型号
- 型号
- 关键词
IEC61883, 1394a Link Layer Controller integrated with a 1394a, 400Mbps, 2-port Physical Layer (PHY) 196-BGA MICROSTAR -20 to 85
器件类别：嵌入式处理器和控制器 微控制器和处理器
器件标准：
| 型号 | TSB43DA42AZHC | TSB43DA42AGHC | TSB43DA42AGHCR | TSB43DA42AZHCR | TSB43DA42GHC | TSB43DA42GHCR |
|---|---|---|---|---|---|---|
| 描述 | IEC61883, 1394a Link Layer Controller integrated with a 1394a, 400Mbps, 2-port Physical Layer (PHY) 196-BGA MICROSTAR -20 to 85 | 1394 Interface IC IEC61883 1394a Link | 1394 Interface IC IEC61883 1394a Link | IEC61883, 1394a Link Layer Controller integrated with a 1394a, 400Mbps, 2-port Physical Layer (PHY) 196-BGA MICROSTAR -20 to 85 | 1394 Interface IC IEC61883 1394a Link Layer Cntrlr | 1394 Interface IC TSB43DA2GHCR (Jedi) in Tape and Reel |
| 是否无铅 | 不含铅 | 含铅 | 含铅 | 不含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 符合 | 不符合 | 不符合 | 符合 | 不符合 | 不符合 |
| 零件包装代码 | BGA | BGA | BGA | BGA | BGA | BGA |
| 包装说明 | LBGA, | LBGA, | LBGA, | LBGA, | LBGA, | LBGA, |
| 针数 | 196 | 196 | 196 | 196 | 196 | 196 |
| Reach Compliance Code | compli | compli | _compli | compli | _compli | compli |
| ECCN代码 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 |
| 地址总线宽度 | 32 | 32 | 32 | 32 | 32 | 32 |
| 总线兼容性 | PCI | PCI | PCI | PCI | PCI | PCI |
| 最大时钟频率 | 33 MHz | 33 MHz | 33 MHz | 33 MHz | 33 MHz | 33 MHz |
| 最大数据传输速率 | 400 MBps | 400 MBps | 400 MBps | 400 MBps | 400 MBps | 400 MBps |
| 驱动器接口标准 | IEEE1394; IEEE1394A | IEEE1394; IEEE1394A | IEEE1394; IEEE1394A | IEEE1394; IEEE1394A | IEEE1394; IEEE1394A | IEEE1394; IEEE1394A |
| 外部数据总线宽度 | 32 | 32 | 32 | 32 | 32 | 32 |
| JESD-30 代码 | S-PBGA-B196 | S-PBGA-B196 | S-PBGA-B196 | S-PBGA-B196 | S-PBGA-B196 | S-PBGA-B196 |
| JESD-609代码 | e1 | e0 | e0 | e1 | e0 | e0 |
| 长度 | 15 mm | 15 mm | 15 mm | 15 mm | 15 mm | 15 mm |
| 湿度敏感等级 | 3 | 3 | 3 | 3 | 3 | 3 |
| 端子数量 | 196 | 196 | 196 | 196 | 196 | 196 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | LBGA | LBGA | LBGA | LBGA | LBGA | LBGA |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE |
| 峰值回流温度（摄氏度） | 260 | 220 | 220 | 260 | 220 | 220 |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.5 mm | 1.5 mm | 1.5 mm | 1.5 mm | 1.5 mm | 1.5 mm |
| 表面贴装 | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | OTHER | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | OTHER | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED |
| 端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) | TIN LEAD | Tin/Lead (Sn/Pb) | Tin/Silver/Copper (Sn/Ag/Cu) | Tin/Lead (Sn/Pb) | TIN LEAD |
| 端子形式 | BALL | BALL | BALL | BALL | BALL | BALL |
| 端子节距 | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm |
| 端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 15 mm | 15 mm | 15 mm | 15 mm | 15 mm | 15 mm |
| uPs/uCs/外围集成电路类型 | PCI BUS CONTROLLER | PCI BUS CONTROLLER | CONSUMER CIRCUIT | PCI BUS CONTROLLER | PCI BUS CONTROLLER | PCI BUS CONTROLLER |
| Base Number Matches | 1 | 1 | - | 1 | 1 | 1 |
