VEMI65A6-FC2
Vishay Semiconductors
6-channel Flip-Chip EMI Filter with ESD-Protection
Features
•
•
•
•
•
•
•
•
Ultra compact Flip-Chip package
In-line pinning
3 dB Cut-off frequency = 60 MHz
Series resistance 100 Ohms
Low leakage current
ESD protection to
IEC 61000-4-2
±
30 kV
Lead (Pb)-free component
Component in accordance to RoHS 2002/95/EC
and WEEE 2002/96/EC
IN
6
IN
5
IN
4
ball view
IN
3
IN
2
Pin 1
IN
1
GND
3
OUT
6
OUT
5
OUT
4
GND
2
OUT
3
OUT
2
GND
1
OUT
1
19464
Mechanical Data
Case:
FC2 (FlipChip/BGA)
Terminals:
High temperature soldering guaranteed:
260 °C/10 sec. at terminals
Weight:
5.5 mg
Packaging Codes/Options:
GS18 = 10 k per 13" reel (8 mm tape), 10 k/box
GS08 = 3 k per 7" reel (8 mm tape), 15 k/box
Marking:
X01
Pin 1
19463_1
Absolute Maximum Ratings
(T
A
= 25 °C unless otherwise specified)
Parameter
ESD Air Discharge per IEC 61000-4-2
ESD Contact Discharge per IEC 61000-4-2
Symbol
V
ESD
V
ESD
Value
±
30
±
30
Unit
kV
kV
Thermal Characteristics
(T
A
= 25 °C unless otherwise specified)
Parameter
Operating Temperature
Storage Temperature
Symbol
T
J
T
STG
Value
- 40 to + 85
- 55 to + 150
Unit
°C
°C
Document Number 84746
Rev. 1.0, 07-Okt-05
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1
VEMI65A6-FC2
Vishay Semiconductors
Electrical Characteristics
(T
A
= 25 °C unless otherwise specified)
Parameter
Reverse Stand-Off Voltage
Line resistance
Cut-off Frequency
Attenuation
Input current
Max. clamping output voltage
Max. Peak pulse current
Reverse Breakdown Voltage
Capacitance
Test Conditions
Input to ground
between input and output
3 dB - attenuation
f = 800 MHz - 2 GHz
Input to ground at V
RWM
output not
connected
Output to ground V
in-ESD
= 8 kV
each Input to ground
See Fig. 1
at I
R
= 1 mA each input or output to
ground
at V
R
= 0 V; f = 1 MHz
each input or output to ground
Synbol
V
RWM
R
S
f
3dB
S
21
I
R
V
C-Out
at I
PPM
V
BR
C
IN
5
6.5
90
Min.
5
90
100
60
- 30
1
8
110
Typ.
Max.
Unit
V
Ω
MHz
dB
µA
V
A
V
pF
8
8µs
to 100%
100 %
Output not connected
7
6
5
80
%
V
IN
in
V
I
PPM
60 %
20µs to 50%
4
3
2
40 %
20 %
1
0
0.01
19473
0%
19465
0
10
20
Time in
µs
30
40
0.1
1
10
I
IN
in
µA
100
1000
10000
Figure 1. 8/20 µs Peak Pulse Current wave from IEC 61000-4-5
Figure 3. Typical Input Voltage V
IN
vs. Input Current I
IN
12
10
8
V
in
V
C
6
4
2
Measured acc. IEC 61000-4-5 (8/20µs -
Waveform)
0
V
C
INPUT to Ground
Transmission (S21) in dB
-5
-10
-15
-20
-25
-30
-35
-40
V
IN_
= 0V
Z
0
= 50
Ω
V
IN_
= 5V
V
C
OUTPUT to Ground
0
0
19474
1
2
3
4
I
PP
in A
5
6
1
19475
10
100
Frequency in MHz
1000
10000
Figure 2. Typical Clamping Voltage vs. Peak Pulse Current I
PP
Figure 4. Typical small signal transmission (S21) at Z
0
= 50 Ohm
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2
Document Number 84746
Rev. 1.0, 07-Okt-05
VEMI65A6-FC2
Vishay Semiconductors
90
f = 1MHz
80
70
60
C
IN
in pF
50
40
30
20
10
0
0
19471
1
2
V
IN
in
V
3
4
5
Figure 5. Typical Input Capacitance C
IN
vs. Input Voltage V
IN
Document Number 84746
Rev. 1.0, 07-Okt-05
www.vishay.com
3
VEMI65A6-FC2
Vishay Semiconductors
Application Note:
a) With the
VEMI65A6-FC2
6 different signal or data lines can be filtered and clamped to ground. Due to the
different clamping levels in forward and reverse direction the clamping behavior is
Bidirectional
and
Asym-
metric
(BiAs).
L1
IN
L2
IN
L3
IN
L4
IN
L5
IN
L6
IN
L1
OUT
L2
OUT
L3
OUT
L4
OUT
L5
OUT
L6
OUT
19466
Circuit diagram of one EMI-Filter-Channel
R
S
Input
C
Output
C
Ground
19467
Each filter is symmetrical so that both ports can be used as Input or Output.
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Document Number 84746
Rev. 1.0, 07-Okt-05
VEMI65A6-FC2
Vishay Semiconductors
Package Dimensions in mm (Inches)
500µm
315µm
±50µm
1330µm
±45µm
870µm
2960µm
±45µm
400µm
650µm
±70µm
±50µm
19468
Foot print recommendation:
Opening
solder mask & solder stencil
diameter = 0.38 mm
Non-Solder
Mask defined Pad
diameter = 0.28 mm
19469
Document Number 84746
Rev. 1.0, 07-Okt-05
www.vishay.com
5
