Integrated and Configurable Power Management IC (PMIC) with 2 Buck Controllers and 1 LDO 20-VQFN -40 to 85
器件标准:
敬请期待型号 | TPS75003RHLT | TPS75003RHLR | TPS75003RHLRG4 | TPS75003RHLTG4 |
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描述 | Integrated and Configurable Power Management IC (PMIC) with 2 Buck Controllers and 1 LDO 20-VQFN -40 to 85 | Integrated and Configurable Power Management IC (PMIC) with 2 Buck Controllers and 1 LDO 20-VQFN -40 to 85 | Integrated and Configurable Power Management IC (PMIC) with 2 Buck Controllers and 1 LDO 20-VQFN -40 to 85 | Integrated and Configurable Power Management IC (PMIC) with 2 Buck Controllers and 1 LDO 20-VQFN -40 to 85 |
Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 |
厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
零件包装代码 | QFN | QFN | QFN | QFN |
包装说明 | QFN-20 | QFN-20 | HVQCCN, LCC20/24,.14X.18,20 | HVQCCN, LCC20/24,.14X.18,20 |
针数 | 20 | 20 | 20 | 20 |
Reach Compliance Code | compliant | compliant | compli | compli |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 |
Factory Lead Time | 1 week | 1 week | 6 weeks | 1 week |
可调阈值 | YES | YES | YES | YES |
模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT |
JESD-30 代码 | R-PQCC-N20 | R-PQCC-N20 | R-PQCC-N20 | R-PQCC-N20 |
JESD-609代码 | e4 | e4 | e4 | e4 |
长度 | 4.5 mm | 4.5 mm | 4.5 mm | 4.5 mm |
湿度敏感等级 | 1 | 1 | 1 | 1 |
信道数量 | 3 | 3 | 3 | 3 |
功能数量 | 1 | 1 | 1 | 1 |
端子数量 | 20 | 20 | 20 | 20 |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C |
最大输出电流 | 3 A | 3 A | 3 A | 3 A |
最大输出电压 | 6.25 V | 6.25 V | 6.25 V | 6.25 V |
最小输出电压 | 1 V | 1 V | 1 V | 1 V |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | HVQCCN | HVQCCN | HVQCCN | HVQCCN |
封装等效代码 | LCC20/24,.14X.18,20 | LCC20/24,.14X.18,20 | LCC20/24,.14X.18,20 | LCC20/24,.14X.18,20 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度) | 260 | 260 | 260 | 260 |
电源 | 2.5/6 V | 3 V | 3 V | 2.5/6 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 0.9 mm | 0.9 mm | 1 mm | 1 mm |
最大供电电流 (Isup) | 0.15 mA | 0.15 mA | 0.15 mA | 0.15 mA |
最大供电电压 (Vsup) | 6.5 V | 6.5 V | 6.5 V | 6.5 V |
最小供电电压 (Vsup) | 2.2 V | 2.2 V | 2.2 V | 2.2 V |
标称供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V |
表面贴装 | YES | YES | YES | YES |
最大切换频率 | 300 kHz | 300 kHz | 300 kHz | 300 kHz |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
端子位置 | QUAD | QUAD | QUAD | QUAD |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 3.5 mm | 3.5 mm | 3.5 mm | 3.5 mm |