型号
- 型号
- 关键词
| 型号 | TPS2206ADAPG4 | TPS2206ADBRG4 | TPS2206ADBG4 | TPS2204APWPG4 |
|---|---|---|---|---|
| 描述 | Switch ICs - Various 1A Dual-Slot PC Card Pwr Sw | Switch ICs - Various PC Card Power-Ifc Switch | Switch ICs - Various 1A Dual-Slot PC Card Pwr Sw | Switch ICs - Various 1A Dual-Slot PC Card Pwr Sw |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 零件包装代码 | TSSOP | SSOP | SSOP | TSSOP |
| 包装说明 | HTSSOP, TSSOP32,.3 | SSOP, SSOP30,.3 | SSOP, SSOP30,.3 | HTSSOP, TSSOP24,.25 |
| 针数 | 32 | 30 | 30 | 24 |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 |
| 其他特性 | ALSO REQUIRES A SUPPLY OF 3 TO 5.5V & 7 TO 13.5V | ALSO REQUIRES A SUPPLY OF 3 TO 5.5V & 7 TO 13.5V | ALSO REQUIRES A SUPPLY OF 3 TO 5.5V & 7 TO 13.5V | ALSO REQUIRES A SUPPLY OF 3 TO 5.5V & 7 TO 13.5V |
| 可调阈值 | NO | NO | NO | NO |
| 模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT |
| JESD-30 代码 | R-PDSO-G32 | R-PDSO-G30 | R-PDSO-G30 | R-PDSO-G24 |
| JESD-609代码 | e4 | e4 | e4 | e4 |
| 长度 | 11 mm | 10.2 mm | 10.2 mm | 7.8 mm |
| 湿度敏感等级 | 3 | 1 | 1 | 2 |
| 信道数量 | 3 | 3 | 3 | 3 |
| 功能数量 | 1 | 1 | 1 | 1 |
| 端子数量 | 32 | 30 | 30 | 24 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | HTSSOP | SSOP | SSOP | HTSSOP |
| 封装等效代码 | TSSOP32,.3 | SSOP30,.3 | SSOP30,.3 | TSSOP24,.25 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 |
| 电源 | 3.3,5,12 V | 3.3,5,12 V | 3.3,5,12 V | 3.3,5,12 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.2 mm | 2 mm | 2 mm | 1.2 mm |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 6.1 mm | 5.3 mm | 5.3 mm | 4.4 mm |
ARM技术
FPGA/CPLD
stm32/stm8
单片机
嵌入式系统
模拟电子
