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TLV2460, TLV2461, TLV2462, TLV2463, TLV2464, TLV2465, TLV246xA
FAMILY OF LOW POWER RAIL TO RAIL INPUT/OUTPUT
OPERATIONAL AMPLIFIERS WITH SHUTDOWN
SLOS220J − JULY 1998 − REVISED FEBRUARY 2004
D
D
D
D
D
D
D
D
D
D
Rail-to-Rail Output Swing
Gain Bandwidth Product . . . 6.4 MHz
±
80 mA Output Drive Capability
Supply Current . . . 500
µA/channel
Input Offset Voltage . . . 100
µV
Input Noise Voltage . . . 11 nV/√Hz
Slew Rate . . . 1.6 V/µs
Micropower Shutdown Mode
(TLV2460/3/5) . . . 0.3
µA/Channel
Universal Operational Amplifier EVM
Available in Q-Temp Automotive
HighRel Automotive Applications
Configuration Control/Print Support
Qualification to Automotive Standards
TLV2460
DBV PACKAGE
(TOP VIEW)
OUT
GND
IN+
1
2
3
6
5
4
VDD+
SHDN
IN −
description
The TLV246x is a family of low-power rail-to-rail input/output operational amplifiers specifically designed for
portable applications. The input common-mode voltage range extends beyond the supply rails for maximum
dynamic range in low-voltage systems. The amplifier output has rail-to-rail performance with high-output-drive
capability, solving one of the limitations of older rail-to-rail input/output operational amplifiers. This rail-to-rail
dynamic range and high output drive make the TLV246x ideal for buffering analog-to-digital converters.
The operational amplifier has 6.4 MHz of bandwidth and 1.6 V/µs of slew rate with only 500
µA
of supply current,
providing good ac performance with low power consumption. Three members of the family offer a shutdown
terminal, which places the amplifier in an ultralow supply current mode (I
DD
= 0.3
µA/ch).
While in shutdown,
the operational-amplifier output is placed in a high-impedance state. DC applications are also well served with
an input noise voltage of 11 nV/√Hz and input offset voltage of 100
µV.
This family is available in the low-profile SOT23, MSOP, and TSSOP packages. The TLV2460 is the first
rail-to-rail input/output operational amplifier with shutdown available in the 6-pin SOT23, making it perfect for
high-density circuits. The family is specified over an expanded temperature range (T
A
= − 40°C to 125°C) for
use in industrial control and automotive systems, and over the military temperature range
(T
A
= −55°C to 125°C) for use in military systems.
SELECTION GUIDE
DEVICE
TLV246x(A)
TLV277x(A)
TLV247x(A)
TLV245x(A)
TLV225x(A)
TLV226x(A)
VDD
[V]
2.7−6
2.5−5.5
2.7−6
2.7−6
2.7−8
2.7−8
VIO
[µV]
150
360
250
20
200
300
IDD/ch
[µA]
550
1000
600
23
35
200
IIB
[pA]
1300
2
2.5
500
1
1
GBW
[MHz]
6.4
5.1
2.8
0.22
0.2
0.71
SLEW RATE
[V/µs]
1.6
10.5
1.5
0.11
0.12
0.55
Vn, 1 kHz
[nV/√Hz]
11
17
15
52
19
12
IO
[mA]
25
6
20
10
3
3
SHUTDOWN
Y
Y
Y
Y
—
—
RAIL-RAIL
I/O
O
I/O
I/O
—
—
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Copyright
1998−2004, Texas Instruments Incorporated
On products compliant to MIL PRF 38535, all parameters are tested
unless otherwise noted. On all other products, production
processing does not necessarily include testing of all parameters.
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1
SLOS220J − JULY 1998 − REVISED FEBRUARY 2004
TLV2460, TLV2461, TLV2462, TLV2463, TLV2464, TLV2465, TLV246xA
FAMILY OF LOW POWER RAIL TO RAIL INPUT/OUTPUT
OPERATIONAL AMPLIFIERS WITH SHUTDOWN
TLV2460C/I/AI and TLV2461C/I/AI AVAILABLE OPTIONS
TA
VIOmax
AT 25°C
2000
µV
2000
µV
−40°C to 125°C
1500
µV
SMALL OUTLINE
(D)
TLV2460CD
TLV2461CD
TLV2460ID
TLV2461ID
TLV2460AID
TLV2461AID
PACKAGED DEVICES
SOT-23†
SYMBOL
(DBV)
TLV2460CDBV
TLV2461CDBV
TLV2460IDBV
TLV2461IDBV
—
—
VAOC
VAPC
VAOI
VAPI
—
—
PLASTIC DIP
(P)
TLV2460CP
TLV2461CP
TLV2460IP
TLV2461IP
TLV2460AIP
TLV2461AIP
0°C to 70°C
† This package is available taped and reeled. To order this packaging option, add an R suffix to the part number (e.g., TLV2460CDR).
‡ Chip forms are tested at TA = 25°C only.
TLV2460M/AM/Q/AQ and TLV2461M/AM/Q/AQ AVAILABLE OPTIONS
PACKAGED DEVICES
TA
VIOmax
AT 25°C
SMALL
OUTLINE†
(D)
TLV2460QD
TLV2461QD
TLV2460AQD
TLV2461AQD
—
—
—
—
SMALL
OUTLINE†
(PW)
TLV2460QPW
TLV2461QPW
TLV2460AQPW
TLV2461AQPW
—
—
—
—
CERAMIC DIP
(JG)
—
—
—
—
TLV2460MJG
TLV2461MJG
TLV2460AMJG
TLV2461AMJG
CERAMIC
FLATPACK
(U)
—
—
—
—
TLV2460MU
TLV2461MU
TLV2460AMU
TLV2461AMU
CHIP CARRIER
(FK)
—
—
—
—
TLV2460MFK
TLV2461MFK
TLV2460AMFK
TLV2461AMFK
2000
µV
−40°C to 125°C
1500
µV
2000
µV
−55°C to 125°C
1500
µV
† This package is available taped and reeled. To order this packaging option, add an R suffix to the part number (e.g., TLV2460QDR).
TLV2462C/I/AI and TLV2463C/I/AI AVAILABLE OPTIONS
PACKAGED DEVICES
TA
VIOmax
AT 25°C
SMALL
OUTLINE†
(D)
TLV2462CD
TLV2463CD
TLV2462ID
TLV2463ID
TLV2462AID
TLV2463AID
MSOP
(DGK)
TLV2462CDGK
—
TLV2462IDGK
—
—
—
SYMBOL
xxTIAAI
xxTIAAJ
—
—
MSOP†
(DGS)
—
TLV2463CDGS
—
TLV2463IDGS
—
—
SYMBOL
—
xxTIAAK
—
xxTIAAL
—
—
PLASTIC DIP
(N)
—
TLV2463CN
—
TLV2463IN
—
TLV2463AIN
PLASTIC DIP
(P)
TLV2462CP
—
TLV2462IP
—
TLV2462AIP
—
0°C to 70°C
2000
µV
2000
µV
1500
µV
−40 C
−40°C to
125°C
† This package is available taped and reeled. To order this packaging option, add an R suffix to the part number (e.g., TLV2462CDR).
‡ Chip forms are tested at TA = 25°C only.
2
WWW.TI.COM
TLV2460, TLV2461, TLV2462, TLV2463, TLV2464, TLV2465, TLV246xA
FAMILY OF LOW POWER RAIL TO RAIL INPUT/OUTPUT
OPERATIONAL AMPLIFIERS WITH SHUTDOWN
SLOS220J − JULY 1998 − REVISED FEBRUARY 2004
TLV2462M/AM/Q/AQ and TLV2463M/AM/Q/AQ AVAILABLE OPTIONS
PACKAGED DEVICES
TA
VIOmax
AT 25°C
SMALL
OUTLINE†
(D)
TLV2462QD
TLV2463QD
TLV2462AQD
TLV2463AQD
—
—
—
—
SMALL
OUTLINE†
(PW)
TLV2462QPW
TLV2463QPW
TLV2462AQPW
TLV2463AQPW
—
—
—
—
CERAMIC DIP
(JG)
—
—
—
—
TLV2462MJG
—
TLV2462AMJG
—
CERAMIC
DIP
(J)
—
—
—
—
—
TLV2463MJ
—
TLV2463AMJ
CERAMIC
FLATPACK
(U)
—
—
—
—
TLV2462MU
TLV2462AMU
CHIP CAR-
RIER
(FK)
—
—
—
—
TLV2462MFK
TLV2463MFK
TLV2462AMFK
TLV2463AMFK
2000
µV
−40°C to 125°C
1500
µV
2000
µV
−55°C to 125°C
1500
µV
† This package is available taped and reeled. To order this packaging option, add an R suffix to the part number (e.g., TLV2462QDR).
TLV2464C/I/AI and TLV2465C/I/AI AVAILABLE OPTIONS
PACKAGED DEVICES
TA
VIOmax
AT 25°C
2000
µV
2000
µV
−40°C to 125°C
1500
µV
SMALL OUTLINE
(D)
TLV2464CD
TLV2465CD
TLV2464ID
TLV2465ID
TLV2464AID
TLV2465AID
PLASTIC DIP
(N)
TLV2464CN
TLV2465CN
TLV2464IN
TLV2465IN
TLV2464AIN
TLV2465AIN
TSSOP
(PW)
TLV2464CPW
TLV2465CPW
TLV2464IPW
TLV2465IPW
TLV2464AIPW
TLV2465AIPW
0°C to 70°C
† This package is available taped and reeled. To order this packaging option, add an R suffix to the part
number(e.g., TLV2464CDR).
‡ Chip forms are tested at TA = 25°C only.
TLV2464M/AM/Q/AQ and TLV2465M/AM/Q/AQ AVAILABLE OPTIONS
PACKAGED DEVICES
TA
VIOmax
AT 25°C
SMALL
OUTLINE†
(D)
TLV2464QD
TLV2465QD
TLV2464AQD
TLV2465AQD
—
—
—
—
SMALL
OUTLINE†
(PW)
TLV2464QPW
TLV2465QPW
TLV2464AQPW
TLV2465AQPW
—
—
—
—
CERAMIC DIP
(J)
—
—
—
—
TLV2464MJ
TLV2465MJ
TLV2464AMJ
TLV2465AMJ
CHIP CARRIER
(FK)
—
—
—
—
TLV2464MFK
TLV2465MFK
TLV2464AMFK
TLV2465AMFK
2000
µV
- 40°C to 125°C
1500
µV
2000
µV
−55°C to 125°C
1500
µV
† This package is available taped and reeled. To order this packaging option, add an R suffix to the part number
(e.g., TLV2464QDR).
WWW.TI.COM
3
SLOS220J − JULY 1998 − REVISED FEBRUARY 2004
TLV2460, TLV2461, TLV2462, TLV2463, TLV2464, TLV2465, TLV246xA
FAMILY OF LOW POWER RAIL TO RAIL INPUT/OUTPUT
OPERATIONAL AMPLIFIERS WITH SHUTDOWN
TLV246x PACKAGE PINOUTS
(1)
TLV2460
DBV PACKAGE
(TOP VIEW)
OUT
GND
IN+
1
2
3
6
5
4
VDD+
SHDN
IN −
OUT
GND
IN+
TLV2461
DBV PACKAGE
(TOP VIEW)
1
2
3
4
IN −
5
VDD+
TLV2460
D, P, JG, OR PW PACKAGE
(TOP VIEW)
NC
IN −
IN +
GND
1
2
3
4
8
7
6
5
SHDN
V
DD
+
OUT
NC
TLV2461
D, P, JG, OR PW PACKAGE
(TOP VIEW)
TLV2462
D, DGK, P, JG, OR PW PACKAGE
(TOP VIEW)
TLV2463
DGS PACKAGE
(TOP VIEW)
NC
IN −
IN +
GND
1
2
3
4
8
7
6
5
NC
V
DD
+
OUT
NC
1OUT
1IN −
1IN +
GND
1
2
3
4
8
7
6
5
V
DD
+
2OUT
2IN −
2IN+
1OUT
1IN −
1IN+
GND
1SHDN
1
2
3
4
5
10
9
8
7
6
V
DD
+
2OUT
2IN −
2IN+
2SHDN
TLV2463
D, N, J, OR PW PACKAGE
(TOP VIEW)
TLV2464
D, N, PWP, J, OR PW PACKAGE
(TOP VIEW)
TLV2465
D, N, PWP, J, OR PW PACKAGE
(TOP VIEW)
1OUT
1IN −
1IN+
GND
NC
1SHDN
NC
1
2
3
4
5
6
7
14
13
12
11
10
9
8
V
DD
+
2OUT
2IN −
2IN+
NC
2SHDN
NC
1OUT
1IN −
1IN+
V
DD
+
2IN+
2IN −
2OUT
1
2
3
4
5
6
7
14
13
12
11
10
9
8
4OUT
4IN −
4IN+
GND
3IN+
3IN −
3OUT
1OUT
1IN −
1IN+
V
DD
+
2IN+
2IN −
2OUT
1/2SHDN
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
4OUT
4IN −
4IN+
GND
3IN +
3IN−
3OUT
3/4SHDN
NC − No internal connection
(1) SOT−23 may or may not be indicated
TYPICAL PIN 1 INDICATORS
Pin 1
Printed or
Molded Dot
Pin 1
Stripe
Pin 1
Bevel Edges
Pin 1
Molded ”U” Shape
4
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