TMP87P808
Document Change Notification
The purpose of this notification is to inform customers about the launch of the Pb-free version of the
device. The introduction of a Pb-free replacement affects the datasheet. Please understand that this
notification is intended as a temporary substitute for a revision of the datasheet.
Changes to the datasheet may include the following, though not all of them may apply to this
particular device.
1. Part number
Example: TMPxxxxxxF
→
TMPxxxxxxFG
All references to the previous part number were left unchanged in body text. The new
part number is indicated on the prelims pages (cover page and this notification).
2. Package code and package dimensions
Example: LQFP100-P-1414-0.50C
→
LQFP100-P-1414-0.50F
All references to the previous package code and package dimensions were left unchanged
in body text. The new ones are indicated on the prelims pages.
3. Addition of notes on lead solderability
Now that the device is Pb-free, notes on lead solderability have been added.
4. RESTRICTIONS ON PRODUCT USE
The previous (obsolete) provision might be left unchanged on page 1 of body text. A new
replacement is included on the next page.
5. Publication date of the datasheet
The publication date at the lower right corner of the prelims pages applies to the new
device.
I
2008-03-06
TMP87P808
1. Part number
2. Package code and dimensions
Previous Part Number Previous Package Code
New Part Number
(in Body Text)
(in Body Text)
TMP87P808N
TMP87P808M
TMP87P808LN
TMP87P808LM
P-SDIP28-400-1.78
P-SOP28-450-1.27
P-SDIP28-400-1.78
P-SOP28-450-1.27
TMP87P808NG
TMP87P808MG
TMP87P808LNG
TMP87P808LMG
New Package Code
SDIP28-P-400-1.78
SOP28-P-450-1.27B
SDIP28-P-400-1.78
SOP28-P-450-1.27B
OTP
—
—
—
—
*
: For the dimensions of the new package, see the attached Package Dimensions diagram.
3. Addition of notes on lead solderability
The following solderability test is conducted on the new device.
Lead solderability of Pb-free devices (with the G suffix)
Test
Test Conditions
(1) Use of Lead (Pb)
·solder bath temperature
=
230°C
·dipping time
=
5 seconds
·the number of times
=
once
·use of R-type flux
(2) Use of Lead (Pb)-Free
·solder bath temperature
=
245°C
·dipping time
=
5 seconds
·the number of times
=
once
·use of R-type flux
Remark
Solderability
Leads with over 95% solder coverage
till lead forming are acceptable.
4. RESTRICTIONS ON PRODUCT USE
The following replaces the “RESTRICTIONS ON PRODUCT USE” on page 1 of body text.
RESTRICTIONS ON PRODUCT USE
20070701-EN
•
The information contained herein is subject to change without notice.
•
TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety
in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such
TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc.
•
The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer,
personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.).These
TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high
quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury
(“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship
instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical
instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his document shall
be made at the customer’s own risk.
•
The products described in this document shall not be used or embedded to any downstream products of which
manufacture, use and/or sale are prohibited under any applicable laws and regulations.
•
The information contained herein is presented only as a guide for the applications of our products. No responsibility
is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its
use. No license is granted by implication or otherwise under any patents or other rights of TOSHIBA or the third
parties.
•
Please contact your sales representative for product-by-product details in this document regarding RoHS
compatibility. Please use these products in this document in compliance with all applicable laws and regulations that
regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring
as a result of noncompliance with applicable laws and regulations.
•
For a discussion of how the reliability of microcontrollers can be predicted, please refer to Section 1.3 of the chapter
entitled Quality and Reliability Assurance/Handling Precautions.
II
2008-03-06
TMP87P808
5. Publication date of the datasheet
The publication date of this datasheet is printed at the lower right corner of this notification.
III
2008-03-06
TMP87P808
(Annex)
Package Dimensions
SDIP28-P-400-1.78
Unit: mm
IV
2008-03-06
