型号
- 型号
- 关键词
| 型号 | UPD7757C | UPD7755C | UPD7755G | UPD7756C | UPD7756G | UPD7757G | UPD7758C | UPD7758G |
|---|---|---|---|---|---|---|---|---|
| 描述 | Speech Synthesizer, 24s, CMOS, PDIP18, 0.300 INCH, PLASTIC, DIP-18 | Speech Synthesizer, 4s, CMOS, PDIP18, 0.300 INCH, PLASTIC, DIP-18 | Speech Synthesizer, 4s, CMOS, PDSO24, 0.450 INCH, PLASTIC, SOP-24 | Speech Synthesizer, 12s, CMOS, PDIP18, 0.300 INCH, PLASTIC, DIP-18 | Speech Synthesizer, 12s, CMOS, PDSO24, 0.450 INCH, PLASTIC, SOP-24 | Speech Synthesizer, 24s, CMOS, PDSO24, 0.450 INCH, PLASTIC, SOP-24 | Speech Synthesizer, 48s, CMOS, PDIP18, 0.300 INCH, PLASTIC, DIP-18 | Speech Synthesizer, 48s, CMOS, PDSO24, 0.450 INCH, PLASTIC, SOP-24 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 包装说明 | 0.300 INCH, PLASTIC, DIP-18 | 0.300 INCH, PLASTIC, DIP-18 | 0.450 INCH, PLASTIC, SOP-24 | 0.300 INCH, PLASTIC, DIP-18 | 0.450 INCH, PLASTIC, SOP-24 | 0.450 INCH, PLASTIC, SOP-24 | 0.300 INCH, PLASTIC, DIP-18 | 0.450 INCH, PLASTIC, SOP-24 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
| 商用集成电路类型 | SPEECH SYNTHESIZER | SPEECH SYNTHESIZER | SPEECH SYNTHESIZER | SPEECH SYNTHESIZER | SPEECH SYNTHESIZER | SPEECH SYNTHESIZER | SPEECH SYNTHESIZER | SPEECH SYNTHESIZER |
| JESD-30 代码 | R-PDIP-T18 | R-PDIP-T18 | R-PDSO-G24 | R-PDIP-T18 | R-PDSO-G24 | R-PDSO-G24 | R-PDIP-T18 | R-PDSO-G24 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 18 | 18 | 24 | 18 | 24 | 24 | 18 | 24 |
| 片上内存类型 | ROM | ROM | ROM | ROM | ROM | ROM | ROM | ROM |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 最低工作温度 | -10 °C | -10 °C | -10 °C | -10 °C | -10 °C | -10 °C | -10 °C | -10 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | DIP | SOP | DIP | SOP | SOP | DIP | SOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最长读取时间 | 24 s | 4 s | 4 s | 12 s | 12 s | 24 s | 48 s | 48 s |
| 座面最大高度 | 5.08 mm | 5.08 mm | 2.5 mm | 5.08 mm | 2.5 mm | 2.5 mm | 5.08 mm | 2.5 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
| 表面贴装 | NO | NO | YES | NO | YES | YES | NO | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE | GULL WING |
| 端子节距 | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 7.62 mm | 7.62 mm | 8.4 mm | 7.62 mm | 8.4 mm | 8.4 mm | 7.62 mm | 8.4 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
