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TZA3001U

SDH/SONET STM4/OC12 laser drivers

器件类别:模拟混合信号IC    驱动程序和接口   

厂商名称:Philips Semiconductors (NXP Semiconductors N.V.)

厂商官网:https://www.nxp.com/

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器件参数
参数名称
属性值
厂商名称
Philips Semiconductors (NXP Semiconductors N.V.)
包装说明
, DIE OR CHIP
Reach Compliance Code
unknow
最高工作温度
85 °C
最低工作温度
-40 °C
封装等效代码
DIE OR CHIP
电源
5 V
认证状态
Not Qualified
标称供电电压
5 V
温度等级
INDUSTRIAL
文档预览
INTEGRATED CIRCUITS
DATA SHEET
TZA3001AHL; TZA3001BHL;
TZA3001U
SDH/SONET STM4/OC12 laser
drivers
Preliminary specification
Supersedes data of 1997 Sep 08
File under Integrated Circuits, IC19
1999 Aug 24
Philips Semiconductors
Preliminary specification
SDH/SONET STM4/OC12 laser drivers
FEATURES
622 Mbits/s data input, both Current-Mode Logic (CML)
and Positive Emitter Coupled Logic (PECL) compatible;
maximum 800 mV (p-p)
Adaptive laser output control with dual loop, stabilizing
optical ONE and ZERO levels
Optional external control of laser modulation and biasing
currents (non-adaptive)
Automatic laser shutdown
Few external components required
Rise and fall times of 120 ps (typical value)
Jitter <50 mUI (p-p)
RF output current sinking capability of 60 mA
Bias current sinking capability of 90 mA
Power dissipation of 430 mW (typical value)
Low cost LQFP32 plastic package
Single 5 V power supply.
TZA3001AHL
Laser alarm output for signalling extremely low and high
bias current conditions.
TZA3001BHL
Extra STM4 622 Mbits/s loop mode input; both CML and
PECL compatible.
TZA3001U
Bare die version with combined bias alarm and loop
mode functionality.
ORDERING INFORMATION
TYPE
NUMBER
TZA3001AHL
TZA3001BHL
TZA3001U
bare die; 2000
×
2000
×
380
µm
TZA3001AHL; TZA3001BHL;
TZA3001U
APPLICATIONS
SDH/SONET STM4/OC12 optical transmission systems
SDH/SONET STM4/OC12 optical laser modules.
GENERAL DESCRIPTION
The TZA3001AHL, TZA3001BHL and TZA3001U are fully
integrated laser drivers for STM4/OC12 (622 Mbits/s)
systems, incorporating the RF path between the data
multiplexer and the laser diode. Since the dual loop bias
and modulation control circuits are integrated on the IC,
the external component count is low. Only decoupling
capacitors and adjustment resistors are required.
The TZA3001AHL features an alarm function for signalling
extreme bias current conditions. The alarm low and high
threshold levels can be adjusted to suit the application
using only a resistor or a current Digital-to-Analog
Converter (DAC).
The TZA3001BHL is provided with an additional RF data
input to facilitate remote (loop mode) system testing.
The TZA3001U is a bare die version for use in compact
laser module designs. The die contains 40 pads and
features the combined functionality of the TZA3001AHL
and the TZA3001BHL.
PACKAGE
NAME
LQFP32
DESCRIPTION
plastic low profile quad flat package; 32 leads; body 5
×
5
×
1.4 mm
VERSION
SOT401-1
1999 Aug 24
2
Philips Semiconductors
Preliminary specification
SDH/SONET STM4/OC12 laser drivers
BLOCK DIAGRAM
TZA3001AHL; TZA3001BHL;
TZA3001U
handbook, full pagewidth
ALARM TONE TZERO ALARMLO ALARMHI
26
4
5
21
LASER
CONTROL
BLOCK
data input
(differential)
18
2
22
23
13
MONIN
ONE
ZERO
LA
LAQ
BIAS
DIN
DINQ
28
29
CURRENT
SWITCH
12
15
TZA3001AHL
19, 20
27, 30
4
VCC(R) VCC(G) VCC(B)
ALS
BAND GAP
REFERENCE
6
BGAP
7
10
31
1, 3, 8, 9,
11, 14, 16, 17
24, 25, 32
11
GND
MGK271
Fig.1 Block diagram of TZA3001AHL.
handbook, full pagewidth
ENL
26
TONE
4
TZERO
5
LASER
CONTROL
BLOCK
2
22
23
13
MONIN
ONE
ZERO
LA
LAQ
BIAS
DIN
DINQ
DLOOP
DLOOPQ
28
29
19
20
BAND GAP
REFERENCE
6
MUX
CURRENT
SWITCH
12
15
BGAP
TZA3001BHL
18, 21
27, 30
4
VCC(R) VCC(G) VCC(B)
ALS
7
10
31
1, 3, 8, 9,
11, 14, 16, 17
24, 25, 32
11
GND
MGK270
Fig.2 Block diagram of TZA3001BHL.
1999 Aug 24
3
Philips Semiconductors
Preliminary specification
SDH/SONET STM4/OC12 laser drivers
PINNING
PIN
SYMBOL
TZA3001AHL TZA3001BHL
GND
MONIN
GND
IGM
TONE
TZERO
BGAP
V
CC(G)
V
CC(G)
GND
GND
V
CC(B)
V
CC(B)
GND
LAQ
LA
GND
BIAS
GND
GND
GND
ALARMHI
V
CC(R)
V
CC(R)
DLOOP
V
CC(R)
DLOOPQ
V
CC(R)
ALARMLO
V
CC(R)
ONE
ZERO
GND
GND
ALARM
ENL
V
CC(R)
1999 Aug 24
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
TZA3001U
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
4
ground
PAD
TZA3001AHL; TZA3001BHL;
TZA3001U
DESCRIPTION
monitor photodiode current input
ground
not used; leave unbonded
connection for external capacitor used to set optical
ONE control loop time constant (optional)
connection for external capacitor used to set optical
ZERO control loop time constant (optional)
connection for external band gap decoupling capacitor
supply voltage (green domain)
supply voltage (green domain)
ground
ground
supply voltage (blue domain)
supply voltage (blue domain)
ground
laser modulation output inverted
laser modulation output
ground
laser bias current output
ground
ground
ground
maximum bias current alarm reference level input
supply voltage (red domain)
supply voltage (red domain)
loop mode data input
supply voltage (red domain)
loop mode data input inverted
supply voltage (red domain)
minimum bias current alarm reference level input
supply voltage (red domain)
optical ONE reference level input
optical ZERO reference level input
ground
ground
alarm output
loop mode enable input
supply voltage (red domain)
Philips Semiconductors
Preliminary specification
SDH/SONET STM4/OC12 laser drivers
TZA3001AHL; TZA3001BHL;
TZA3001U
PIN
SYMBOL
TZA3001AHL TZA3001BHL
DIN
DINQ
V
CC(R)
ALS
GND
GND
28
29
30
31
32
28
29
30
31
32
PAD
DESCRIPTION
TZA3001U
35
36
37
38
39
40
data input
data input inverted
supply voltage (red domain)
automatic laser shutdown input
ground
ground
27 VCC(R)
30 VCC(R)
29 DINQ
handbook, full pagewidth
26 ALARM
25 GND
32 GND
31 ALS
28 DIN
GND
MONIN
GND
TONE
TZERO
BGAP
VCC(G)
GND
1
2
3
4
24 GND
23 ZERO
22 ONE
21 ALARMLO
TZA3001AHL
5
6
7
8
20 VCC(R)
19 VCC(R)
18 ALARMHI
17 GND
VCC(B) 10
GND 11
LAQ 12
LA 13
GND 14
BIAS 15
GND 16
GND
9
MGK273
Fig.3 Pin configuration of TZA3001AHL.
1999 Aug 24
5
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参数对比
与TZA3001U相近的元器件有:TZA3001AHL、TZA3001BHL。描述及对比如下:
型号 TZA3001U TZA3001AHL TZA3001BHL
描述 SDH/SONET STM4/OC12 laser drivers SDH/SONET STM4/OC12 laser drivers SDH/SONET STM4/OC12 laser drivers
厂商名称 Philips Semiconductors (NXP Semiconductors N.V.) Philips Semiconductors (NXP Semiconductors N.V.) Philips Semiconductors (NXP Semiconductors N.V.)
包装说明 , DIE OR CHIP QFP, QFP32,.28SQ,20 QFP, QFP32,.28SQ,20
Reach Compliance Code unknow unknow unknow
最高工作温度 85 °C 85 °C 85 °C
最低工作温度 -40 °C -40 °C -40 °C
封装等效代码 DIE OR CHIP QFP32,.28SQ,20 QFP32,.28SQ,20
电源 5 V 5 V 5 V
认证状态 Not Qualified Not Qualified Not Qualified
标称供电电压 5 V 5 V 5 V
温度等级 INDUSTRIAL INDUSTRIAL INDUSTRIAL
是否Rohs认证 - 不符合 不符合
JESD-30 代码 - S-PQFP-G32 S-PQFP-G32
JESD-609代码 - e0 e0
端子数量 - 32 32
封装主体材料 - PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 - QFP QFP
封装形状 - SQUARE SQUARE
封装形式 - FLATPACK FLATPACK
表面贴装 - YES YES
端子面层 - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
端子形式 - GULL WING GULL WING
端子节距 - 0.5 mm 0.5 mm
端子位置 - QUAD QUAD
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