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TMC1175AM7C20

ADC, Flash Method, 8-Bit, 1 Func, 1 Channel, Parallel, 8 Bits Access, CMOS, PDSO24,

器件类别:模拟混合信号IC    转换器   

厂商名称:Raytheon Company

厂商官网:https://www.raytheon.com/

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器件:TMC1175AM7C20

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器件参数
参数名称
属性值
是否Rohs认证
不符合
厂商名称
Raytheon Company
包装说明
SOP, SOP24,.3
Reach Compliance Code
unknow
最大模拟输入电压
2.6 V
最小模拟输入电压
0.6 V
转换器类型
ADC, FLASH METHOD
JESD-30 代码
R-PDSO-G24
JESD-609代码
e0
最大线性误差 (EL)
0.293%
模拟输入通道数量
1
位数
8
功能数量
1
端子数量
24
最高工作温度
75 °C
最低工作温度
-20 °C
输出位码
BINARY
输出格式
PARALLEL, 8 BITS
封装主体材料
PLASTIC/EPOXY
封装代码
SOP
封装等效代码
SOP24,.3
封装形状
RECTANGULAR
封装形式
SMALL OUTLINE
峰值回流温度(摄氏度)
NOT SPECIFIED
电源
5 V
认证状态
Not Qualified
采样速率
20 MHz
采样并保持/跟踪并保持
TRACK
最大压摆率
30 mA
标称供电电压
5 V
表面贴装
YES
技术
CMOS
温度等级
COMMERCIAL EXTENDED
端子面层
Tin/Lead (Sn/Pb)
端子形式
GULL WING
端子节距
1.27 mm
端子位置
DUAL
处于峰值回流温度下的最长时间
NOT SPECIFIED
参数对比
与TMC1175AM7C20相近的元器件有:TMC1175N2C20、TMC1175M7C30、TMC1175R3C20、TMC1175R3C30、TMC1175N2C40、TMC1175R3C40、TMC1175N2C30、TMC1175AN2C20。描述及对比如下:
型号 TMC1175AM7C20 TMC1175N2C20 TMC1175M7C30 TMC1175R3C20 TMC1175R3C30 TMC1175N2C40 TMC1175R3C40 TMC1175N2C30 TMC1175AN2C20
描述 ADC, Flash Method, 8-Bit, 1 Func, 1 Channel, Parallel, 8 Bits Access, CMOS, PDSO24, ADC, Proprietary Method, 8-Bit, 1 Func, Parallel, 8 Bits Access, CMOS, PDIP24, ADC, Proprietary Method, 8-Bit, 1 Func, Parallel, 8 Bits Access, CMOS, PDSO24, ADC, Proprietary Method, 8-Bit, 1 Func, Parallel, 8 Bits Access, CMOS, PQCC28, ADC, Proprietary Method, 8-Bit, 1 Func, Parallel, 8 Bits Access, CMOS, PQCC28, ADC, Proprietary Method, 8-Bit, 1 Func, Parallel, 8 Bits Access, CMOS, PDIP24, ADC, Proprietary Method, 8-Bit, 1 Func, Parallel, 8 Bits Access, CMOS, PQCC28, ADC, Proprietary Method, 8-Bit, 1 Func, Parallel, 8 Bits Access, CMOS, PDIP24, ADC, Flash Method, 8-Bit, 1 Func, 1 Channel, Parallel, 8 Bits Access, CMOS, PDIP24,
是否Rohs认证 不符合 不符合 不符合 不符合 不符合 不符合 不符合 不符合 不符合
Reach Compliance Code unknow unknown unknown unknown unknown unknown unknown unknown unknown
最大模拟输入电压 2.6 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 2.6 V
转换器类型 ADC, FLASH METHOD ADC, PROPRIETARY METHOD ADC, PROPRIETARY METHOD ADC, PROPRIETARY METHOD ADC, PROPRIETARY METHOD ADC, PROPRIETARY METHOD ADC, PROPRIETARY METHOD ADC, PROPRIETARY METHOD ADC, FLASH METHOD
JESD-30 代码 R-PDSO-G24 R-PDIP-T24 R-PDSO-G24 S-PQCC-J28 S-PQCC-J28 R-PDIP-T24 S-PQCC-J28 R-PDIP-T24 R-PDIP-T24
JESD-609代码 e0 e0 e0 e0 e0 e0 e0 e0 e0
最大线性误差 (EL) 0.293% 0.39% 0.39% 0.39% 0.39% 0.39% 0.39% 0.39% 0.293%
模拟输入通道数量 1 1 1 1 1 1 1 1 1
位数 8 8 8 8 8 8 8 8 8
功能数量 1 1 1 1 1 1 1 1 1
端子数量 24 24 24 28 28 24 28 24 24
最高工作温度 75 °C 75 °C 75 °C 75 °C 75 °C 75 °C 75 °C 75 °C 75 °C
最低工作温度 -20 °C -20 °C -20 °C -20 °C -20 °C -20 °C -20 °C -20 °C -20 °C
输出位码 BINARY BINARY BINARY BINARY BINARY BINARY BINARY BINARY BINARY
输出格式 PARALLEL, 8 BITS PARALLEL, 8 BITS PARALLEL, 8 BITS PARALLEL, 8 BITS PARALLEL, 8 BITS PARALLEL, 8 BITS PARALLEL, 8 BITS PARALLEL, 8 BITS PARALLEL, 8 BITS
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 SOP DIP SOP QCCJ QCCJ DIP QCCJ DIP DIP
封装等效代码 SOP24,.3 DIP24,.3 SOP24,.3 LDCC28,.5SQ LDCC28,.5SQ DIP24,.3 LDCC28,.5SQ DIP24,.3 DIP24,.3
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR SQUARE SQUARE RECTANGULAR SQUARE RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE IN-LINE SMALL OUTLINE CHIP CARRIER CHIP CARRIER IN-LINE CHIP CARRIER IN-LINE IN-LINE
电源 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
采样速率 20 MHz 20 MHz 30 MHz 20 MHz 30 MHz 40 MHz 40 MHz 30 MHz 20 MHz
采样并保持/跟踪并保持 TRACK TRACK TRACK TRACK TRACK TRACK TRACK TRACK TRACK
最大压摆率 30 mA 60 mA 70 mA 60 mA 70 mA 80 mA 80 mA 70 mA 30 mA
标称供电电压 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
表面贴装 YES NO YES YES YES NO YES NO NO
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 COMMERCIAL EXTENDED COMMERCIAL EXTENDED COMMERCIAL EXTENDED COMMERCIAL EXTENDED COMMERCIAL EXTENDED COMMERCIAL EXTENDED COMMERCIAL EXTENDED COMMERCIAL EXTENDED COMMERCIAL EXTENDED
端子面层 Tin/Lead (Sn/Pb) TIN LEAD Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) TIN LEAD Tin/Lead (Sn/Pb) TIN LEAD TIN LEAD
端子形式 GULL WING THROUGH-HOLE GULL WING J BEND J BEND THROUGH-HOLE J BEND THROUGH-HOLE THROUGH-HOLE
端子节距 1.27 mm 2.54 mm 1.27 mm 1.27 mm 1.27 mm 2.54 mm 1.27 mm 2.54 mm 2.54 mm
端子位置 DUAL DUAL DUAL QUAD QUAD DUAL QUAD DUAL DUAL
厂商名称 Raytheon Company - Raytheon Company Raytheon Company Raytheon Company - Raytheon Company - -
包装说明 SOP, SOP24,.3 DIP, DIP24,.3 SOP, SOP24,.3 QCCJ, LDCC28,.5SQ QCCJ, LDCC28,.5SQ DIP, DIP24,.3 QCCJ, LDCC28,.5SQ DIP, DIP24,.3 -
峰值回流温度(摄氏度) NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED - -
处于峰值回流温度下的最长时间 NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED - -
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器件捷径:
E0 E1 E2 E3 E4 E5 E6 E7 E8 E9 EA EB EC ED EE EF EG EH EI EJ EK EL EM EN EO EP EQ ER ES ET EU EV EW EX EY EZ F0 F1 F2 F3 F4 F5 F6 F7 F8 F9 FA FB FC FD FE FF FG FH FI FJ FK FL FM FN FO FP FQ FR FS FT FU FV FW FX FY FZ G0 G1 G2 G3 G4 G5 G6 G7 G8 G9 GA GB GC GD GE GF GG GH GI GJ GK GL GM GN GO GP GQ GR GS GT GU GV GW GX GZ H0 H1 H2 H3 H4 H5 H6 H7 H8 HA HB HC HD HE HF HG HH HI HJ HK HL HM HN HO HP HQ HR HS HT HU HV HW HX HY HZ I1 I2 I3 I4 I5 I6 I7 IA IB IC ID IE IF IG IH II IK IL IM IN IO IP IQ IR IS IT IU IV IW IX J0 J1 J2 J6 J7 JA JB JC JD JE JF JG JH JJ JK JL JM JN JP JQ JR JS JT JV JW JX JZ K0 K1 K2 K3 K4 K5 K6 K7 K8 K9 KA KB KC KD KE KF KG KH KI KJ KK KL KM KN KO KP KQ KR KS KT KU KV KW KX KY KZ
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