型号
- 型号
- 关键词
Micro Peripheral IC, CQFP196,
器件类别：嵌入式处理器和控制器 微控制器和处理器
厂商名称：TEMIC
厂商官网：http://www.temic.de/
下载文档| 型号 | TSS901EMB/883 | TSS901EMA | TSS901EMA/883 | TSS901EMB |
|---|---|---|---|---|
| 描述 | Micro Peripheral IC, CQFP196, | Micro Peripheral IC, CQFP196, | Micro Peripheral IC, CQFP196, | Micro Peripheral IC, CQFP196, |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | TEMIC | TEMIC | TEMIC | TEMIC |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| JESD-30 代码 | S-XQFP-G196 | S-XQFP-F196 | S-XQFP-F196 | S-XQFP-G196 |
| JESD-609代码 | e0 | e0 | e0 | e0 |
| 端子数量 | 196 | 196 | 196 | 196 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C |
| 封装主体材料 | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
| 封装代码 | QFP | QFF | QFF | QFP |
| 封装等效代码 | QFP196,1.5SQ | QFL196,1.8SQ,25 | QFL196,1.8SQ,25 | QFP196,1.5SQ |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | FLATPACK | FLATPACK | FLATPACK | FLATPACK |
| 电源 | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大压摆率 | 190 mA | 190 mA | 190 mA | 190 mA |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING | FLAT | FLAT | GULL WING |
| 端子节距 | 0.635 mm | 0.635 mm | 0.635 mm | 0.635 mm |
| 端子位置 | QUAD | QUAD | QUAD | QUAD |
