Standard SRAM, 64KX1, 15ns, CMOS, PDIP22, 0.300 INCH, PLASTIC, DIP-22
厂商名称:NEC(日电)
下载文档型号 | UPD4361BCR-15 | UPD4361BCR-12 | UPD4361BLA-15 | UPD4361BLA-12 | UPD4361BCR-20 |
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描述 | Standard SRAM, 64KX1, 15ns, CMOS, PDIP22, 0.300 INCH, PLASTIC, DIP-22 | Standard SRAM, 64KX1, 12ns, CMOS, PDIP22, 0.300 INCH, PLASTIC, DIP-22 | Standard SRAM, 64KX1, 15ns, CMOS, PDSO24, 0.300 INCH, PLASTIC, SOJ-24 | Standard SRAM, 64KX1, 12ns, CMOS, PDSO24, 0.300 INCH, PLASTIC, SOJ-24 | Standard SRAM, 64KX1, 20ns, CMOS, PDIP22, 0.300 INCH, PLASTIC, DIP-22 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
包装说明 | 0.300 INCH, PLASTIC, DIP-22 | 0.300 INCH, PLASTIC, DIP-22 | 0.300 INCH, PLASTIC, SOJ-24 | 0.300 INCH, PLASTIC, SOJ-24 | DIP, |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant |
最长访问时间 | 15 ns | 12 ns | 15 ns | 12 ns | 20 ns |
JESD-30 代码 | R-PDIP-T22 | R-PDIP-T22 | R-PDSO-J24 | R-PDSO-J24 | R-PDIP-T22 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 |
内存密度 | 65536 bit | 65536 bit | 65536 bit | 65536 bit | 65536 bit |
内存集成电路类型 | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
内存宽度 | 1 | 1 | 1 | 1 | 1 |
功能数量 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 22 | 22 | 24 | 24 | 22 |
字数 | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words |
字数代码 | 64000 | 64000 | 64000 | 64000 | 64000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
组织 | 64KX1 | 64KX1 | 64KX1 | 64KX1 | 64KX1 |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | DIP | DIP | SOJ | SOJ | DIP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 5.08 mm | 5.08 mm | 3.7 mm | 3.7 mm | 5.08 mm |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | NO | YES | YES | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子面层 | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | J BEND | J BEND | THROUGH-HOLE |
端子节距 | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 7.62 mm | 7.62 mm | 7.57 mm | 7.57 mm | 7.62 mm |
端口数量 | 1 | 1 | 1 | 1 | - |
可输出 | NO | NO | NO | NO | - |
厂商名称 | - | NEC(日电) | NEC(日电) | NEC(日电) | NEC(日电) |