VFCP Series (Z-Foil) (0805, 1206, 1506, 2010, 2512)
VFCP Series (Z-Foil)
(0805, 1206, 1506, 2010, 2512)
Ultra High-Precision Z-Foil Flip Chip Resistor
with TCR of ±0.2 ppm/°C, 35% Space Saving vs. Wraparound Design
and PCR of 5 ppm at Rated Power
FEATURES
• Temperature coefficient of resistance (TCR):
± 0.2 ppm/°C typical (–55°C to +125°C, +25°C ref.)
• Tolerance: to ±0.01% (100 ppm)
• Power coefficient “∆R due to self heating” 5 ppm at
rated power
• Load-life stability (70°C for 2000 h): ±0.005% (50 ppm)
• Power rating to: 600 mW at +70°C
• Electrostatic discharge (ESD): at least to 25 kV
• Resistance range: 5 Ω to 125 kΩ (for lower and higher
values, please contact us)
• Bulk Metal
®
Foil resistors are not restricted to standard
values; specific “as required” values can be supplied at
no extra cost or delivery (e.g., 1K2345 vs. 1K)
• Non-inductive, non-capacitive design
• Thermal stabilization time: <1 s (within 10 ppm of
steady state value)
• Short time overload: ≤0.005% (50 ppm)
• Non hot spot design
• Rise time: 1 ns effectively no ringing
• Current noise: <0.010 μV
rms
/ V of applied voltage
(<–40 dB)
• Voltage coefficient: <0.1 ppm/V
• Non-inductive: <0.08 μH
• Terminal finishes available: lead (Pb)-free, tin/lead alloy
• Compliant to RoHS directive 2002/95/EC*
• Matched sets are available per request
• Rapid prototype sample quantities are available.
For more information, please contact us at
foil@vpgsensors.com
critical applications by eliminating the need for corrective
circuitry and reducing the large land patterns needed
for a wrap-around configuration. The device’s flip-chip
configuration saves up to 35% PCB space compared with
a surface-mount chip with wraparound terminations while
also providing better strain relief to eliminate cracked
substrates and board delamination.
In addition to its remarkably improved load-life stability,
the VFCP Series is noise-free and provides ESD
protection of 25 kV or more for increased reliability. The
device’s solid element alloy is matched to the substrate,
forming a single entity with balanced resistance versus
temperature characteristics for an unusually low and
predictable TCR over a wide temperature range from
–55°C to more than +125°C. The adhesive that holds the
foil to the flat substrate withstands high temperatures,
pulsing power, moisture incursions, shock and vibration,
and low-temperature exposure while still holding securely
to the foil element. Resistance patterns are photo-etched
into the element to permit the trimming of resistance
values to very tight tolerances as low as 0.01%.
The Flip Chips devices are qualified as anti-sulfurated
resistors for use in environments with high levels of
contamination. Such environments include alternative
energy applications, industrial control systems,
sensors, RTDs, electric instrumentation, weather and
communication base stations, and any electronic
appliance used in high concentrations of sulfur. The
combination of flip-chip terminations and Z-Foil
construction and materials results in the most stable
resistors available, requiring the lowest error allowance.
This means that more error allowance can be transferred
to active devices—resulting in lower costs—or applied
to the foil resistors themselves, allowing for looser initial
tolerances than would be required for other resistor
technologies.
INTRODUCTION
Based on VFR’s Bulk Metal Z-Foil technology, the VFCP
Series (foil resistor flip-chip) excels over all previous
stability standards for precision resistors with an order
of magnitude improvement in high-temperature stability,
load-life stability, and moisture resistance. These new
benchmark levels of performance provide design
engineers with the tools to build circuits not previously
achievable while reducing costs and space in the most
*
RELATED VIDEO
Refer to
Bulk Metal® Foil Resistor TCR Performance
(Product Demo).
This datasheet provides information about parts that are RoHS-compliant and/or parts that are non-RoHS-compliant. For example,
parts with lead (Pb) terminations are not RoHS compliant. Please see the information/tables in this datasheet for details.
Document No.: 63106
Revision: 19-Oct-2015
For any questions, contact
foil@vpgsensors.com
www.vishayfoilresistors.com
1
VFCP Series (Z-Foil) (0805, 1206, 1506, 2010, 2512)
Series (Z-Foil)
(0805, 1206, 1506, 2010, 2512)
TABLE 1—TOLERANCE AND TCR VS.
RESISTANCE VALUE
Resistance
Value
(Ω)
250 to 125k
100 to <250
50 to <100
25 to <50
10 to <25
5 to <10
FIGURE 1—POWER DERATING CURVE
Percent of Rated Power
100
75
50
25
0
–75
Tolerance
(%)
±0.01%
±0.02%
±0.05%
±0.1%
±0.25%
±0.5%
Typical TCR and Max. Spread
(–55°C to +125°C, +25°C Ref.)
(ppm/°C)
±0.2 ±1.6
±0.2 ±1.6
±0.2 ±1.8
±0.2 ±2.8
±0.2 ±2.8
±0.2 ±7.8
–55°C
+70°C
–50
–25
0
+25
+50
+75
+100 +125 +150 +175
Ambient Temperature (°C)
FIGURE 2—NOMINAL
RESISTANCE/TEMPERATURE CURVE
+400
+500
FIGURE 3—TRIMMING TO VALUES
(conceptual illustration)
Interloop
capacitance
reduction
in series
Mutual
inductance
reduction
due to change
in current
direction
+300
∆R
(ppm)
R
+200
+100
–100
–200
–400
–300
–500
–55
Current path
before trimming
Current path after trimming
0
0.05 ppm/°C
- 0.1 ppm/°C
- 0.16 ppm/°C
–25
0
+25
0.1 ppm/°C
0.14 ppm/°C
0.2 ppm/°C
+60
+75
+100
+125
Ambient Temperature (°C) and TCR Chord Slopes
for Different Temperature Ranges
Note
The TCR values for <100 Ω are influenced by the termination
composition and result in deviation from this curve.
Note
To acquire a precision resistance value, the Bulk Metal Foil
chip is trimmed by selectively removing built-in “shorting bars.”
To increase the resistance in known increments, marked
areas are cut, producing progressively smaller increases in
resistance. This method reduces the effect of “hot spots” and
improves the long-term stability of VFR resistors.
Trimming process
removes this material
from shorting strip area
changing current path
and increasing
resistance
Foil shown in black, etched spaces in white
TABLE 2—MODEL SELECTION
Chip
Size
0805
1206
1506
2010
2512
Rated Power
Maximum
Resistance
at +70°C
Voltage Rating
Range
(mW)
(≤√P
×
R)
(Ω)
100 mW
250 mW
300 mW
400 mW
600 mW
28 V
79 V
95 V
167 V
220 V
5 to 8k
5 to 25k
5 to 30k
5 to 70k
5 to 125k
Max.
Weight
(mg)
5.2
10.3
12
25
35
TABLE 3—LOAD-LIFE STABILITY
(+70°C for 2000 h)
Chip Size
0805
1206
1506
2010
2512
MAXIMUM ∆R LIMITS
±0.005% at 50 mW
±0.01% at 100 mW
±0.005% at 150 mW
±0.01% at 250 mW
±0.005% at 150 mW
±0.01% at 300 mW
±0.005% at 200 mW
±0.01% at 400 mW
±0.005% at 500 mW
±0.01% at 600 mW
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2
For any questions, contact
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Document No.: 63106
Revision: 19-Oct-2015
VFCP Series (Z-Foil) (0805, 1206, 1506, 2010, 2512)
VFCP Series (Z-Foil)
(0805, 1206, 1506, 2010, 2512)
TABLE 4—PERFORMANCE SPECIFICATIONS
Test or Condition
Thermal Shock
Low Temperature Operation
Short Time Overload
High Temperature Exposure
Resistance to Soldering Heat
Moisture Resistance
Load Life Stability +70°C for
2000 hours at Rated Power
MIL-PRF-55342
Characteristic E ∆R Limits
±0.1%
±0.1%
±0.1%
±0.1%
±0.2%
±0.2%
±0.5%
Typical ∆R Limits
±0.005% (50 ppm)
±0.005% (50 ppm)
±0.005% (50 ppm)
±0.01% (100 ppm)
±0.005% (50 ppm)
±0.005% (50 ppm)
±0.005% (50 ppm)
Maximum ∆R Limits
(1)
± 0.01% (100 ppm)
± 0.01% (100 ppm)
± 0.01% (100 ppm)
±0.02% (200 ppm)
±0.015% (150 ppm)
±0.03% (300 ppm)
±0.01% (100 ppm)
Note
(1) As shown +0.01 ohms (Ω) to allow for measurement errors at low values.
TABLE 5—DIMENSIONS AND LAND PATTERN
in inches (millimeters)
BOTTOM VIEW (showing terminals for mounting)
D
Solder Terminals
LAND PATTERN
W
W1 (W - 0.003")
G
X
L1 (L - 0.005")
L
Z
Chip
Size
0805
1206
1506
2010
2512
L
±0.005 (0.13)
0.079 (2.01)
0.126 (3.20)
0.150 (3.81)
0.200 (5.08)
0.250 (6.35)
W
±0.005 (0.13)
0.049 (1.24)
0.062 (1.57)
0.062 (1.57)
0.100 (2.54)
0.126 (3.20)
Thickness
Maximum
0.025 (0.64)
0.025 (0.64)
0.025 (0.64)
0.025 (0.64)
0.025 (0.64)
D
±0.005 (0.13)
0.010 (0.25)
0.015 (0.38)
0.012 (0.30)
0.020 (0.51)
0.024 (0.61)
Z
0.078 (1.98)
0.125 (3.18)
0.150 (3.81)
0.199 (5.05)
0.250 (6.35)
G
0.053 (1.35)
0.090 (2.29)
0.120 (3.05)
0.153 (3.89)
0.196 (4.98)
X
0.049 (1.24)
0.062 (1.57)
0.062 (1.57)
0.100 (2.54)
0.126 (3.20)
Notes
Avoid the use of those cleaning agents that could attack epoxy resins, which form part of the resistor construction.
Vacuum pick-up is recommended for handling.
Soldering iron not recommended.
RELATED PRODUCT TRAINING MODULE
Refer to
Precision Resistors—There is more to resistor
precision than meets the eye.
the resistance value depending on the construction,
material, and size. Under these conditions Bulk Metal Foil
resistors behave more linearly than other resistor types.
RELATED VIDEO
Refer to
Bulk Metal® Foil Resistor Accelerated Life Test
(Product Demo).
FLOWER OF SULFUR
ASTM B 809, also known as flower of sulfur, is a test to
determine the porosity of metallic coating using humid
sulfur vapor. This vapor can penetrate conformal coatings
and cause damage to the device when it reacts with
lower layers of silver. Surface-mount Bulk Metal Foil chip
resistors avoid this problem with a special coating that
is proven to be reliable in extreme environments and
even against sulfur. The flower of sulfur test is especially
HARMONIC DISTORTION
Harmonic distortion is an important consideration in the
choice of precision resistors for sensitive applications. A
significant signal voltage across the resistor may change
Document No.: 63106
Revision: 19-Oct-2015
For any questions, contact
foil@vpgsensors.com
www.vishayfoilresistors.com
3
VFCP Series (Z-Foil) (0805, 1206, 1506, 2010, 2512)
Series (Z-Foil)
(0805, 1206, 1506, 2010, 2512)
relevant to designers of circuits used in alternative
energy and industrial applications, where environmental
pollution is a constant concern. Analog circuitry in
these applications almost always operates under severe
environmental, thermal, and mechanical conditions,
and must withstand frequent and extended service by
professionals and novices alike. The picture is further
complicated by tough regulatory restrictions and high
consumer expectations. VFR received a steady stream
of customer inquiries, which led to more focus on anti-
sulfurated resistor research and development. As a result
we have qualified our surface-mount foil chip resistors
as “antisulfurated resistors.” These resistors are capable
of exposure to sulfurous environments without damage.
Beyond alternative energy, applications include industrial
control systems, sensors, RTDs, electric instrumentation,
weather and communication base stations. These
resistors are also suited for electronic appliances used in
high concentrations of sulfur.
POWER COEFFICIENT OF RESISTANCE
(PCR)
The TCR of a resistor for a given temperature range is
established by measuring the resistance at two different
ambient temperatures: at room temperature and in a
cooling chamber or oven. The ratio of relative resistance
change and temperature difference gives the slope of
DR/R = f (T) curve. This slope is usually expressed in
parts per million per degree Centigrade (ppm/°C). In
these conditions, a uniform temperature is achieved
in the measured resistance. In practice, however, the
temperature rise of the resistor is also partially due to
self-heating as a result of the power it is dissipating. As
stipulated by the Joule effect, when current flows through
a resistance, there will be an associated generation of
of a heat flow and of a temperature gradient. Therefore,
the TCR alone does not provide the actual resistance
change for precision resistor. Hence, another metric is
introduced to incorporate this inherent characteristic—the
Power Coefficient of Resistance (PCR). PCR is expressed
in parts per million per Watt or in ppm at rated power. In
the case of Z-based Bulk Metal
®
Foil, the PCR is 5 ppm
typical at rated power or 4 ppm per Watt typical for power
resistors.
TABLE 6—GLOBAL PART NUMBER INFORMATION
(1)
NEW GLOBAL PART NUMBER: Y163010K0000T9W (preferred part number format)
DENOTES PRECISION
Y
VALUE
R
=
Ω
K
= kΩ
CHARACTERISTICS
0
= tin/lead
9
= lead (Pb)-free
1 to 999
= custom
Y
1
6
3
0
1
0
K
0
0
0
0
T
9
W
1629
= VFCP0805
1630
= VFCP1206
1631
= VFCP1506
1632
= VFCP2010
1633
= VFCP2512
PRODUCT CODE
RESISTANCE TOLERANCE
T
= ±0.01%
Q
= ±0.02%
A
= ±0.05%
B
= ±0.10%
C
= ±0.25%
D
= ±0.50%
F
= ±1.00%
R
= tape and reel
W
= waffle pack
PACKAGING
FOR EXAMPLE: ABOVE GLOBAL ORDER Y1630 10K0000 T 9 W:
TYPE: VFCP1206
VALUE: 10.0 kΩ
ABSOLUTE TOLERANCE: ±0.01%
TERMINATION: lead (Pb)-free
PACKAGING: waffle pack
VFCP1206
MODEL
VFCP0805
VFCP1206
VFCP1506
VFCP2010
VFCP2512
HISTORICAL PART NUMBER: VFCP1206 10K000 TCR0.2 T S W (will continue to be used)
10K000
OHMIC VALUE
10.0 kΩ
TCR0.2
TCR
Characteristic
T
RESISTANCE
TOLERANCE
T
= ±0.01%
Q
= ±0.02%
A
= ±0.05%
B
= ±0.10%
C
= ±0.25%
D
= ±0.50%
F
= ±1.00%
S
TERMINATION
S
= lead (Pb)-free
B
= tin/lead
W
PACKAGING
T
= tape and reel
W
= waffle pack
Note
(1) For non-standard requests, please contact Application Engineering
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Document No.: 63106
Revision: 19-Oct-2015
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Disclaimer
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Copyright Vishay Precision Group, Inc., 2014. All rights reserved.
Document No.: 63999
Revision: 15-Jul-2014
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NXP MCU
