UW Series
FEATURES
•
•
•
•
•
•
•
Resistances from 0.01 to 91kOhms
Tolerance to ±0.01%
Low Temperature Coefficient
Power Rating to 15Watts
All Welded Resistance Element
Non-Inductive Windings are Available
Flameproof Inorganic Construction
TABLE 1—SPECIFICATIONS
Tolerances
Temperature Coefficient
±0.01% to ±10% ( 1% Standard )
>10W : ±20ppm/K
1W to10W : ±50ppm/K
<1W : Call Factory
-55°C to +275°C
1500 VAC
Centerless ground ceramic core
Tinned copper or copperweld leads
High temperature / inorganic potting compound
All welded terminations
Temperature Range
Dielectric Strength
Constuction
Environmental Performance
(MIL-STD 202)
DR
±0.2% + 0.05W
±1% + 0.05W
±0.2% + 0.05W
±0.2% + 0.05W
±0.2% + 0.05W
±0.2% + 0.05W
±0.1% + 0.05W
±0.1% + 0.05W
Dielectric
Load Life
Storage
Moisture Resistance
Thermal Shock
5X Overload ( 5s )
Shock
Vibration
FIGURE 1—DERATING
Power Derating Curve
120
100
Power ( % )
80
60
40
20
0
0
50
100
150
200
250
300
350
Ambient Temperature (°C)
ORDERING INFORMATION
Part Number - Resistance - Tolerance - TCR ( If not standard )
UW-5 100 Ohm 1%
For Non-Inductive Windings / insert the letter “N” ( i.e. UWN-5 )
Document No.: 64329
Revision: 31-01-2015
For technical questions,
contact
powertron@vpgsensors.com
www.powertron.de
1
UW Series
TABLE 1—SPECIFICATIONS (continued)
Power Rat-
ing
W @ 70°C
Resistance
1
Range
0.01 to 22k
0.01 to 22k
0.01 to 45k
0.01 to 65k
0.01 to 91k
Type
UW-2
UW-3
UW-5
UW-10
UW-15
1
2
L
±0.04 [±1.0]
0.700 [17.8]
0.875 [22.2]
0.875 [22.2]
1.875 [48]
1.875 [48]
H
±0.04 [±1.0]
0.245 [6.2]
0.312 [7.9]
0.375 [9.5]
0.375 [9.5]
0.500 [12.7]
HS
±0.04 [±1.0]
0.300 [7.6]
0.375 [9.5]
0.437 [11.1]
0.500 [12.7]
0.625 [15.9]
W
0.255 [6.5]
0.312 [7.9]
0.375 [9.5]
0.375 [9.5]
0.500 [12.7]
d
2
0.032 [0.8]
0.032 [0.8]
0.032 [0.8]
0.040 [1.0]
0.040 [1.0]
±0.015 [±0.4] ±0.015 [±0.4]
2
3
5
10
15
For non-inductive windings / divide maximum resistance by 2
Lead Diameter: 18 AWG = 0.040” / 20 AWG = 0.032”
www.powertron.de
2
For technical questions,
contact
powertron@vpgsensors.com
Document No.: 64329
Revision: 31-01-2015
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Document No.: 63999
Revision: 15-Jul-2014
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1
嵌入式系统
