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UPD75116FGF-XXX-3BE

Microcontroller, 4-Bit, MROM, MOS, PQFP64, 14 X 20 MM, PLASTIC, QFP-64

器件类别:嵌入式处理器和控制器    微控制器和处理器   

厂商名称:NEC(日电)

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器件参数
参数名称
属性值
是否Rohs认证
不符合
厂商名称
NEC(日电)
零件包装代码
QFP
包装说明
QFP,
针数
64
Reach Compliance Code
compliant
具有ADC
NO
地址总线宽度
位大小
4
最大时钟频率
5 MHz
DAC 通道
NO
DMA 通道
NO
外部数据总线宽度
JESD-30 代码
R-PQFP-G64
JESD-609代码
e0
长度
20 mm
I/O 线路数量
54
端子数量
64
最高工作温度
50 °C
最低工作温度
-40 °C
PWM 通道
NO
封装主体材料
PLASTIC/EPOXY
封装代码
QFP
封装形状
RECTANGULAR
封装形式
FLATPACK
峰值回流温度(摄氏度)
NOT SPECIFIED
认证状态
Not Qualified
ROM可编程性
MROM
座面最大高度
3 mm
最大供电电压
5 V
最小供电电压
2 V
表面贴装
YES
技术
MOS
温度等级
OTHER
端子面层
TIN LEAD
端子形式
GULL WING
端子节距
1 mm
端子位置
QUAD
处于峰值回流温度下的最长时间
NOT SPECIFIED
宽度
14 mm
uPs/uCs/外围集成电路类型
MICROCONTROLLER
Base Number Matches
1
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DATA SHEET
MOS INTEGRATED CIRCUIT
µ
PD75108F,75112F,75116F
4-BIT SINGLE-CHIP MICROCOMPUTER
DESCRIPTION
The
µ
PD75116F offers high-speed operation (t
CY
= 1.91
µ
s) at a low supply voltage (V
DD
= 2.7 V) which is not possible
with the
µ
PD75116.
It has the same functions as, and is pin compatible with, the
µ
PD75116, allowing low voltage sets to be developed
by making efficient use of previously developed and used software resources. Note, however, that the operating
voltage range is different from that of the
µ
PD75116.
A version of the
µ
PD75116F with on-chip PROM, the
µ
PD75P116*, is also available for evaluation during system
development.
*
There are some differences in electrical specifications between the
µ
PD75116F and the
µ
PD75P116.
Functions are described in detail in the following User’s Manual, which should be read when carrying out design
work.
µ
PD75116 User’s Manual : IEM-922
FEATURES
µ
PD75116 low voltage high-speed operation product
• Instruction execution time
Ta = –40 to +50
°C
V
DD
= 2.7 to 5.0 V
1.91
µ
s , 15.3
µ
s (operation at 4.19 MHz)
2
µ
s, 4
µ
s, 32
µ
s (operation at 2 MHz)
1.91
µ
s , 15.3
µ
s (operation at 4.19 MHz)
2
µ
s, 4
µ
s, 32
µ
s (operation at 2 MHz)
0.95
µ
s, 1.91
µ
s, 15.3
µ
s (operation at 4.19 MHz)
Ta = –40 to +60
°C
V
DD
= 2.8 to 5.0 V
V
DD
= 4.5 to 5.0 V
43 systematically arranged instructions
• 8-bit data transfer, compare, operation and increment/decrement instructions
• GETI instruction allowing any 2-byte or 3-byte instruction to be implemented in 1 byte
Wide range of input/output ports : 58 ports
3 on-chip 8-bit timer channels : synchronous/asynchronous (start/stop)
8-bit serial interface on chip
Programmable threshold port : 4-bit resolution
×
4 channels
"Unless there are any particular functional differences, the
µPD75116F
is described in this document as a representative
product."
The information in this document is subject to change without notice.
Document No. IC-2810B
(O.D.No. IC-8224B)
Date Published April 1994P
Printed in Japan
The mark
5
shows major revised points.
© NEC Corporation 1991
µ
PD75108F,75112F,75116F
ORDERING INFORMATION
Ordering Code
Package
64-pin plastic QFP (14
×
12 mm)
64-pin plastic QFP (14
×
12 mm)
64-pin plastic QFP (14
×
20 mm)
Quality Grade
Standard
Standard
Standard
µ
PD75108FGF-×××-3BE
µ
PD75112FGF-×××-3BE
µ
PD75116FGF-×××-3BE
Remarks
×××:
ROM code number
Please refer to "Quality grade on NEC Semiconductor Devices" (Document number IEI-1209) published by
NEC Corporation to know the specification of quality grade on the devices and its recommended applications.
APPLICATIONS
Cordless telephone subsets, portable radio equipment, pager, etc.
2
µ
PD75108F,75112F,75116F
OVERVIEW OF FUNCTIONS
Item
Basic instructions
43
Contents
Instruction cycle
0.95
µ
s, 1.91
µ
s, 15.3
µ
s (V
DD
= 4.5 to 5.0 V, 4.19 MHz operation)
2
µ
s, 4
µ
s, 32
µ
s (V
DD
= 2.7 to 5.0 V, 2 MHz operation)
3-stage switching capability
0.95
µ
s (operating at 4.5 to 5.0 V)
1.91
µ
s (operating at 2.7 V )
8064
×
8 bits (
µ
PD75108F)
Minimum instruction
execution time
On-chip memory
ROM
12160
×
8 bits (
µ
PD75112F)
16256
×
8 bits (
µ
PD75116F)
RAM
General register
Accumulator
512
×
4 bits
4-bits
×
8
×
4 banks (memory mapping)
3 accumulators for different manipulated data lengths
• 1-bit accumulator (CY), 4–bit acculumalor (A), 8-bit accumulator (XA)
Total 58
• CMOS input pins
: 10
• CMOS input/output pins (LED direct drive capability)
: 32
• Middle-high voltage N-ch open-drain input/output pins : 12
(LED direct drive capability, a pull-up resistor can be incorporated bit-wise.)
• Comparator input pins (4-bit precision)
: 4
• 8-bit timer/event counter
×
2
• 8-bit basic interval timer (watchdog timer applicable)
• 2 transfer modes
• Serial transmission/reception modes
• Serial reception mode
• LSB top/MSB top switchable
External : 3 Internal : 4
Input/output port
Timer/counter
8-bit serial interface
Vector interrupt
Test input
Standby
External : 2
• STOP/HALT mode
• Various bit manipulation instructions (set, reset, test, Boolean operation)
Instruction set
• 8-bit data transfer, comparison, operation, increment/decrement instructions
• 1-byte relative branch instruction
• GETI instruction that can implement arbitrary 2-byte/3-byte instructions with 1 byte
• Bit manipulation memory (bit sequential buffer) on chip
• 64-pin plastic QFP (14
×
20 mm)
Others
Package
3
µ
PD75108F,75112F,75116F
CONTENTS
1.
2.
3.
PIN CONFIGURATION (TOP VIEW) .....................................................................................................
BLOCK DIAGRAM ..................................................................................................................................
PIN FUNCTIONS ....................................................................................................................................
3.1
3.2
3.3
3.4
3.5
PORT PINS .....................................................................................................................................................
OTHER PINS ...................................................................................................................................................
PIN INPUT/OUTPUT CIRCUITS ...................................................................................................................
RECOMMENDED CONNECTION OF UNUSED PINS .................................................................................
PRECAUTIONS CONCERNING P00/INT4 PIN AND RESET PIN ...............................................................
6
7
8
8
9
10
11
12
4.
5.
MEMORY CONFIGURATION ................................................................................................................ 13
PERIPHERAL HARDWARE FUNCTIONS .............................................................................................. 18
5.1
5.2
5.3
5.4
5.5
5.6
5.7
5.8
DIGITAL INPUT/OUTPUT PORTS ................................................................................................................
CLOCK GENERATOR .....................................................................................................................................
CLOCK OUTPUT CIRCUIT .............................................................................................................................
BASIC INTERVAL TIMER ..............................................................................................................................
TIMER/EVENT COUNTER .............................................................................................................................
SERIAL INTERFACE .......................................................................................................................................
PROGRAMMABLE THRESHOLD PORT (ANALOG INPUT PORT) ............................................................
BIT SEQUENTIAL BUFFER ...........................................................................................................................
18
19
20
21
21
23
25
26
6.
7.
8.
9.
INTERRUPT FUNCTION ........................................................................................................................ 27
STANDBY FUNCTION ........................................................................................................................... 29
RESET FUNCTION ................................................................................................................................. 30
INSTRUCTION SET ................................................................................................................................ 32
10. APPLICATION EXAMPLE ...................................................................................................................... 41
10.1 CORDLESS TELEPHONE (SUBSET) ............................................................................................................
10.2 DISPLAY PAGER ............................................................................................................................................
41
42
11. MASK OPTION SELECTION .................................................................................................................. 43
12. ELECTRICAL SPECIFICATIONS ............................................................................................................ 44
12.1 WHEN Ta = –40 to +50
°C,
V
DD
= 2.7 to 5.0 V ...........................................................................................
12.2 WHEN Ta = –40 to +60
°C,
V
DD
= 2.8 to 5.0 V ...........................................................................................
45
55
4
µ
PD75108F,75112F,75116F
13. CHARACTERISTIC CURVES (REFERENCE) ......................................................................................... 65
14.
PACKAGE INFORMATION .....................................................................................................................................
71
15. RECOMMENDED SOLDERING CONDITIONS ..................................................................................... 73
APPENDIX A. FUNCTIONAL DIFFERENCES AMONG
µ
PD751×× SERIES PRODUCTS ....................... 74
APPENDIX B. DEVELOPMENT TOOLS ...................................................................................................... 76
APPENDIX C. RELATED DOCUMENTS ..................................................................................................... 77
5
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参数对比
与UPD75116FGF-XXX-3BE相近的元器件有:UPD75108FGF-XXX-3BE、UPD75112FGF-XXX-3BE。描述及对比如下:
型号 UPD75116FGF-XXX-3BE UPD75108FGF-XXX-3BE UPD75112FGF-XXX-3BE
描述 Microcontroller, 4-Bit, MROM, MOS, PQFP64, 14 X 20 MM, PLASTIC, QFP-64 Microcontroller, 4-Bit, MROM, MOS, PQFP64, 14 X 20 MM, PLASTIC, QFP-64 Microcontroller, 4-Bit, MROM, MOS, PQFP64, 14 X 20 MM, PLASTIC, QFP-64
是否Rohs认证 不符合 不符合 不符合
厂商名称 NEC(日电) NEC(日电) NEC(日电)
零件包装代码 QFP QFP QFP
包装说明 QFP, QFP, 14 X 20 MM, PLASTIC, QFP-64
针数 64 64 64
Reach Compliance Code compliant compliant compliant
具有ADC NO NO NO
位大小 4 4 4
最大时钟频率 5 MHz 5 MHz 5 MHz
DAC 通道 NO NO NO
DMA 通道 NO NO NO
JESD-30 代码 R-PQFP-G64 R-PQFP-G64 R-PQFP-G64
JESD-609代码 e0 e0 e0
长度 20 mm 20 mm 20 mm
I/O 线路数量 54 54 54
端子数量 64 64 64
最高工作温度 50 °C 50 °C 50 °C
最低工作温度 -40 °C -40 °C -40 °C
PWM 通道 NO NO NO
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 QFP QFP QFP
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 FLATPACK FLATPACK FLATPACK
峰值回流温度(摄氏度) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
认证状态 Not Qualified Not Qualified Not Qualified
ROM可编程性 MROM MROM MROM
座面最大高度 3 mm 3 mm 3 mm
最大供电电压 5 V 5 V 5 V
最小供电电压 2 V 2 V 2 V
表面贴装 YES YES YES
技术 MOS MOS MOS
温度等级 OTHER OTHER OTHER
端子面层 TIN LEAD TIN LEAD TIN LEAD
端子形式 GULL WING GULL WING GULL WING
端子节距 1 mm 1 mm 1 mm
端子位置 QUAD QUAD QUAD
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
宽度 14 mm 14 mm 14 mm
uPs/uCs/外围集成电路类型 MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER
Base Number Matches 1 1 -
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