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TSI320-G133IE

PCI Bus Controller, CMOS, PBGA352, 27 X 27 MM, 2.33 MM HEIGHT, 1.27 MM PITCH, PLASTIC, MO-151BAL-2, BGA-352

器件类别:嵌入式处理器和控制器    微控制器和处理器   

厂商名称:Tundra Semiconductor Corp

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器件参数
参数名称
属性值
是否Rohs认证
不符合
厂商名称
Tundra Semiconductor Corp
包装说明
27 X 27 MM, 2.33 MM HEIGHT, 1.27 MM PITCH, PLASTIC, MO-151BAL-2, BGA-352
Reach Compliance Code
unknown
地址总线宽度
64
最大时钟频率
66 MHz
外部数据总线宽度
64
JESD-30 代码
S-PBGA-B352
JESD-609代码
e0
长度
27 mm
端子数量
352
封装主体材料
PLASTIC/EPOXY
封装代码
HBGA
封装等效代码
BGA352,20X20,50
封装形状
SQUARE
封装形式
GRID ARRAY, HEAT SINK/SLUG
峰值回流温度(摄氏度)
NOT SPECIFIED
电源
1.2,3.3 V
认证状态
Not Qualified
座面最大高度
2.4 mm
最大压摆率
0.08 mA
最大供电电压
1.32 V
最小供电电压
1.08 V
标称供电电压
1.2 V
表面贴装
YES
技术
CMOS
端子面层
Tin/Lead (Sn/Pb)
端子形式
BALL
端子节距
1.27 mm
端子位置
BOTTOM
处于峰值回流温度下的最长时间
NOT SPECIFIED
宽度
27 mm
uPs/uCs/外围集成电路类型
BUS CONTROLLER, PCI
文档预览
TitlePage 80A600B_MA001_05
Tsi320
Dual-Mode PCI-to-PCI Bus Bridge
User Manual
Document Number: 80A600B_MA001_05
Document Status: Preliminary
Release Date: March 2002
This document discusses the features, capabilities, and
configuration requirements of the Tsi320. It is intended for hardware
and software engineers who are designing system interconnect
applications with the Tsi320.
Tundra Semiconductor Corporation
Trademarks
TUNDRA is a registered trademark of Tundra Semiconductor Corporation (Canada, U.S., and U.K.). TUNDRA,
the Tundra logo, Tsi320, and Silicon Behind the Network, are trademarks of Tundra Semiconductor Corporation.
All other registered and unregistered marks (including trademarks, service marks and logos) are the property of
their respective owners. The absence of a mark identifier is not a representation that a particular product name is
not a mark.
Copyright
Copyright © March 2002 Tundra Semiconductor Corporation. All rights reserved.
Published in Canada
This document contains information which is proprietary to Tundra and may be used for non-commercial
purposes within your organization in support of Tundra products. No other use or transmission of all or any part
of this document is permitted without written permission from Tundra, and must include all copyright and other
proprietary notices. Use or transmission of all or any part of this document in violation of any applicable
Canadian or other legislation is hereby expressly prohibited.
User obtains no rights in the information or in any product, process, technology or trademark which it includes or
describes, and is expressly prohibited from modifying the information or creating derivative works without the
express written consent of Tundra.
Disclaimer
Tundra assumes no responsibility for the accuracy or completeness of the information presented which is subject
to change without notice. In no event will Tundra be liable for any direct, indirect, special, incidental or
consequential damages, including lost profits, lost business or lost data, resulting from the use of or reliance upon
the information, whether or not Tundra has been advised of the possibility of such damages.
Mention of non-Tundra products or services is for information purposes only and constitutes neither an
endorsement nor a recommendation.
Corporate Profile
Tundra Semiconductor Corporation
Tundra Semiconductor Corporation (TSE:TUN) designs, develops, and markets
advanced System Interconnect for use by the world's leading Internet and
communications infrastructure vendors. Tundra chips provide the latest interface
and throughput features to help these vendors design and deliver more powerful
equipment in shorter timeframes. Tundra products are essential to a range of
applications, including telecommunications, data communications, wireless
communications, industrial automation, and ruggedized systems. Tundra
headquarters are located in Kanata, Ontario, Canada, and sales offices are based in
Mountain View, California and Maidenhead, U.K. Tundra sells its products
worldwide through a network of direct sales personnel, independent distributors,
and manufacturers' representatives. More information is available online at
www.tundra.com.
Greater Demand, Greater Opportunity
The increasingly complex requirements placed on the Internet, intranets and
extranets have created an insatiable demand for higher speed and greater capacity in
communications networks. The evolution of converging communications networks
requires higher levels of security and increasingly sophisticated network
intelligence. These network demands, and the user expectations that drive them,
have created a global need for well-managed and ever-increasing bandwidth.
Tundra helps meet those demands by creating underlying technology that enables
the accelerated flow of voice, data, and video information over communications
networks. Tundra products can be found in a broad range of applications, including
telecommunications, data communications, wireless communications, industrial
automation, and avionics. Communications infrastructure vendors rely on Tundra
for off-the-shelf, standards-based, easy-to-deploy and highly scalable System
Interconnect products.
Tsi320 Dual-Mode PCI-to-PCI Bus Bridge User Manual
80A600B_MA001_05
3
Corporate Profile
Tundra System Interconnect
Tundra is
System Interconnect.
Tundra uses the term System Interconnect to refer to
the technology used to connect all the components and sub-systems in almost any
embedded system. This concept applies to the interfacing of functional elements
(CPU, memory, I/O complexes, etc.) within a single-board system, and the
interfacing of multiple boards in a larger system.
System Interconnect is a vital enabling technology for the networked world. The
convergence of voice, video, and data traffic, the need for more secure
communications, and the exploding demand for high-speed network access are
putting communications infrastructure vendors under intense pressure to provide
faster, well-managed bandwidth that also integrates smoothly with existing
technology. Tundra System Interconnect helps these vendors address their customer
needs. It enables them to build standards-based network equipment that can scale to
multi-gigahertz speeds and also integrate with existing infrastructure.
Partnerships
Fundamental to the success of Tundra is its partnerships with leading
manufacturers, including Motorola, Compaq and Texas Instruments. As a result of
these alliances, Tundra devices greatly influence the design of customers’
architectures. Customers are changing their designs to incorporate Tundra products.
This highlights the commitment Tundra holds to be a significant part of its
customers’ success.
The Tundra design philosophy is one in which a number of strategic customers are
invited to participate in the definition, design, test, and early silicon supply phases
of product development. Close working relationships with customers and clear
product roadmaps ensure that Tundra can anticipate and meet the future directions
and needs of communications systems designers and manufacturers.
Tundra Customers
Tundra semiconductor products are used by the world's leading communications
infrastructure vendors, including Cisco, Motorola, Ericsson, Nortel, Lucent, IBM,
Xerox, Hewlett-Packard, 3Com, Nokia, Siemens, Alcatel, Matsushita, OKI, Fujitsu,
Samsung, and LGS.
Tundra Customer Support
Tundra is respected throughout the industry for its outstanding commitment to
customer support. Tundra ensures that its customers can take immediate advantage
of the company's products through its Applications Engineering Group, unmatched
Design Support Tools (DST), and full documentation. Customer support also
includes Web-based and telephone access to in-house technical resources.
Tundra System Interconnect … Silicon Behind the Network ™
4
Tsi320 Dual-Mode PCI-to-PCI Bus Bridge User Manual
80A600B_MA001_05
Contact Information
Tundra is dedicated to providing its customers with superior technical
documentation and support. The following types of support are available:
Web
Product Information
www.tundra.com/Tsi320 describes Tsi320’s
features, benefits, typical applications, and
block diagram. This webpage also provides links
to other product-related information located on
the Tundra website.
www.tundra.com/dst contains an extensive
collection of technical documents that explain
Tsi320’s features and how to implement them.
Some of the DST resources include the device
manual, manual addenda, application notes,
design notes, and device errata.
Once you register for access to the Design
Support Tools webpage you can opt to receive
email notification when a resource is added or
changed.
www.tundra.com/faq is a support database that
contains answers to common technical questions
fielded by our knowledgeable Technical
Support team.
www.tundra.com/sales contains information
that will help you locate a Tundra sales
representative nearest you.
Design Support Tools (DST)
Design Support Tools FAQ
Sales Support
Tsi320 Dual-Mode PCI-to-PCI Bus Bridge User Manual
80A600B_MA001_05
5
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参数对比
与TSI320-G133IE相近的元器件有:TSI320-G133CE。描述及对比如下:
型号 TSI320-G133IE TSI320-G133CE
描述 PCI Bus Controller, CMOS, PBGA352, 27 X 27 MM, 2.33 MM HEIGHT, 1.27 MM PITCH, PLASTIC, MO-151BAL-2, BGA-352 PCI Bus Controller, CMOS, PBGA352, 27 X 27 MM, 2.33 MM HEIGHT, 1.27 MM PITCH, PLASTIC, MO-151BAL-2, BGA-352
是否Rohs认证 不符合 不符合
包装说明 27 X 27 MM, 2.33 MM HEIGHT, 1.27 MM PITCH, PLASTIC, MO-151BAL-2, BGA-352 27 X 27 MM, 2.33 MM HEIGHT, 1.27 MM PITCH, PLASTIC, MO-151BAL-2, BGA-352
Reach Compliance Code unknown unknown
地址总线宽度 64 64
最大时钟频率 66 MHz 66 MHz
外部数据总线宽度 64 64
JESD-30 代码 S-PBGA-B352 S-PBGA-B352
JESD-609代码 e0 e0
长度 27 mm 27 mm
端子数量 352 352
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 HBGA HBGA
封装等效代码 BGA352,20X20,50 BGA352,20X20,50
封装形状 SQUARE SQUARE
封装形式 GRID ARRAY, HEAT SINK/SLUG GRID ARRAY, HEAT SINK/SLUG
电源 1.2,3.3 V 1.2,3.3 V
认证状态 Not Qualified Not Qualified
座面最大高度 2.4 mm 2.4 mm
最大压摆率 0.08 mA 0.08 mA
最大供电电压 1.32 V 1.32 V
最小供电电压 1.08 V 1.08 V
标称供电电压 1.2 V 1.2 V
表面贴装 YES YES
技术 CMOS CMOS
端子面层 Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
端子形式 BALL BALL
端子节距 1.27 mm 1.27 mm
端子位置 BOTTOM BOTTOM
宽度 27 mm 27 mm
uPs/uCs/外围集成电路类型 BUS CONTROLLER, PCI BUS CONTROLLER, PCI
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