplifiers in the SOT-23 package. Their
small size and low power consumption, make them ideal for high density, battery-powered equipment.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Advanced LinCMOS is a trademark of Texas Instruments Incorporated.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303
•
DALLAS, TEXAS 75265
ÁÁ
ÁÁ
Copyright
©
1999, Texas Instruments Incorporated
On products compliant to MIL-PRF-38535, all parameters are tested
unless otherwise noted. On all other products, production
processing does not necessarily include testing of all parameters.
1
TLV226x, TLV226xA
Advanced LinCMOS™ RAIL-TO-RAIL
OPERATIONAL AMPLIFIERS
SLOS186A – FEBRUARY 1997 – REVISED JULY 1999
TLV2262 AVAILABLE OPTIONS
PACKAGED DEVICES
TA
VIOmax
AT 25°C
2.5 mV
950
µV
µ
2.5 mV
950
µV
µ
2.5 mV
950
µV
2.5 mV
SMALL
OUTLINE
(D)
TLV2262CD
TLV2262AID
TLV2262ID
TLV2262AQD
TLV2262QD
—
—
CHIP
CARRIER
(FK)
—
—
—
—
—
TLV2262AMFK
TLV2262MFK
CERAMIC
DIP
(JG)
—
—
—
—
—
TLV2262AMJG
TLV2262MJG
PLASTIC
DIP
(P)
TLV2262CP
TLV2262AIP
TLV2262IP
—
—
—
—
TSSOP
(PW)
TLV2262CPWLE
TLV2262AIPWLE
—
—
—
—
—
CERAMIC
FLATPACK
(U)
—
—
—
—
—
TLV2262AMU
TLV2262MU
0°C to 70°C
– 40°C to 85°C
– 40°C to 125°C
– 55°C to 125°C
† The D packages are available taped and reeled. Add R suffix to device type (e.g., TLV2262CDR).
‡ The PW package is available only left-end taped and reeled.
§ Chips are tested at 25°C.
TLV2264 AVAILABLE OPTIONS
PACKAGED DEVICES
TA
VIOmax
AT 25°C
950
µV
µ
2.5 mV
950
µV
µ
2.5 mV
950
µV
2.5 mV
SMALL
OUTLINE
(D)
TLV2264AID
TLV2264ID
TLV2264AQD
TLV2264QD
—
—
CHIP
CARRIER
(FK)
—
—
—
—
TLV2264AMFK
TLV2264MFK
CERAMIC
DIP
(J)
—
—
—
—
TLV2264AMJ
TLV2264MJ
PLASTIC
DIP
(N)
TLV2264AIN
TLV2264IN
—
—
—
—
TSSOP
(PW)
TLV2264AIPWLE
—
—
—
—
—
CERAMIC
FLATPACK
(W)
—
—
—
—
TLV2264AMW
TLV2264MW
– 40°C to
85°C
– 40°C to
125°C
– 55°C to
125°C
† The D packages are available taped and reeled. Add R suffix to device type (e.g., TLV2262IDR).
‡ The PW package is available only left-end taped and reeled.
§ Chips are tested at 25°C.
2
POST OFFICE BOX 655303
•
DALLAS, TEXAS 75265
TLV226x, TLV226xA
Advanced LinCMOS™ RAIL-TO-RAIL
OPERATIONAL AMPLIFIERS
SLOS186A – FEBRUARY 1997 – REVISED JULY 1999
TLV2262C, TLV2262AC
TLV2262I, TLV2262AI
TLV2262Q, TLV2262AQ
D, P, OR PW PACKAGE
(TOP VIEW)
TLV2264I, TLV2264AI
TLV2264Q, TLV2264AQ
D, N, OR PW PACKAGE
(TOP VIEW)
1OUT
1IN –
1IN +
V
DD –
/GND
1
2
3
4
8
7
6
5
V
DD +
2OUT
2IN –
2IN +
TLV2262M, TLV2262AM
JG PACKAGE
(TOP VIEW)
1OUT
1IN –
1IN +
V
DD +
2IN +
2IN –
2OUT
1
2
3
4
5
6
7
14
13
12
11
10
9
8
4OUT
4IN –
4IN +
V
DD –
/ GND
3IN +
3IN –
3OUT
1OUT
1IN –
1IN +
V
DD –
/GND
1
2
3
4
8
7
6
5
V
DD +
2OUT
2IN –
2IN +
TLV2264M, TLV2264AM
J OR W PACKAGE
(TOP VIEW)
TLV2662M, TLV2262AM
U PACKAGE
(TOP VIEW)
NC
1OUT
1IN –
1IN +
V
CC –
/GND
1
2
3
4
5
10
9
8
7
6
NC
V
CC
+
2OUT
2IN –
2IN +
1OUT
1IN –
1IN +
V
DD +
2IN +
2IN –
2OUT
1
2
3
4
5
6
7
14
13
12
11
10
9
8
4OUT
4IN –
4IN +
V
DD –
/ GND
3IN +
3IN –
3OUT
TLV2264M, TLV2264AM
FK PACKAGE
(TOP VIEW)
TLV2262M, TLV2262AM
FK PACKAGE
(TOP VIEW)
NC
1IN –
NC
1IN +
NC
4
5
6
7
8
3 2 1 20 19
18
17
16
15
14
9 10 11 12 13
NC
2OUT
NC
2IN –
NC
1IN +
NC
V
CC +
NC
2IN +
4
5
6
7
8
3 2 1 20 19
18
17
16
15
14
9 10 11 12 13
1IN –
1OUT
NC
4OUT
4IN –
4IN +
NC
V
CC –
/GND
NC
3IN +
NC
1OUT
NC
VDD+
NC
NC
VDD– /GND
NC
2IN+
NC
POST OFFICE BOX 655303
•
DALLAS, TEXAS 75265
2IN –
2OUT
NC
3OUT
3IN –
3
SLOS186A – FEBRUARY 1997 – REVISED JULY 1999
TLV226x, TLV226xA
Advanced LinCMOS™ RAIL-TO-RAIL
OPERATIONAL AMPLIFIERS
equivalent schematic (each amplifier)
VDD +
4
POST OFFICE BOX 655303
•
DALLAS, TEXAS 75265
Template Release Date: 7–11–94
Q3
Q6
Q9
Q12
Q14
Q16
IN +
R6
C1
OUT
IN –
Q1
Q4
R5
Q13
Q15
Q17
D1
Q2
R3
Q5
R4
Q7
Q8
Q10
Q11
R1
R2
VDD – / GND
ACTUAL DEVICE COMPONENT COUNT†
COMPONENT
Transistors
Resistors
Diodes
Capacitors
TLV2252
38
28
9
3
TLV2254
76
54
18
6
† Includes both amplifiers and all ESD, bias, and trim circuitry
