型号
- 型号
- 关键词
| 型号 | TS81102G0VGSB/Q | TS81102G0CGS | TS81102G0CGSB/Q | TS81102G0VGS |
|---|---|---|---|---|
| 描述 | Telecom Circuit, 1-Func, Bipolar, CBGA360, CGA-360 | Telecom Circuit, 1-Func, Bipolar, CBGA360, HERMETIC SEALED, CGA-360 | Telecom Circuit, 1-Func, Bipolar, CBGA360, CGA-360 | Telecom Circuit, 1-Func, Bipolar, CBGA360, HERMETIC SEALED, CGA-360 |
| 厂商名称 | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) |
| 零件包装代码 | CGA | CGA | CGA | CGA |
| 包装说明 | CGA, | CGA, | CGA, | CGA, |
| 针数 | 360 | 360 | 360 | 360 |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| JESD-30 代码 | X-CBGA-X360 | X-CBGA-X360 | X-CBGA-X360 | X-CBGA-X360 |
| 负电源额定电压 | -5 V | -5 V | -5 V | -5 V |
| 功能数量 | 1 | 1 | 1 | 1 |
| 端子数量 | 360 | 360 | 360 | 360 |
| 最高工作温度 | 85 °C | 70 °C | 70 °C | 85 °C |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | CGA | CGA | CGA | CGA |
| 封装形状 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
| 封装形式 | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES |
| 技术 | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
| 电信集成电路类型 | TELECOM CIRCUIT | TELECOM CIRCUIT | TELECOM CIRCUIT | TELECOM CIRCUIT |
| 温度等级 | INDUSTRIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL |
| 端子形式 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
| 端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM |