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TM248CBK32F-60

2MX32 FAST PAGE DRAM MODULE, 60ns, SMA72, SIMM-72

器件类别:存储    存储   

厂商名称:Texas Instruments(德州仪器)

厂商官网:http://www.ti.com.cn/

敬请期待
器件参数
参数名称
属性值
Brand Name
Texas Instruments
是否无铅
含铅
零件包装代码
SIMM
包装说明
SIMM, SSIM72
针数
72
Reach Compliance Code
unknown
ECCN代码
EAR99
访问模式
FAST PAGE
最长访问时间
60 ns
其他特性
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
I/O 类型
COMMON
JESD-30 代码
R-XSMA-N72
内存密度
67108864 bit
内存集成电路类型
FAST PAGE DRAM MODULE
内存宽度
32
功能数量
1
端口数量
1
端子数量
72
字数
2097152 words
字数代码
2000000
工作模式
ASYNCHRONOUS
最高工作温度
70 °C
最低工作温度
组织
2MX32
输出特性
3-STATE
封装主体材料
UNSPECIFIED
封装代码
SIMM
封装等效代码
SSIM72
封装形状
RECTANGULAR
封装形式
MICROELECTRONIC ASSEMBLY
电源
5 V
认证状态
Not Qualified
刷新周期
1024
座面最大高度
25.4 mm
自我刷新
NO
最大待机电流
0.004 A
最大压摆率
0.36 mA
最大供电电压 (Vsup)
5.5 V
最小供电电压 (Vsup)
4.5 V
标称供电电压 (Vsup)
5 V
表面贴装
NO
技术
CMOS
温度等级
COMMERCIAL
端子形式
NO LEAD
端子节距
1.27 mm
端子位置
SINGLE
Base Number Matches
1
参数对比
与TM248CBK32F-60相近的元器件有:TM124BBK32F-70、TM124BBK32F-60、TM124BBK32U-70、TM124BBK32U-80、TM248CBK32F-70、TM248CBK32F-80、TM248CBK32U-60、TM248CBK32U-80。描述及对比如下:
型号 TM248CBK32F-60 TM124BBK32F-70 TM124BBK32F-60 TM124BBK32U-70 TM124BBK32U-80 TM248CBK32F-70 TM248CBK32F-80 TM248CBK32U-60 TM248CBK32U-80
描述 2MX32 FAST PAGE DRAM MODULE, 60ns, SMA72, SIMM-72 1MX32 FAST PAGE DRAM MODULE, 70ns, SMA72, SIMM-72 1MX32 FAST PAGE DRAM MODULE, 60ns, SMA72, SIMM-72 1MX32 FAST PAGE DRAM MODULE, 70ns, SMA72, SIMM-72 1MX32 FAST PAGE DRAM MODULE, 80ns, SMA72, SIMM-72 2MX32 FAST PAGE DRAM MODULE, 70ns, SMA72, SIMM-72 2MX32 FAST PAGE DRAM MODULE, 80ns, SMA72, SIMM-72 2MX32 FAST PAGE DRAM MODULE, 60ns, SMA72, SIMM-72 2MX32 FAST PAGE DRAM MODULE, 80ns, SMA72, SIMM-72
零件包装代码 SIMM SIMM SIMM SIMM SIMM SIMM SIMM SIMM SIMM
包装说明 SIMM, SSIM72 SIMM, SSIM72 SIMM, SSIM72 SIMM, SSIM72 SIMM, SSIM72 SIMM, SSIM72 SIMM, SSIM72 SIMM, SSIM72 SIMM, SSIM72
针数 72 72 72 72 72 72 72 72 72
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown unknown
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
访问模式 FAST PAGE FAST PAGE FAST PAGE FAST PAGE FAST PAGE FAST PAGE FAST PAGE FAST PAGE FAST PAGE
最长访问时间 60 ns 70 ns 60 ns 70 ns 80 ns 70 ns 80 ns 60 ns 80 ns
其他特性 RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
I/O 类型 COMMON COMMON COMMON COMMON COMMON COMMON COMMON COMMON COMMON
JESD-30 代码 R-XSMA-N72 R-XSMA-N72 R-XSMA-N72 R-XSMA-N72 R-XSMA-N72 R-XSMA-N72 R-XSMA-N72 R-XSMA-N72 R-XSMA-N72
内存密度 67108864 bit 33554432 bit 33554432 bit 33554432 bit 33554432 bit 67108864 bit 67108864 bit 67108864 bit 67108864 bit
内存集成电路类型 FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE FAST PAGE DRAM MODULE
内存宽度 32 32 32 32 32 32 32 32 32
功能数量 1 1 1 1 1 1 1 1 1
端口数量 1 1 1 1 1 1 1 1 1
端子数量 72 72 72 72 72 72 72 72 72
字数 2097152 words 1048576 words 1048576 words 1048576 words 1048576 words 2097152 words 2097152 words 2097152 words 2097152 words
字数代码 2000000 1000000 1000000 1000000 1000000 2000000 2000000 2000000 2000000
工作模式 ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
最高工作温度 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
组织 2MX32 1MX32 1MX32 1MX32 1MX32 2MX32 2MX32 2MX32 2MX32
输出特性 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
封装主体材料 UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED
封装代码 SIMM SIMM SIMM SIMM SIMM SIMM SIMM SIMM SIMM
封装等效代码 SSIM72 SSIM72 SSIM72 SSIM72 SSIM72 SSIM72 SSIM72 SSIM72 SSIM72
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
电源 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
刷新周期 1024 1024 1024 1024 1024 1024 1024 1024 1024
座面最大高度 25.4 mm 25.4 mm 25.4 mm 25.4 mm 25.527 mm 25.4 mm 25.527 mm 25.4 mm 25.527 mm
自我刷新 NO NO NO NO NO NO NO NO NO
最大待机电流 0.004 A 0.002 A 0.002 A 0.002 A 0.002 A 0.004 A 0.004 A 0.004 A 0.004 A
最大压摆率 0.36 mA 0.16 mA 0.18 mA 0.16 mA 0.14 mA 0.32 mA 0.28 mA 0.36 mA 0.28 mA
最大供电电压 (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
标称供电电压 (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
表面贴装 NO NO NO NO NO NO NO NO NO
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
端子形式 NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD
端子节距 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm
端子位置 SINGLE SINGLE SINGLE SINGLE SINGLE SINGLE SINGLE SINGLE SINGLE
Base Number Matches 1 1 1 1 1 1 1 1 1
Brand Name Texas Instruments Texas Instruments Texas Instruments Texas Instruments - Texas Instruments - Texas Instruments -
是否无铅 含铅 含铅 含铅 含铅 - 含铅 - 含铅 -
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