TNPU e3
Vishay Draloric
High Precision Thin Film Chip Resistors
± 0.05 %; ± 5 ppm/K
FEATURES
• Low temperature coefficient and tight
tolerances (± 0.05 %; ± 5 ppm/K)
• Superior moisture resistivity
≤
0.25 % (85 °C;
56 days; 85 % RH)
• Waste gas resistant
• AEC-Q200 qualified
• Compliant to RoHS directive 2002/95/EC
• Find out more about Vishay’s Automotive Grade Product
requirements at:
www.vishay.com/applications
TNPU e3 High Precision Thin Film Flat Chip Resistors
combine the proven reliability of TNPW e3 products with a
most advanced level of precision and stability. This unique
combination makes the product perfectly suited for all
applications with outstanding requirements towards size,
reliable precision and stability.
APPLICATIONS
•
•
•
•
•
•
Industrial equipment
Telecommunication
Medical equipment
Instrumentation
Test and measuring equipment
Automotive
STANDARD ELECTRICAL SPECIFICATIONS
TNPU0603 e3
Metric size
Resistance range
Resistance tolerance
Temperature coefficent
Climatic category (LCT/UCT/days)
Rated dissipation,
P
70 (1)
Operating voltage,
U
max.
AC/DC
Maximum permissible film temperature
Thermal resistance
(2)
Max. resistance change at
P
70
; |ΔR/R|
1000 h
8000 h
225 000 h
Insulation voltage:
U
ins
1 min
Continuous
FIT
observed
Weight/1000 pieces
Notes
voltage
P
x
R
. The power dissipation on the resistor generates a temperature rise against the local ambient, depending on the heat
flow support of the printed-circuit board (thermal resistance). The rated dissipation applies only if the permitted film temperature is not
exceeded.
(2)
Measuring conditions in accordance with EN 140401-801.
(1)
Rated
TNPU0805 e3
RR 2012M
100
Ω
to 332 kΩ
± 0.1 %; ± 0.05 %
± 10 ppm/K; ± 5 ppm/K
TNPU1206 e3
RR 3216M
100
Ω
to 511 kΩ
RR 1608M
100
Ω
to 100 kΩ
55/125/56
0.1 W
75 V
125 °C
550 K/W
55/125/56
0.125 W
150 V
125 °C
440 K/W
55/125/56
0.25 W
200 V
125 °C
220 K/W
≤
0.05 %
≤
0.10 %
≤
0.30 %
≤
0.05 %
≤
0.10 %
≤
0.30 %
≤
0.05 %
≤
0.10 %
≤
0.30 %
100 V
75 V
≤
0.1 x 10
-9
/h
2g
200 V
75 V
≤
0.1 x 10
-9
/h
5.5 g
300 V
75 V
≤
0.1 x 10
-9
/h
10 g
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Document Number: 28779
Revision: 12-Aug-10
TNPU e3
High Precision Thin Film Chip Resistors
± 0.05 %; ± 5 ppm/K
DIMENSIONS
SIZE
INCH METRIC
0603
0805
1206
1608
2012
3216
L
DIMENSIONS
in millimeters
W
H
T1
T2
Vishay Draloric
1.6 ± 0.10 0.85 ± 0.10 0.45 ± 0.10
2.0 ± 0.15 1.25 ± 0.15 0.45 ± 0.10
3.2 ± 0.15
1.6 ± 0.15
0.55 ± 0.10
0.3 ± 0.20
0.4 ± 0.20
0.5 ± 0.25
SOLDER PAD DIMENSIONS
in millimeters
SIZE
INCH METRIC
0603
0805
1206
1608
2012
3216
REFLOW SOLDERING
a
0.5
0.7
0.9
b
0.9
1.3
1.7
l
1.0
1.2
2.0
WAVE SOLDERING
a
0.9
0.9
1.1
b
0.9
1.3
1.7
l
1.0
1.3
2.3
TEMPERATURE COEFFICIENT AND RESISTANCE RANGE
TYPE
TNPU0603 e3
TCR
± 10 ppm/K
± 5 ppm/K
± 10 ppm/K
TNPU0805 e3
± 5 ppm/K
± 10 ppm/K
TNPU1206 e3
± 5 ppm/K
± 0.1 %
± 0.05 %
± 0.05 %
± 0.1 %
± 0.05 %
± 0.05 %
± 0.1 %
± 0.05 %
100
Ω
to 511 kΩ
100
Ω
to 332 kΩ
E24 to E192
TOLERANCE
± 0.05 %
100
Ω
to 100 kΩ
RESISTANCE VALUE
E-SERIES
PART NUMBER AND PRODUCT DESCRIPTION
Part Number: TNPU12061K32AZEA00
T
MODEL
N
P
U
VALUE
1
2
0
6
1
K
3
TCR
2
A
Z
E
A
0
0
SPECIAL
TOLERANCE
B
= ± 0.1 %
A
= ± 0.05 %
PACKAGING
(1)
EA
EN
TNPU0603
TNPU0805
TNPU1206
R
= Decimal
K
= Thousand
M
= Million
(4 digits)
Y
= ± 10 ppm/K
Z
= ± 5 ppm/K
Up to 2 digits
00
= Standard
Product Description: TNPU1206 1K32 0.05 % T-16 ET1 e3
TNPU1206
MODEL
TNPU0603
TNPU0805
TNPU1206
1K32
RESISTANCE
VALUE
Examples:
1K32
= 1320
Ω
0.05 %
TOLERANCE
±
0.05 %
±
0.1 %
T-16
TCR
T-13
= ± 10 ppm/K
T-16
= ± 5 ppm/K
ET1
PACKAGING
(1)
ET1
E52
e3
LEAD (Pb)-FREE
e3
= Pure tin
termination finish
Notes
•
Products can be ordered using either the PRODUCT DESCRIPTION or the PART NUMBER.
(1)
Please refer to PACKAGING table.
Document Number: 28779
Revision: 12-Aug-10
For technical questions, contact:
thinfilmchip@vishay.com
www.vishay.com
315
TNPU e3
Vishay Draloric
High Precision Thin Film Chip Resistors
± 0.05 %; ± 5 ppm/K
PACKAGING
MODEL
TAPE WIDTH
[mm]
PITCH
[mm]
REEL DIAMETER
[mm/inch]
PIECES PER
REEL
1000
8
4
180/7
5000
ET1
EA
PACKAGING
CODE FOR
PRODUCT
DESCRIPTION
E52
PACKAGING
CODE FOR PART
NUMBER
EN
Paper
TYPE OF
CARRIER TAPE
TNPU0603 e3
TNPU0805 e3
TNPU1206 e3
DESCRIPTION
Production is strictly controlled and follows an extensive
set of instructions established for reproducibility. A
homogeneous film of metal alloy is deposited on a high grade
AI
2
O
3
ceramic substrate and conditioned to achieve the
desired temperature coefficient. Specially designed inner
contacts are deposited on both sides. A special laser is used
to achieve the target value by smoothly fine trimming the
resistive layer without damaging the ceramics. A further
conditioning is applied in order to stabilize the trimming
result. The resistor elements are covered by a protective
coating designed for electrical, mechanical and climatic
protection. The terminations receive a final pure tin on nickel
plating. The result of the determined production is verified by
an extensive testing procedure on 100 % of the individual
chip resistors. Only accepted products are laid directly into
the tape in accordance with
IEC 60286-3
(3)
.
ASSEMBLY
The resistors are suitable for processing on automatic
SMD assembly systems. They are suitable for automatic
soldering using wave, reflow or vapour phase as shown in
IEC 61760-1.
The encapsulation is resistant to all cleaning
solvents commonly used in the electronics industry,
including alcohols, esters and aqueous solutions. The
suitability of conformal coatings, if applied, shall be qualified
by appropriate means to ensure the long-term stability of the
whole system.
The resistors are RoHS compliant, the pure tin plating
provides
compatibility
with
lead
(Pb)-free
and
lead-containing soldering processes. The immunity of the
plating against tin whisker growth has been proven under
extensive testing.
All products comply with the
GADSL
(1)
and the
CEFIC-EECA-EICTA
(2)
list of legal restrictions on
hazardous substances. This includes full compliance with
the following directives:
• 2000/53/EC End of Vehicle life Directive (ELV) and
Annex II (ELV II)
• 2002/95/EC Restriction of the
Substances Directive (RoHS)
use
of
Hazardous
• 2002/96/EC Waste Electrical and Electronic Equipment
Directive (WEEE)
Solderability is specified for 2 years after production or
re-qualification. The permitted storage time is 20 years.
Notes
(1)
(2)
Global Automotive Declarable Substance List, see
www.gadsl.org.
CEFIC (European Chemical Industry Council), EECA (European Electronic Component Manufacturers Association), EICTA (European trade
organisation representing the information and communications technology and consumer electronics), see
www.eicta.org
→
issue
→
environment policy
→
chemicals
→
chemicals for electronics.
The quoted IEC standards are also released as EN standards with the same number and identical contents.
(3)
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316
For technical questions, contact:
thinfilmchip@vishay.com
Document Number: 28779
Revision: 12-Aug-10
TNPU e3
High Precision Thin Film Chip Resistors
± 0.05 %; ± 5 ppm/K
Vishay Draloric
Non-Linearity A
3
in dB
110
100
90
80
70
60
40
100
TNPU1206 e3
TNPU0805 e3
TNPU0603 e3
Current Noise in
µV/V
1
TNPU0805
e3
TNPU0603
e3
0.1
TNPU1206
e3
1K
10K
Non-Linearity
100K
1M
Resistance Value in
Ω
0.01
100
1K
10K
Current Noise
100K
1M
Resistance Value in
Ω
Rated Power in
%
120
100
80
60
40
20
0
- 55
- 25
0
25
50
70
75
100
125
150 175
Derating
Ambient Temperature in °C
TEST AND REQUIREMENTS
All tests are carried out in accordance with the following
specifications:
EN 60115-1, generic specification (includes tests)
EN 140 400, sectional specification (includes schedule for
qualification approval)
EN 140 401-801, detail specification (includes schedule for
conformance inspection)
The following table contains only the most important tests.
For the full test schedule refer to the documents listed above.
The testing also covers most of the requirements specified
by EIA/IS-703 and JIS-C-5202. The tests are carried out in
accordance with IEC 60068 and under standard atmospheric
conditions in accordance with IEC 60068-1, 5.3. Climatic
category LCT/UCT/56 (rated temperature range: Lower
category temperature, upper category temperature; damp
heat, long term, 56 days) is valid. Unless otherwise specified
Document Number: 28779
Revision: 12-Aug-10
the following values apply:
Temperature: 15 °C to 35 °C
Relative humidity: 45 % to 75 %
Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar).
The components are mounted for testing on boards in
accordance with EN 60115-1, 4.31 unless otherwise
specified. The parameters stated in the Test Procedures and
Requirements table are based on the required tests and
permitted limits of EN 140 401-801. However, some
additional tests and a number of improvements against those
minimum requirements have been included.
For technical questions, contact:
thinfilmchip@vishay.com
www.vishay.com
317
TNPU e3
Vishay Draloric
High Precision Thin Film Chip Resistors
± 0.05 %; ± 5 ppm/K
TEST PROCEDURES AND REQUIREMENTS
EN 60115-1
CLAUSE
IEC 60068-2
TEST METHOD
TEST
PROCEDURE
Stability for product types:
TNPU0603 e3
TNPU0805 e3
TNPU1206 e3
4.5
4.8.4.2
-
-
Resistance
Temperature
coefficient
At (20/- 55/20)
°C
and
(20/125/20) °C
U
=
P
70
x
R
or
U
=
U
max.
; whichever is the
less severe;
4.25.1
-
Endurance at
70
°C
1.5 h “ON”; 0.5 h “OFF”;
70 °C; 1000 h
70
°C;
8000 h
Endurance at
upper
category
temperature
Damp heat,
steady state
Climatic
sequence:
2 (Ba)
30 (Db)
1 (Aa)
13 (M)
Dry heat
Damp heat,
cyclic
Cold
Low air
pressure
Damp heat,
cyclic
UCT; 16 h
55 °C; 24 h; > 90 % RH;
1 cycle
LCT; 2 h
± (0.1 %
R
+ 0.02
Ω)
8.5 kPa; 2 h; 25 ± 10 °C
55 °C; 5 days;
> 95 to 100 % RH; 5 cycles
U
=
4.23.7
-
D.c. load
P
70
x
R
≤
U
max.
; 1 min
LCT = - 55 °C
UCT = 125 °C
- 55 °C; 2 h
30 min at LCT and
30 min at UCT;
LCT = - 55 °C; UCT = 125 °C;
1000 cycles
U
= 2.5 x
P
70
x
R
or
U
= 2 x
U
max.
; whichever is
the less severe; 5 s
± (0.05 %
R
+ 0.01
Ω)
± (0.05 %
R
+ 0.01
Ω)
± (0.1 %
R
+ 0.02
Ω)
± 0.1 %; ± 0.05 %
± 10 ppm/K; ± 5 ppm/K
REQUIREMENTS
PERMISSIBLE CHANGE
4.25.3
-
125 °C; 1000 h
± (0.05 %
R
+ 0.01
Ω)
4.24
78 (Cab)
(40 ± 2) °C; 56 days;
(93 ± 3) % RH
± (0.1 %
R
+ 0.01
Ω)
4.23
4.23.2
4.23.3
4.23.4
4.23.5
4.23.6
30 (Db)
-
1 (Aa)
Cold
Rapid change
of
temperature
4.19
14 (Na)
± (0.1 %
R
+ 0.01
Ω)
4.13
-
Short time
overload
± (0.05 %
R
+ 0.01
Ω)
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318
For technical questions, contact:
thinfilmchip@vishay.com
Document Number: 28779
Revision: 12-Aug-10
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