型号
  • 型号
  • 关键词
首页 > 器件类别 > 分立半导体 > 二极管

U0404FC24C

UNBUMPED FLIP CHIP ARRAY

器件类别：分立半导体    二极管   

厂商名称：ProTek Devices

厂商官网：http://www.protekdevices.com/

下载文档
参数 预览 参数对比
器件参数
参数名称
属性值
是否Rohs认证
不符合
零件包装代码
FLIP-CHIP
包装说明
R-PBGA-B4
针数
4
Reach Compliance Code
compli
ECCN代码
EAR99
最小击穿电压
26.7 V
击穿电压标称值
26.7 V
最大钳位电压
55 V
配置
COMMON BIPOLAR TERMINAL, 3 ELEMENTS
二极管元件材料
SILICON
二极管类型
TRANS VOLTAGE SUPPRESSOR DIODE
JESD-30 代码
R-PBGA-B4
JESD-609代码
e0
湿度敏感等级
1
最大非重复峰值反向功率耗散
250 W
元件数量
3
端子数量
4
封装主体材料
PLASTIC/EPOXY
封装形状
RECTANGULAR
封装形式
GRID ARRAY
峰值回流温度（摄氏度）
245
极性
BIDIRECTIONAL
认证状态
Not Qualified
最大重复峰值反向电压
24 V
表面贴装
YES
技术
AVALANCHE
端子面层
Tin/Lead (Sn/Pb)
端子形式
BALL
端子位置
BOTTOM
处于峰值回流温度下的最长时间
NOT SPECIFIED
Base Number Matches
1
文档预览
05159
U0404FC3.3C
thru
Only One Name Means ProT
ek’Tion™
U0404FC36C
UNBUMPED FLIP CHIP ARRA
Y
APPLICA
TIONS
✔
Cellular Phones
✔
MCM Boards
✔
Wireless Communication Circuits
✔
IR LEDs
✔
SMART & PCMCIA Cards
IEC COMPA
TIBILITY
(EN61000-4)
✔
61000-4-2 (ESD): Air - 15kV, Contact - 8kV
✔
61000-4-4 (EFT): 40A - 5/50ns
FEA
TURES
✔
ESD Protection > 25 kilovolts
✔
Available in Multiple Voltage Types Ranging From 3.3V to 36V
✔
250 Watts Peak Pulse Power per Line (tp = 8/20µs)
✔
Bidirectional Configuration & Monolithic Structure
✔
Protects 1 to 3 Lines
✔
RoHS Compliant
MECHANICAL CHARACTERISTICS
✔
Standard EIA Chip Size: 0404
✔
Weight 0.73 milligrams (Approximate)
✔
Solder Reflow Temperature:
Tin-Lead - Sn/Pb: 240-245°C
Lead-Free: 260-270°C
✔
Flammability Rating UL 94V-0
✔
8mm Plastic & Paper Tape and Reel Per EIA Standard 481
✔
Device Marking On Reel
PIN CONFIGURA
TION
05159.R4 3/05
1
www.protekdevices.com
U0404FC3.3C
thru
U0404FC36C
DEVICE CHARACTERISTICS
MAXIMUM RATINGS @ 25°C Unless Otherwise Specified
PARAMETER
Peak Pulse Power (t
p
= 8/20µs) - See Figure 1
Operating Temperature
Storage Temperature
SYMBOL
P
PP
T
J
T
STG
VALUE
250
-55°C to 150°C
-55°C to 150°C
UNITS
Watts
°C
°C
ELECTRICAL CHARACTERISTICS PER LINE @ 25°C Unless Otherwise Specified
PART
NUMBER
(See Note 1)
RATED
STAND-OFF
VOLTAGE
MINIMUM
BREAKDOWN
VOLTAGE
MAXIMUM
CLAMPING
VOLTAGE
(See Fig. 2)
@ I
P
= 1A
V
C
VOLTS
7.0
9.8
13.4
19.0
24.0
43.0
64.0
MAXIMUM
CLAMPING
VOLTAGE
(See Fig. 2)
MAXIMUM
LEAKAGE
CURRENT
(See Note 2)
@V
WM
I
D
µA
75*
10**
10***
1
1
1
1
TYPICAL
CAPACITANCE
V
WM
VOLTS
U0404FC3.3C
U0404FC05C
U0404FC08C
U0404FC12C
U0404FC15C
U0404FC24C
U0404FC36C
3.3
5.0
8.0
12.0
15.0
24.0
36.0
@ 1mA
V
(BR)
VOLTS
4.0
6.0
8.5
13.3
16.7
26.7
40.0
@8/20µs
V
C
@ I
PP
12.5V @ 20A
14.7V @ 17A
19.2V @ 13A
29.7V @ 9.0A
35.7V @ 7.0A
55.0V @ 5.0A
84.0V @ 3.0A
@0V, 1 MHz
C
pF
150
100
75
50
40
30
25
Note 1:
All devices are bidirectional. Electrical characteristics apply in both directions.
Note 2:
*Maximum leakage current < 5µA @ 2.8V. **Maximum leakage current <500nA @ 3.3V. ***Maximum leakage current <200nA @ 5V.
FIGURE 1
PEAK PULSE POWER VS PULSE TIME
10,000
I
PP
- Peak Pulse Current - % of I
PP
P
PP
- Peak Pulse Current - Watts
120
100
80
60
40
20
0
t
f
FIGURE 2
PULSE WAVE FORM
Peak Value I
PP
TEST
WAVEFORM
PARAMETERS
t
f
= 8µs
t
d
= 20µs
1,000
250W, 8/20µs Waveform
e
-t
100
t
d
= t I /2
PP
10
0.01
1
10
100
t
d
- Pulse Duration - µs
1,000
10,000
0
5
10
15
t - Time - µs
20
25
30
05159.R4 3/05
2
www.protekdevices.com
U0404FC3.3C
thru
U0404FC36C
GRAPHS
FIGURE 3
POWER DERATING CURVE
Peak Pulse Power
8/20µs
100
80
% Of Rated Power
60
40
20
Average Power
0
0
25
50
75
100
125
T
L
- Lead Temperature - °C
150
FIGURE 4
OVERSHOOT & CLAMPING VOLTAGE FOR U0404FC05C
35
5 Volts per Division
25
15
5
-5
ESD Test Pulse - 25 kilovolt, 1/30ns (waveshape)
FIGURE 5
TYPICAL CLAMPING VOLTAGE VS PEAK PULSE CURRENT FOR U0404FC05C
14
12
10
8
6
4
2
0
0
5
10
I
PP
- Peak Pulse Current - Amps
05159.R4 3/05
3
www.protekdevices.com
15
20
V
C
- Clamping Voltage - Volts
U0404FC3.3C
thru
U0404FC36C
APPLICA
TION INFORMA
TION
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
Pad Size on PCB
Pad Shape
Pad Definition
Solder Mask Opening
Solder Stencil Thickness
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
Solder Paste Type
Pad Protective Finish
Tolerance - Edge To Corner Ball
Solder Ball Side Coplanarity
Maximum Dwell Time Above Liquidous (183°C)
Soldering Maximum Temperature
VALUE
0.275mm
Round
Non-Solder Mask Defined Pads
0.325mm Round
0.150mm
0.330mm Round
No Clean
OSP(Entek Cu Plus 106A)
±50µm
±20µm
60 Seconds
270°C
REQUIREMENTS
Temperature:
T
P
for Lead-Free (SnAgCu): 260-265°C
T
P
for Tin-Lead: 240-245°C
Preheat time and temperature depends on solder paste and flux
activation temperature, component size, weight, surface area &
plating.
RECOMMENDED NON-SOLDER MASK
DEFINED PAD ILLUSTRATION
Non-Solder Mask Defined Pad
0.275mm DIA.
Solder Mask Opening
0.325mm DIA.
Solder Stencil Opening
0.330mm DIA.
T
P
Ramp-up
Temperature - °C
Ramp-down
T
L
T
SMAX
155°
T
SMIN
140°
T
S
- Preheat
t 25°C to Peak
30-60 seconds
Ramp-up
15 seconds
Solder Time
15-20 seconds
Ramp-down
05159.R4 3/05
4
www.protekdevices.com
U0404FC3.3C
thru
U0404FC36C
PACKAGE OUTLINE & DIMENSIONS
PACKAGE OUTLINE
PACKAGE DIMENSIONS
DIM
A
B
C
MILLIMETERS
0.56 NOM
0.86 NOM
1.0 ± 0.02
0.15 SQ
1.0 ± 0.0254
0.406 NOM
INCHES
0.022 NOM
0.034 NOM
0.039 ± 0.001
0.006 SQ
0.039 ± 0.001
0.016 NOM
TOP
SIDE
E
F
I
B
C
A
NOTES:
1. Controlling dimensions in inches.
2. Decimal tolerances for mounting pad and
outline: .xxx ± 0.05mm (± 0.002”).
E
F
Metalized Die Contacts
END
I
MOUNTING PAD LA
YOUT - Option 1
D
PAD DIMENSIONS
DIM
A
C
D
E
F
G
H
I
NOTE:
C
A
MILLIMETERS
0.51
0.30
0.46
0.20
0.15 SQ
0.71
0.99
0.51
INCHES
0.020
0.012
0.018
0.008
0.006 SQ
0.028
0.039
0.020
DIE
SOLDER
CONTACT
H
G
E
1.
Preferred:
Using 0.1mm (0.004”) stencil.
I
SOLDER PADS
SOLDER PRINT
0.010” - 0.012” DIA.
SOLDER MASK
F
Outline & Dimensions: Rev 3 - 9/04, 06024
05159.R4 3/05
5
www.protekdevices.com
查看更多>
参数对比
与U0404FC24C相近的元器件有：U0404FC05C、U0404FC33C、U0404FC3.3C、U0404FC36C、U0404FC15C、U0404FC08C、U0404FC12C。描述及对比如下：
型号 U0404FC24C U0404FC05C U0404FC33C U0404FC3.3C U0404FC36C U0404FC15C U0404FC08C U0404FC12C
描述 UNBUMPED FLIP CHIP ARRAY UNBUMPED FLIP CHIP ARRAY UNBUMPED FLIP CHIP ARRAY UNBUMPED FLIP CHIP ARRAY UNBUMPED FLIP CHIP ARRAY UNBUMPED FLIP CHIP ARRAY UNBUMPED FLIP CHIP ARRAY UNBUMPED FLIP CHIP ARRAY
是否Rohs认证 不符合 不符合 - 不符合 不符合 不符合 不符合 不符合
零件包装代码 FLIP-CHIP FLIP-CHIP - FLIP-CHIP FLIP-CHIP FLIP-CHIP FLIP-CHIP FLIP-CHIP
包装说明 R-PBGA-B4 R-PBGA-B4 - R-PBGA-B4 R-PBGA-B4 R-PBGA-B4 R-PBGA-B4 R-PBGA-B4
针数 4 4 - 4 4 4 4 4
Reach Compliance Code compli compli - compli compli compli compli compli
ECCN代码 EAR99 EAR99 - EAR99 EAR99 EAR99 EAR99 EAR99
最小击穿电压 26.7 V 6 V - 4 V 40 V 16.7 V 8.5 V 13.3 V
击穿电压标称值 26.7 V 6 V - 4 V 40 V 16.7 V 8.5 V 13.3 V
最大钳位电压 55 V 14.7 V - 12.5 V 84 V 35.7 V 19.2 V 29.7 V
配置 COMMON BIPOLAR TERMINAL, 3 ELEMENTS COMMON BIPOLAR TERMINAL, 3 ELEMENTS - COMMON BIPOLAR TERMINAL, 3 ELEMENTS COMMON BIPOLAR TERMINAL, 3 ELEMENTS COMMON BIPOLAR TERMINAL, 3 ELEMENTS COMMON BIPOLAR TERMINAL, 3 ELEMENTS COMMON BIPOLAR TERMINAL, 3 ELEMENTS
二极管元件材料 SILICON SILICON - SILICON SILICON SILICON SILICON SILICON
二极管类型 TRANS VOLTAGE SUPPRESSOR DIODE TRANS VOLTAGE SUPPRESSOR DIODE - TRANS VOLTAGE SUPPRESSOR DIODE TRANS VOLTAGE SUPPRESSOR DIODE TRANS VOLTAGE SUPPRESSOR DIODE TRANS VOLTAGE SUPPRESSOR DIODE TRANS VOLTAGE SUPPRESSOR DIODE
JESD-30 代码 R-PBGA-B4 R-PBGA-B4 - R-PBGA-B4 R-PBGA-B4 R-PBGA-B4 R-PBGA-B4 R-PBGA-B4
JESD-609代码 e0 e0 - e0 e0 e0 e0 e0
湿度敏感等级 1 1 - 1 1 1 1 1
最大非重复峰值反向功率耗散 250 W 250 W - 250 W 250 W 250 W 250 W 250 W
元件数量 3 3 - 3 3 3 3 3
端子数量 4 4 - 4 4 4 4 4
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装形状 RECTANGULAR RECTANGULAR - RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 GRID ARRAY GRID ARRAY - GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY
峰值回流温度（摄氏度） 245 245 - 245 245 245 245 245
极性 BIDIRECTIONAL BIDIRECTIONAL - BIDIRECTIONAL BIDIRECTIONAL BIDIRECTIONAL BIDIRECTIONAL BIDIRECTIONAL
认证状态 Not Qualified Not Qualified - Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
最大重复峰值反向电压 24 V 5 V - 3.3 V 36 V 15 V 8 V 12 V
表面贴装 YES YES - YES YES YES YES YES
技术 AVALANCHE AVALANCHE - AVALANCHE AVALANCHE AVALANCHE AVALANCHE AVALANCHE
端子面层 Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) - Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
端子形式 BALL BALL - BALL BALL BALL BALL BALL
端子位置 BOTTOM BOTTOM - BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
Base Number Matches 1 1 - 1 1 1 1 1
热门器件
热门资源推荐
EEWORLD大学堂----直播回放：ROHM 罗姆 DC/DC 转换器设计研讨会 有奖闯关：TI汽车照明知识关卡已就绪~老将出马，万夫难闯？ 场效应管恒流源 单片机通过继电器控制交流220V的输出 ADI & 世健 带您了解 化学分析和分析仪器应用方案 答题赢好礼！ DIY-小板凳（处女作） 研究可以不坐着吗？ 本站的电子资源很丰富 今天上午十点在线直播【瑞萨电子安全物联网套件为您提供安全云联接解决方案 EEWORLD大学堂----直播回放: C2000? F280013x实现更低成本且更高效的实时控制方案
PIC单片机控制的遥控防盗报警器电路 红外线探测报警器 使用ESP8266从NTP服务器获取时间并在OLED显示器上显示 开关电源的基本组成及工作原理 用NE555制作定时器 RS-485基础知识:处理空闲总线条件的两种常见方法 如何构建一个触摸传感器电路 如何调制IC555振荡器 基于ICL296的大电流开关稳压器电源电路 基于TDA2003的简单低功耗汽车立体声放大器电路
器件捷径:
E0 E1 E2 E3 E4 E5 E6 E7 E8 E9 EA EB EC ED EE EF EG EH EI EJ EK EL EM EN EO EP EQ ER ES ET EU EV EW EX EY EZ F0 F1 F2 F3 F4 F5 F6 F7 F8 F9 FA FB FC FD FE FF FG FH FI FJ FK FL FM FN FO FP FQ FR FS FT FU FV FW FX FY FZ G0 G1 G2 G3 G4 G5 G6 G7 G8 G9 GA GB GC GD GE GF GG GH GI GJ GK GL GM GN GO GP GQ GR GS GT GU GV GW GX GZ H0 H1 H2 H3 H4 H5 H6 H7 H8 HA HB HC HD HE HF HG HH HI HJ HK HL HM HN HO HP HQ HR HS HT HU HV HW HX HY HZ I1 I2 I3 I4 I5 I6 I7 IA IB IC ID IE IF IG IH II IK IL IM IN IO IP IQ IR IS IT IU IV IW IX J0 J1 J2 J6 J7 JA JB JC JD JE JF JG JH JJ JK JL JM JN JP JQ JR JS JT JV JW JX JZ K0 K1 K2 K3 K4 K5 K6 K7 K8 K9 KA KB KC KD KE KF KG KH KI KJ KK KL KM KN KO KP KQ KR KS KT KU KV KW KX KY KZ
需要登录后才可以下载。
登录取消