POLYMER, TANTALUM
AND NIOBIUM OXIDE
CAPACITORS
www.avx.com
Version 18.9
Technological Leadership in Tantalum and Niobium
Contents
Introduction to AVX Solid Electrolytics Portfolio
.............................................2-3
SECTION 1: SOLID TANTALUM &
NIOBIUM OXIDE CHIP CAPACITORS
Tantalum and Niobium Oxide Products Introduction and Road Map............4-5
SECTION 2: SOLID CONDUCTIVE POLYMER
ELECTROLYTIC CHIP CAPACITORS
TCJ Series
–
Standard and Low Profile - J-Lead ......................................198-208
TCM Series
–
Multianode Ultra Low ESR - J-Lead .....................................209-212
TCN Series
–
High CV/cc - Undertab .........................................................213-218
J-CAP
TM
Series –
Highest Joules/cc - Undertab..........................................219-226
F38 Series
–
Miniature - Undertab ...............................................................227-230
TCQ Series
–
Automotive - J-Lead ..............................................................231-234
TCR Series
–
Professional Grade - J-Leads ................................................235-238
TCH Low ESR Hermetic Series
–
SMD Hermetic Chip..............................239-243
Resin Molded Solid Tantalum Chip, J-Lead
TAJ Series
–
Standard & Low Profile .................................................................6-17
TAJ Series
– Automotive Product Range ........................................................18-24
F92 Series
–
Low Profile...................................................................................25-29
F93 Series
........................................................................................................30-34
F93-BE Series
.................................................................................................35-38
F93-AJ6 Series
–
Automotive Product Range .................................................39-43
SECTION 3: LEADED TANTALUM
Introduction
.........................................................................................................244
Dipped Radial Capacitors
..................................................................................245
Dipped Radial
TAP/TEP Series Wire Form Outline..................................................................245
TAP Series ................................................................................................246-248
TEP Series ................................................................................................249-251
TAP/TEP Series Tape & Reel....................................................................252-253
High CV Resin Molded Solid Tantalum Chip
TLJ Series
–
J-Lead ........................................................................................44-49
TLN Series
–
Undertab ....................................................................................50-53
TLN PulseCap
TM
Series
–
High Capacitance - Undertab .............................54-57
F98 Series
–
Undertab......................................................................................58-61
F98-AS1 Series
–
Fused Tantalum Chip - Undertab .......................................62-64
Low ESR Resin Molded Solid Tantalum Chip, J-Lead
TPS Series
–
Standard & Low Profile..............................................................65-77
TPS Series
–
Automotive Product Range ........................................................78-85
F91 Series
........................................................................................................86-89
F91-AJ6 Series
–
Automotive Product Range .................................................90-92
TPM Series
–
Multianode, Ultra Low ESR .......................................................93-97
SECTION 4: TECHNICAL SUMMARY AND
APPLICATION GUIDELINES
Introduction..................................................................................................254-255
Section 1:
Electrical Characteristics and Explanation of Terms .................256-260
Section 2:
A.C. Operation, Ripple Voltage and Ripple Current ..................261-263
Section 3:
Reliability and Calculation of Failure Rate .................................264-266
Section 4:
Application Guidelines for Tantalum and OxiCap
®
Capacitors .........267
Section 5:
Terminations ......................................................................................268
Section 6:
Mechanical and Thermal Properties of Capacitors ...................269-270
Section 7:
Epoxy Flammability ...........................................................................270
Section 8:
Qualification Approval Status ............................................................270
Product Safety and Environmental Information Data..............................271-274
Tantalum & Niobium Oxide Capacitors (excluding F-Series)
–
Tape & Reel Packaging ............................................................................275-278
F-Series Capacitors
–
Tape & Reel Packaging ..................................................279
High Performance Resin Molded Solid Tantalum Chip
TRJ Series
–
Enhanced Reliability Professional
& Automotive Grade - J-Lead ....................................................................98-106
F97 Series
–
Enhanced Reliability Professional
& Automotive Grade - J-Lead ..................................................................107-111
F97-HT3 Series
–
High Temperature (135°C max.) - J-Lead......................112-116
F9H Series
–
High Temperature (150°C max.) - J-Lead ..............................117-119
TRM Series
–
Enhanced Reliability Professional
Grade Multianode - J-Lead ......................................................................120-124
TMJ S1gma
TM
Series
–
LAT* Professional Grade - J-Lead ........................125-130
THJ Series
–
High Temperature (175°C max.) - J-Lead ..............................131-136
THJ Extended Series
–
High Temperature (200°C max.) - J-Lead.............137-140
THH Hermetic Series
–
High Temperature (230°C max.)
Hermetic SMD Chip .................................................................................141-145
TAP/TEP TECHNICAL SUMMARY AND
APPLICATION GUIDELINES
Section 1:
Electrical Characteristics and Explanation of Terms .................280-283
Section 2:
A.C. Operation, Ripple Voltage and Ripple Current..........................284
Section 3:
Reliability and Calculation of Failure Rate .................................285-287
Section 4:
Application Guidelines for Tantalum Capacitors...............................288
Questions and Answers
..............................................................................289-292
TACmicrochip
®
TAC Series
– Standard and Low Profile TACmicrochip
®
................................146-152
TLC Series
– High CV TACmicrochip
®
.........................................................153-157
TPC Series
–
Low ESR TACmicrochip
®
......................................................158-162
Conformal Coated Tantalum Chip
F95 Series
–
Standard ..................................................................................163-167
F95 Audio Series
– Optimized for Audio Applications
...................................168-171
F72/F75 Series
–
Low Profile and HiCV.......................................................172-175
SOFTWARE TOOLS
................................................................................293
PRODUCT LISTING
.................................................................................294
RANGE OF SAMPLE KITS
..................................................................295
*LAT = Lot Acceptance Tested
Resin Molded OxiCap
®
Solid Niobium Oxide Chip, J-Lead
NOJ Series
–
Standard and Low Profile OxiCap
®
........................................176-182
NLJ Series
–
High CV OxiCap
®
....................................................................183-186
NOS Series
–
Low ESR OxiCap
®
.................................................................187-193
NOM Series
–
Multianode Ultra-Low ESR OxiCap
®
.....................................194-197
Section 1: Introduction
AVX Tantalum
APPLICATIONS
AVX – FOCUS ON QUALITY
AVX is committed to Total Customer Satisfaction by meeting
or exceeding expectations in product performance and
product innovation while providing comprehensive technical
support combined with matchless service.
AVX Corporation Goals:
• To provide world class service in the manufacture and
supply of electronic components, while maintaining a pos-
itive return on investment.
• Consistently supplying product of the highest quality with
exceptional service throughout the entire supply chain.
• New or improved products, processes or services will be
qualified to established standards of quality and reliability.
The above objectives shall be achieved by the following
codes of practice:
1. Continuous evaluation of all customer expectations,
bringing to bear all AVX resources to meet their future
needs.
2. Continually fostering and promoting a culture of continu-
ous improvement through training and empowered
participation of employees at all levels of the company.
3. Continuous Process Improvement using sound engineer-
ing principles to enhance existing equipment, materials
and processes. This includes the application of the
science of SPC focused on improving the Process
Capability Index, C
pk
.
All Tantalum division plants are approved to ISO 9001:2008
quality standard; ISO/TS 16949:2009 (Automotive Quality
System Requirements, with the aim to adopt the latest IATF
16949:2016) and ISO 14001:2004 environmental standards.
Defined series of conductive polymer, tantalum and NbO
OxiCap
®
capacitors meet the requirements of AEC-Q200.
Plant Certifications
Site
Location
Adogawa
Japan
Lanskroun
Czech
San Salvador
El Salvador
ISO
16949
✓
✓
✓
ESA
ESCC
✓
IECQ
CECC
✓
OH SAS
18001
9001
✓
✓
✓
14001
✓
✓
✓
✓
Please see AVX web site www.avx.com for the latest certifi-
cation status.
AVX Corporation (NYSE: AVX) with headquarters in Fountain
Inn, South Carolina, USA, is a leading global supplier of pas-
sive electronic components.
AVX solid electrolytic capacitors are produced in major world
regions: Lanskroun, Czech Republic (Europe), San Salvador,
El Salvador (Americas) and Adogawa in Japan (Asia), giving
full access to our global customers and enabling optimum
service for our regional customer base. High reliability spe-
cilised tantalums are produced in AVX Biddeford, Maine,US.
2
Introduction
AVX Tantalum
e-Sustainability Initiative (GeSI) Conflict-Free Smelter program
has been verified.
Niobium oxide
is a ceramic material that
can be refined to the same capacitor grade powder
morphology as high purity tantalum powder, enabling
capacitor anode manufacture by identical processes.
The
dielectric
layer is an oxide of the anodic material –
tantalum or niobium pentoxide. These oxides can be formed in
very thin layers, which, combined with their unique insulating
properties, enables very high and stable capacitance values to
be achieved.
The
cathode
is made from manganese dioxide, a
semiconducting material (for standard tantalum and niobium
oxide solid electrolytic capacitors) or conductive polymer (for
polymer solid electrolytic capacitors).
AVX is world wide leading Tantalum capacitor manu-
facturer
with widest range of capacitors from smallest to
large case sizes, from consumer to automotive, medical and
aerospace level applications. AVX has a leading market
position in all world regions. Call us first -
AVX your global
partner.
The Tantalum division of AVX produces a wide range of solid
electrolytic capacitors. Typically, the construction consists of
a 1st electrode (anode), an insulating layer (dielectric) and a
2nd electrode (cathode) system.
The anode is manufactured either from pure tantalum or
niobium oxide powder.
Tantalum
is an element extracted
from ores found alongside tin and niobium deposits; the major
sources of supply are located in Brazil, Africa and Australia.
Since December 1st, 2011, AVX has exclusively sourced the
tantalum powder and wire used to manufacture its tantalum
capacitors from smelters whose compliance with the
Electronic Industry Code of Conduct (EICC) and the Global
TECHNOLOGY TRENDS
Miniaturization (downsizing in both real estate and height
profile) while retaining high capacitance has been the most
significant driver of capacitor requirements for the latest
electronic hardware designs. Solid electrolytic capacitors are
one of the best technologies to offer very high capacitance
value in small dimensions.
The amount of capacitance achievable in solid electrolytic
capacitors is directly related to the characteristics of the
powder used to manufacture the anode. Capacitance x
voltage per gram (CV/g) is the measure used to define the
volumetric efficiency of a powder. The following graph shows
how the capability in CV/g has steadily increased over time,
allowing the production of greater capacitance values within
the same physical outline. These powder improvements have
been achieved through close development with material
suppliers. AVX are committed to driving the available
technology forward, demonstrated by extended ratings
continually being introduced in all technologies, including
conductive polymer tantalum, TACmicrochip®, and NbO
OxiCap
®
.
Tantalum Powder
CV/g
Tantalum Powder
CV/g
300
250
CV/g (K)
200
150
100
50
0
1980
1985
1990
1995
2000
2005
2010
2015
The next significant driver is equivalent series resistance (ESR)
reduction. As DC-DC converter and power supply designs
increase in power density, they require lower ESR output
capacitors to control ripple. AVX maintains a continuous ESR
improvement program to ensure low ESR capacitor capability
is maintained across the widest operating voltage range to
keep pace with emerging industry requirements.
*Niobium Oxide Capacitors are manufactured and sold under patent license from Cabot Corporation, Boyertown, Pennsylvania U.S.A.
051117
3
Solid Electrolytic Capacitors Road Map
Commercial
Professional
&
Automotive
High-Temp
CECC
COTS+*
DLA*
MIL-PRF*
Space Level*
Medical*
SMD Conventional (MnO
2
Cathode) Tantalum Solid Electrolytic Chip Capacitors
TAJ
J-lead
termination
TAJ
Low Profile
F93
F92
Low Profile
Standard
TAJ
Automotive
TRJ (auto)
Professional
F93-AJ6
(auto)
F97 (auto)
F97-HT3 135°C
(auto)
F9H 150°C
(auto)
TAJ CECC
30801-011
30801-005
DLA
95158
CWR11
TBJ
DLA
07016
TAJ ESCC
3012-001
T4J
HRC4000
THJ 175ºC
(auto)
THJ 200ºC
Conformal
High Energy
Undertab
termination
F95
TAN
High Energy
TPS
Low ESR
F91
Low ESR
J-lead
termination
TPS
Automotive
F91-AJ6
(auto)
TRJ (auto)
Low ESR
TRM
(auto)
DLA
95158
THJ 175ºC
(auto)
TBJ
Low ESR
DLA
07016
TBJ
SRC9000
TES ESCC
3012-004
TBM
SRC9000
TES ESCC
3012-004
Ultra Low
ESR
Multianode
J-lead
termination
TPM
Ultra Low
ESR
TMJ
Low DCL
F93-BE
TLJ
F98
TLN
Undertab
TLN
PulseCap
TM
F72/75
TBM
Ultra Low
ESR
Low DCL
J-lead
termination
TMJ
S1gma
TM
J-lead
termination
High CV
Undertab
termination
Confomal
CWR09
Standard
CWR
09, 19, 29*
Low ESR
F98-AS1
Fused
TCP
Ultra Low
ESR
THH
THH
230ºC
THH
DLA
09009
TAZ
TAZ
CWR19
High CV
CWR29
TAZ
SRC9000
CWR
“T” Level
TAZ
SRC9000
CWR
“T” Level
TAZ
HRC5000
T4Z
HRC4000
TAZ
HRC5000
T4Z
HRC4000
Fused
Modules
TCP
SRC9000
TCP
HRC5000
Hermetic Package*
SMD Conductive Polymer Tantalum Solid Electrolytic Chip Capacitors
Standard
Ultra low ESR
Multianode
High Energy
Low Profile
Miniature
Hermetic Package*
Undertab
termination
J-lead
termination
TCJ
TCM
Multianode
J-CAP
TM
TCN
TCN
Undertab
F38
TCQ
Automotive
TCR
Professional
TCB
TCS
TCH
TCH
TCH
under development
* see High Reliability Tantalum Catalog
Note: For specific requirements and questions please contact AVX
4
082718
嵌入式系统
