Zener diode
UDZS8.2B
Applications
Constant voltage control
Features
1) Compact, 2-pin mini-mold type for
high-density mounting. (UMD2)
2) High reliability.
3) Can be mounted automatically,
using chip mounter.
Dimensions
(Unit : mm)
1.25±0.1
0.1±0.1
0.05
Land
size figure
(Unit : mm)
Construction
Silicon epitaxial planar
Absolute
maximum ratings
(Ta=25C)
N
Parameter
Power dissipation
Junction temperature
Storage temperature
Operating temperature
ot
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1.7±0.1
2.5±0.2
UMD2
0.3±0.05
0.7±0.2
0.1
Structure
ROHM : UMD2
JEDEC : S0D-323
JEITA : SC-90/A
dot (year week factory)
EX. UDZS3.6B
Taping specifications
(Unit : mm)
4.0±0.1
2.0±0.05
φ1.55±0.05
0.3±0.1
3.5±0.05 1.75±0.1
8.0±0.2
1.40±0.1
4.0±0.1
φ1.05
2.75
2.8±0.1
1.0±0.1
R
Symbol
P
Tj
Tstg
Topr
Limits
200
150
-55 to +150
-55 to +150
Unit
mW
℃
℃
℃
1/4
2012.02 - Rev.D
2.1
or
0.9MIN.
0.8MIN.
UDZS8.2B
Electrical
characteristics
(Ta=25C)
Symbol
TYP.
Zener voltage
：Vz(V)
Operating resistance
：Zz(Ω)
Rising operataing
resistance
：Zz(Ω)
Reverse current
：
IR(uA)
Data Sheet
Type
No.
TYPE
UDZS
3.6B
UDZS
3.9B
UDZS
4.3B
UDZS
4.7B
UDZS
5.1B
UDZS
5.6B
UDZS
6.2B
UDZS
6.8B
UDZS
7.5B
UDZS
8.2B
UDZS
9.1B
UDZS
10B
UDZS
11B
N
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TYPE NO.
Iz(mA)
MAX.
Iz(mA)
MAX. Iz(mA)
MAX.
UDZS 3.6B
5.0
100
5.0
1000
10.0
1.0
UDZS 3.9B
5.0
100
5.0
1000
5.0
1.0
UDZS 4.3B 4.170
5.0
5.0
5.0
4.430
100
1000
1.0
UDZS 4.7B 4.550
5.0
5.0
2.0
4.750
100
800
0.5
UDZS 5.1B 4.980
5.0
5.0
2.0
5.200
80
500
0.5
UDZS 5.6B 5.490
5.0
5.0
1.0
5.730
60
200
0.5
UDZS 6.2B 6.060
5.0
5.0
1.0
6.330
60
100
0.5
UDZS 6.8B 6.650
5.0
5.0
0.5
6.930
40
60
0.5
UDZS 7.5B 7.280
5.0
5.0
0.5
7.600
30
60
0.5
UDZS 8.2B 8.020
5.0
5.0
0.5
8.360
30
60
0.5
UDZS 9.1B 8.850
5.0
5.0
0.5
9.230
30
60
0.5
UDZS 10B
5.0
5.0
0.1
9.770
10.210
30
60
0.5
UDZS 11B 10.760
5.0
5.0
0.1
11.220
30
60
0.5
0.1
UDZS 12B 11.740
5.0
5.0
0.5
12.240
30
80
UDZS 13B 12.910
5.0
5.0
0.1
13.490
37
80
0.5
UDZS 15B 14.340
5.0
5.0
0.1
14.980
42
80
0.5
UDZS 16B 15.850
5.0
5.0
0.1
16.510
50
80
0.5
UDZS 18B 17.560
5.0
5.0
0.1
18.350
65
80
0.5
UDZS 20B 19.520
5.0
85
5.0
0.1
20.390
100
0.5
UDZS 22B 21.540
5.0
100
5.0
0.1
22.470
100
0.5
UDZS 24B 23.720
5.0
120
5.0
0.1
24.780
120
0.5
UDZS 27B 26.190
5.0
150
5.0
0.1
27.530
150
0.5
UDZS 30B 29.190
5.0
200
5.0
0.1
30.690
200
0.5
5.0
250
5.0
0.1
UDZS 33B 32.150
33.790
250
0.5
UDZS 36B 35.070
36.870
5.0
300
5.0
300
0.5
0.1
(
１
)The zener voltage(Vz) is measured 40ms after power is supplied.
(
２
)The operating resistances(Zz,Zzk) are measured by superimposing a minute alternating current
on the regulated current(Iz)
MIN.
3.600
3.890
MAX.
3.845
4.160
VR(V)
1.0
1.0
1.0
1.0
1.5
2.5
3.0
3.5
4.0
5.0
6.0
7.0
8.0
9.0
10.0
11.0
12.0
13.0
15.0
17.0
19.0
21.0
23.0
25.0
27.0
62
72
82
92
A2
C2
E2
F2
H2
J2
L2
05
15
TYPE
UDZS
12B
UDZS
13B
UDZS
15B
UDZS
16B
UDZS
18B
UDZS
20B
UDZS
22B
UDZS
24B
UDZS
27B
UDZS
30B
UDZS
33B
UDZS
36B
TYPE NO.
25
35
45
55
65
75
85
95
A5
C5
E5
F5
R
2/4
or
2012.02 - Rev.D
UDZS8.2B
Electrical
characteristic curves
(Ta=25C)
10
Data Sheet
1
ZENER CURRENT:Iz(mA)
0.1
4.7
0.01
4.3
3.9
3.6
0.001
0
250
POWER DISSIPATION:Pd(mW)
200
150
100
0.12
0.1
TEMP.COEFFICIENCE:γz(％/℃)
0.08
0.06
0.04
0.02
30
25
20
15
10
5
0
-5
TRANSIENT
THAERMAL IMPEDANCE:Rth (℃/W)
TEMP.COEFFICIENCE:γz(mV/℃)
ot
N
-0.02
-0.04
-0.06
-0.08
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5.1
5.6
6.8
6.2
7.5
8.2 9.1
10
11 12 13 15
16
18
20
22
24
27
30
33
36
5
10
15
20
25
30
35
40
ZENER VOLTAGE:Vz(V)
Vz-Iz CHARACTERISTICS
10000
REVERSE SURGE MAXIMUM
POWER:PRSM(W)
1000
PRSM
t
100
10
50
1
0
0
25
50
75
100
125
150
0.1
0.001
0.01
0.1
1
10
100
AMBIENT TEMPERATURE:Ta(℃)
Pd-Ta CHARACTERISTICS
TIME:t(ms)
PRSM-TIME CHARACTERISTICS
40
35
1000
Rth(j-a)
100
Rth(j-c)
10
0
Mounted on epoxy board
IM=10mA
IF=100mA
R
1
1ms
time
300us
0
10
20
30
ZENER VOLTAGE：Vz(V)
γz-Vz CHARACTERISTICS
40
0.1
0.001
0.01
1
10
100
TIME:t(s)
Rth-t CHARACTERISTICS
0.1
1000
3/4
or
2012.02 - Rev.D
UDZS8.2B
Data Sheet
10
Ta=-25℃
100
10
REVERSE CURRENT:IR (nA)
Ta=125℃
100
f=1MHz
CAPACITANCE BETWEEN
TERMINALS:Ct(pF)
ZENER CURRENT:Iz(mA)
1
Ta=25℃
Ta=75℃
Ta=75℃
1
0.1
0.01
0.001
0.0001
Ta=25℃
0.1
Ta=125℃
10
Ta=-25℃
0.01
0.001
7
7.5
8
8.5
ZENER VOLTAGE:Vz(V)
Vz-Iz CHARACTERISTICS
9
1
1
2
3
4
5
0
1
8.5
CAPACITANCE
BETWEENTERMINALS:Ct(pF)
8.4
ZENER VOLTAGE:Vz(Ｖ)
8.3
8.2
8.1
8
1000
100
10
1
0.1
N
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1
30
29
28
27
26
25
24
23
22
21
20
REVERSE CURRENT:IR(nA)
Ta=25℃
IZ=5mA
n=30pcs
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
Ta=25℃
VR=5.0V
n=30pcs
AVE:24.75pF
AVE:0.074nA
AVE:8.206V
0
Vz DISPERSION MAP
IR DISPERSION MAP
1
ZENER CURRENT(mA)
Zz-Iz CHARACTERISTICS
10
REVERSE VOLTAGE：VR(V)
VR-IR CHARACTERISTICS
R
DYNAMIC IMPEDANCE:Zz(Ω)
4/4
or
2
3
4
5
REVERSE VOLTAGE:VR(V)
VR-Ct CHARACTERISTICS
Ta=25℃
f=1MHz
VR=0V
n=10pcs
Ct DISPERSION MAP
2012.02 - Rev.D
Datasheet
Notice
Precaution on using ROHM Products
1.
Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
(Note 1)
, transport
intend to use our Products in devices requiring extremely high reliability (such as medical equipment
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅢ
CLASSⅣ
CLASSⅢ
2.
ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl
2
,
H
2
S, NH
3
, SO
2
, and NO
2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
3.
5.
6.
Please verify and confirm characteristics of the final or mounted products in using the Products.
N
ot
In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7.
De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
Confirm that operation temperature is within the specified range described in the product specification.
ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
8.
9.
Precaution for Mounting / Circuit board design
1.
2.
When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E
© 2015 ROHM Co., Ltd. All rights reserved.
R
4.
The Products are not subject to radiation-proof design.
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Rev.001
