型号
- 型号
- 关键词
150-mW Stereo Headphone Audio Amplifier, Pin Compatible with LM4880 and LM4881 8-SOIC -40 to 85
器件标准：
| 型号 | TPA6111A2DRG4 | TPA6111A2D | TPA6111A2DG4 | ATS-03E-199-C2-R0 | TPA6111A2DGNRG4 | TPA6111A2DGNG4 |
|---|---|---|---|---|---|---|
| 描述 | 150-mW Stereo Headphone Audio Amplifier, Pin Compatible with LM4880 and LM4881 8-SOIC -40 to 85 | 150-mW Stereo Headphone Audio Amplifier, Pin Compatible with LM4880 and LM4881 8-SOIC -40 to 85 | 150-mW Stereo Headphone Audio Amplifier, Pin Compatible with LM4880 and LM4881 8-SOIC -40 to 85 | Heat Sink Assembly | 150-mW Stereo Headphone Audio Amplifier, Pin Compatible with LM4880 and LM4881 8-MSOP-PowerPAD -40 to 85 | 150-mW Stereo Headphone Audio Amplifier, Pin Compatible with LM4880 and LM4881 8-MSOP-PowerPAD -40 to 85 |
| Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | - | Texas Instruments | Texas Instruments |
| 是否无铅 | 不含铅 | 不含铅 | - | - | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | - | 符合 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 零件包装代码 | SOIC | SOIC | SOIC | - | MSOP | MSOP |
| 包装说明 | SOP, SOP8,.25 | SOIC-8 | SOP, SOP8,.25 | - | HTSSOP, TSSOP8,.19 | HTSSOP, TSSOP8,.19 |
| 针数 | 8 | 8 | 8 | - | 8 | 8 |
| Reach Compliance Code | compli | compliant | compli | - | compli | compli |
| ECCN代码 | EAR99 | EAR99 | EAR99 | - | EAR99 | EAR99 |
| Factory Lead Time | 12 weeks | 1 week | - | - | 8 weeks | 1 week |
| 标称带宽 | 20 kHz | 20 kHz | 20 kHz | - | 20 kHz | 20 kHz |
| 商用集成电路类型 | AUDIO AMPLIFIER | AUDIO AMPLIFIER | AUDIO AMPLIFIER | - | AUDIO AMPLIFIER | AUDIO AMPLIFIER |
| 增益 | 20 dB | 20 dB | 20 dB | - | 32 dB | 20 dB |
| 谐波失真 | 0.1% | 0.1% | 0.1% | - | 0.1% | 0.1% |
| JESD-30 代码 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | - | S-PDSO-G8 | S-PDSO-G8 |
| JESD-609代码 | e4 | e4 | e4 | - | e4 | e4 |
| 长度 | 4.9 mm | 4.9 mm | 4.9 mm | - | 3 mm | 3 mm |
| 湿度敏感等级 | 1 | 1 | 1 | - | 1 | 1 |
| 信道数量 | 2 | 2 | 2 | - | 2 | 2 |
| 功能数量 | 1 | 1 | 1 | - | 1 | 1 |
| 端子数量 | 8 | 8 | 8 | - | 8 | 8 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | - | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | - | -40 °C | -40 °C |
| 标称输出功率 | 0.15 W | 0.15 W | 0.15 W | - | 0.15 W | 0.15 W |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | SOP | SOP | - | HTSSOP | HTSSOP |
| 封装等效代码 | SOP8,.25 | SOP8,.25 | SOP8,.25 | - | TSSOP8,.19 | TSSOP8,.19 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | SQUARE | SQUARE |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | - | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | - | 260 | 260 |
| 电源 | 3.3/5 V | 3.3/5 V | 3.3/5 V | - | 3.3/5 V | 3.3/5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified |
| 座面最大高度 | 1.75 mm | 1.75 mm | 1.75 mm | - | 1.1 mm | 1.1 mm |
| 最大压摆率 | 3.2 mA | 3.2 mA | 3.2 mA | - | 3.2 mA | 3.2 mA |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | - | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 2.5 V | 2.5 V | 2.5 V | - | 2.5 V | 2.5 V |
| 表面贴装 | YES | YES | YES | - | YES | YES |
| 技术 | CMOS | CMOS | CMOS | - | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | - | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | GULL WING | GULL WING | GULL WING | - | GULL WING | GULL WING |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | - | 0.65 mm | 0.65 mm |
| 端子位置 | DUAL | DUAL | DUAL | - | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 3.9 mm | 3.9 mm | 3.9 mm | - | 3 mm | 3 mm |
