Fixed Gain 3.2 W Mono Class-D with Integrated DAC Noise Filter 9-DSBGA -40 to 85
器件标准:
敬请期待型号 | TPA2039D1YFFT | TPA2039D1YFFR |
---|---|---|
描述 | Fixed Gain 3.2 W Mono Class-D with Integrated DAC Noise Filter 9-DSBGA -40 to 85 | Fixed Gain 3.2 W Mono Class-D with Integrated DAC Noise Filter 9-DSBGA -40 to 85 |
Brand Name | Texas Instruments | Texas Instruments |
是否无铅 | 不含铅 | 不含铅 |
是否Rohs认证 | 符合 | 符合 |
零件包装代码 | BGA | BGA |
包装说明 | VFBGA, BGA9,3X3,16 | VFBGA, BGA9,3X3,16 |
针数 | 9 | 9 |
Reach Compliance Code | compli | compli |
ECCN代码 | EAR99 | EAR99 |
Factory Lead Time | 6 weeks | 6 weeks |
标称带宽 | 20 kHz | 20 kHz |
商用集成电路类型 | AUDIO AMPLIFIER | AUDIO AMPLIFIER |
JESD-30 代码 | S-XBGA-B9 | S-XBGA-B9 |
JESD-609代码 | e1 | e1 |
长度 | 1.505 mm | 1.505 mm |
湿度敏感等级 | 1 | 1 |
信道数量 | 1 | 1 |
功能数量 | 1 | 1 |
端子数量 | 9 | 9 |
最高工作温度 | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C |
标称输出功率 | 3.24 W | 3.24 W |
封装主体材料 | UNSPECIFIED | UNSPECIFIED |
封装代码 | VFBGA | VFBGA |
封装等效代码 | BGA9,3X3,16 | BGA9,3X3,16 |
封装形状 | SQUARE | SQUARE |
封装形式 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
电源 | 3/5 V | 3/5 V |
认证状态 | Not Qualified | Not Qualified |
座面最大高度 | 0.625 mm | 0.625 mm |
最大压摆率 | 2.5 mA | 2.5 mA |
最大供电电压 (Vsup) | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 2.5 V | 2.5 V |
表面贴装 | YES | YES |
温度等级 | INDUSTRIAL | INDUSTRIAL |
端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Silver/Copper (Sn/Ag/Cu) |
端子形式 | BALL | BALL |
端子节距 | 0.4 mm | 0.4 mm |
端子位置 | BOTTOM | BOTTOM |
宽度 | 1.505 mm | 1.505 mm |
Base Number Matches | 1 | 1 |