IC,MICROCONTROLLER,4-BIT,UPD17K CPU,CMOS,QFP,52PIN,PLASTIC
器件类别:嵌入式处理器和控制器 微控制器和处理器
厂商名称:Renesas(瑞萨电子)
器件标准:
下载文档型号 | UPD17203AGC-XXX-3BH-A | UPD17204GC-XXX-3BH | UPD17204GC-XXX-3BH-A | UPD17203AGC-XXX-3BH |
---|---|---|---|---|
描述 | IC,MICROCONTROLLER,4-BIT,UPD17K CPU,CMOS,QFP,52PIN,PLASTIC | 4-BIT, MROM, 8MHz, MICROCONTROLLER, PQFP52, 14 X 14 MM, PLASTIC, QFP-52 | IC,MICROCONTROLLER,4-BIT,UPD17K CPU,CMOS,QFP,52PIN,PLASTIC | 4-BIT, MROM, 8MHz, MICROCONTROLLER, PQFP52, 14 X 14 MM, PLASTIC, QFP-52 |
是否Rohs认证 | 符合 | 不符合 | 符合 | 不符合 |
包装说明 | QFP, QFP52,.7SQ,40 | QFP, QFP52,.7SQ,40 | QFP, QFP52,.7SQ,40 | QFP, QFP52,.7SQ,40 |
Reach Compliance Code | unknown | unknown | unknown | unknown |
位大小 | 4 | 4 | 4 | 4 |
CPU系列 | UPD17K | UPD17K | UPD17K | UPD17K |
JESD-30 代码 | S-PQFP-G52 | S-PQFP-G52 | S-PQFP-G52 | S-PQFP-G52 |
端子数量 | 52 | 52 | 52 | 52 |
最高工作温度 | 70 °C | 75 °C | 70 °C | 75 °C |
最低工作温度 | -20 °C | -20 °C | -20 °C | -20 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | QFP | QFP | QFP | QFP |
封装等效代码 | QFP52,.7SQ,40 | QFP52,.7SQ,40 | QFP52,.7SQ,40 | QFP52,.7SQ,40 |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | FLATPACK | FLATPACK | FLATPACK | FLATPACK |
电源 | 2.2/5.5 V | 2.2/5.5 V | 2.2/5.5 V | 2.2/5.5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
RAM(字节) | 168 | 168 | 168 | 168 |
ROM(单词) | 4096 | 7936 | 7936 | 4096 |
ROM可编程性 | MROM | MROM | MROM | MROM |
表面贴装 | YES | YES | YES | YES |
技术 | CMOS | MOS | CMOS | MOS |
温度等级 | COMMERCIAL | COMMERCIAL EXTENDED | COMMERCIAL | COMMERCIAL EXTENDED |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 1 mm | 1 mm | 1 mm | 1 mm |
端子位置 | QUAD | QUAD | QUAD | QUAD |
最大压摆率 | 2 mA | - | 2 mA | 2 mA |