DUAL COMPARATOR, 10000uV OFFSET-MAX, 600ns RESPONSE TIME, PDIP8, PLASTIC, DIP-8
厂商名称:ST(意法半导体)
厂商官网:http://www.st.com/
下载文档型号 | TS372N | TS372MJ | TS372D |
---|---|---|---|
描述 | DUAL COMPARATOR, 10000uV OFFSET-MAX, 600ns RESPONSE TIME, PDIP8, PLASTIC, DIP-8 | DUAL COMPARATOR, 10000uV OFFSET-MAX, 600ns RESPONSE TIME, CDIP8, CERDIP-8 | DUAL COMPARATOR, 10000uV OFFSET-MAX, 600ns RESPONSE TIME, PDSO8, MICRO, PLASTIC, SO-8 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 |
厂商名称 | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) |
零件包装代码 | DIP | DIP | SOIC |
包装说明 | DIP, DIP8,.3 | DIP, DIP8,.3 | SOP, SOP8,.25 |
针数 | 8 | 8 | 8 |
Reach Compliance Code | not_compliant | not_compliant | not_compliant |
ECCN代码 | EAR99 | EAR99 | EAR99 |
放大器类型 | COMPARATOR | COMPARATOR | COMPARATOR |
最大输入失调电压 | 10000 µV | 10000 µV | 10000 µV |
JESD-30 代码 | R-PDIP-T8 | R-CDIP-T8 | R-PDSO-G8 |
JESD-609代码 | e0 | e0 | e0 |
功能数量 | 2 | 2 | 2 |
端子数量 | 8 | 8 | 8 |
最高工作温度 | 70 °C | 125 °C | 70 °C |
封装主体材料 | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY |
封装代码 | DIP | DIP | SOP |
封装等效代码 | DIP8,.3 | DIP8,.3 | SOP8,.25 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | IN-LINE | SMALL OUTLINE |
电源 | 5 V | 5 V | 5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified |
标称响应时间 | 600 ns | 600 ns | 600 ns |
座面最大高度 | 5.08 mm | 5.08 mm | 1.75 mm |
最大压摆率 | 1 mA | 1 mA | 1 mA |
供电电压上限 | 12 V | 12 V | 12 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V |
表面贴装 | NO | NO | YES |
技术 | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | MILITARY | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | GULL WING |
端子节距 | 2.54 mm | 2.54 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL |
宽度 | 7.62 mm | 7.62 mm | 3.9 mm |