首页 > 器件类别 > 分立半导体 > 二极管

VS-VSKDS200/045

DIODE SCHOTTKY 45V 100A ADDAPAK

器件类别:分立半导体    二极管   

厂商名称:Vishay(威世)

厂商官网:http://www.vishay.com

器件标准:

下载文档
器件参数
参数名称
属性值
是否Rohs认证
符合
包装说明
R-PUFM-X3
Reach Compliance Code
unknown
ECCN代码
EAR99
Factory Lead Time
18 weeks
其他特性
FREE WHEELING DIODE
应用
POWER
外壳连接
ISOLATED
配置
SERIES CONNECTED, CENTER TAP, 2 ELEMENTS
二极管元件材料
SILICON
二极管类型
RECTIFIER DIODE
最大正向电压 (VF)
0.92 V
JESD-30 代码
R-PUFM-X3
最大非重复峰值正向电流
12800 A
元件数量
2
相数
1
端子数量
3
最高工作温度
150 °C
最低工作温度
-55 °C
封装主体材料
PLASTIC/EPOXY
封装形状
RECTANGULAR
封装形式
FLANGE MOUNT
峰值回流温度(摄氏度)
NOT SPECIFIED
最大重复峰值反向电压
45 V
最大反向电流
10000 µA
表面贴装
NO
技术
SCHOTTKY
端子形式
UNSPECIFIED
端子位置
UPPER
处于峰值回流温度下的最长时间
NOT SPECIFIED
Base Number Matches
1
文档预览
VS-VSKDS200/045
www.vishay.com
Vishay Semiconductors
AAP Gen 7 (TO-240AA)
Power Modules Schottky Rectifier, 100 A
FEATURES
• 150 °C T
J
operation
• Low forward voltage drop
• High frequency operation
• Low thermal resistance
• UL pending
• Designed and qualified for industrial level
• Material categorization: for definitions of compliance
please see
www.vishay.com/doc?99912
AAP Gen 7 (TO-240AA)
BENEFITS
• Excellent thermal performances obtained by the usage of
exposed direct bonded copper substrate
PRIMARY CHARACTERISTICS
I
F(AV)
V
R
Package
Circuit configuration
100 A
45 V
AAP Gen 7 (TO-240AA)
Two diodes doubler circuit
• High surge capability
• Easy mounting on heatsink
ELECTRICAL DESCRIPTION / APPLICATIONS
The VS-VSKDS200/045 Schottky rectifier doubler module
has been optimized for low reverse leakage at high
temperature. The proprietary barrier technology allows for
reliable operation up to 150 °C junction temperature.
Typical applications are in high current switching power
supplies, plating power supplies, UPS systems, converters,
freewheeling diodes, welding, and reverse battery
protection.
MECHANICAL DESCRIPTION
The AAP Gen 7, new generation of ADD-A-PAK module,
combines the excellent thermal performances obtained by
the usage of exposed direct bonded copper substrate, with
advanced compact simple package solution and simplified
internal structure with minimized number of interfaces.
MAJOR RATINGS AND CHARACTERISTICS
SYMBOL
I
F(AV)
V
RRM
I
FSM
V
F
T
J
t
p
= 5 μs sine
100 A
pk
, T
J
= 125 °C
Range
CHARACTERISTICS
Rectangular waveform
VALUES
100
45
12 800
0.73
-55 to +150
UNITS
A
V
A
V
°C
VOLTAGE RATINGS
PARAMETER
Maximum DC reverse voltage
Maximum working peak reverse voltage
SYMBOL
V
R
V
RWM
VS-VSKDS200/045
45
UNITS
V
Revision: 03-May-17
Document Number: 94966
1
For technical questions within your region:
DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
VS-VSKDS200/045
www.vishay.com
Vishay Semiconductors
ABSOLUTE MAXIMUM RATINGS
PARAMETER
Maximum average forward current per leg
Maximum peak one cycle
non-repetitive surge current
Non-repetitive avalanche energy
Repetitive avalanche current
SYMBOL
I
F(AV)
I
FSM
10 ms sine or 6 ms rect. pulse
E
AS
I
AR
T
J
= 25 °C, I
AS
= 19 A, L = 1 mH
Current decaying linearly to zero in 1 μs
Frequency limited by T
J
maximum V
A
= 1.5 x V
R
typical
TEST CONDITIONS
50 % duty cycle at T
C
= 91 °C, rectangular waveform
5 μs sine or 3 μs rect. pulse
Following any rated
load condition and with
rated V
RRM
applied
VALUES
100
12 800
1700
180
15
mJ
A
A
UNITS
ELECTRICAL SPECIFICATIONS
PARAMETER
SYMBOL
100 A
Maximum forward voltage drop
V
FM
200 A
100 A
200 A
Maximum reverse leakage current
Maximum junction capacitance
Typical series inductance
Maximum voltage rate of change
Maximum RMS insulation voltage
I
RM
C
T
L
S
dV/dt
V
INS
T
J
= 25 °C
T
J
= 125 °C
TEST CONDITIONS
T
J
= 25 °C
T
J
= 125 °C
V
R
= Rated V
R
VALUES
0.67
0.92
0.73
1.14
10
800
5200
7.0
10 000
3000 (1 min)
3600 (1 s)
mA
pF
nH
V/μs
V
V
UNITS
V
R
= 5 V
DC
(test signal range 100 kHz to 1 MHz), 25 °C
Measured lead to lead 5 mm from package body
Rated V
R
50 Hz
THERMAL - MECHANICAL SPECIFICATIONS
PARAMETER
Maximum junction and storage
temperature range
Maximum thermal resistance,
junction to case per leg
Typical thermal resistance,
case to heatsink per module
Approximate weight
to heatsink
Mounting torque ± 10 %
busbar
Case style
A mounting compound is recommended and the torque
should be rechecked after a period of 3 h to allow for the
spread of the compound.
JEDEC
®
SYMBOL
T
J
, T
Stg
R
thJC
R
thCS
DC operation
TEST CONDITIONS
VALUES
-55 to +150
0.52
°C/W
0.1
75
2.7
4
Nm
3
TO-240AA compatible
g
oz.
UNITS
°C
Revision: 03-May-17
Document Number: 94966
2
For technical questions within your region:
DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
VS-VSKDS200/045
www.vishay.com
Vishay Semiconductors
10 000
I
F
- Instantaneous Forward Current (A)
1000
I
R
- Reverse Current (mA)
T
J
= 25 °C
T
J
= 150 °C
T
J
= 125 °C
1000
100
10
150°C
125 °C
100 °C
75 °C
50 °C
100
10
1
0.1
0.01
25 °C
1
0.000
0.500
1.000
1.500
2.000
2.500
0
10
20
30
40
50
V
FM
- Forward Voltage Drop (V)
Fig. 1 - Maximum Forward Voltage Drop Characteristics
V
R
- Reverse Voltage (V)
Fig. 2 - Typical Values of Reverse Current vs. Reverse Voltage
10 000
C
T
- Junction Capacitance (pF)
T
J
= 25 °C
1000
0
10
20
30
40
50
V
R
- Reverse Voltage (V)
Fig. 3 - Typical Junction Capacitance vs. Reverse Voltage
Z
thJC
- Thermal Impedance (°C/W)
1
0.1
D = 0.75
D = 0.50
D = 0.33
D = 0.25
D = 0.20
DC
0.01
0.00001
0.0001
0.001
0.01
0.1
1
10
100
t
1
- Rectangular Pulse Duration (s)
Fig. 4 - Maximum Thermal Impedance Z
thJC
Characteristics
Revision: 03-May-17
Document Number: 94966
3
For technical questions within your region:
DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
VS-VSKDS200/045
www.vishay.com
160
Vishay Semiconductors
120
Allowable Case Temperature (°C)
120
100
80
60
40
20
0
0
50
100
150
200
250
Square
Wave (d=0,5)
Rated V
R
applied
DC
Average Power Loss (W)
140
100
80
60
40
D = 0.75
D = 0.50
D = 0.33
D = 0.25
D = 0.20
RMS limit
DC
20
0
0
30
60
90
120
150
I
F(AV)
- Average Forward Current (A)
Fig. 5 - Maximum Allowable Case Temperature vs.
Average Forward Current
I
F(AV)
- Average Forward Current (A)
Fig. 6 - Forward Power Loss Characteristics
I
FSM
- Non-Repetitive Surge Current (A)
10 000
At any rated load condition
and with rated V
RRM
applied
following
surge
1000
10
100
1000
10 000
t
p
- Square Wave Pulse Duration (µs)
Fig. 7 - Maximum Non-Repetitive Surge Current
L
High-speed
switch
Freewheel
diode
40HFL40S02
+ V
d
= 25 V
D.U.T.
IRFP460
R
g
= 25
Ω
Current
monitor
Fig. 8 - Unclamped Inductive Test Circuit
Note
(1)
Formula used: T = T - (Pd + Pd
C
J
REV
) x R
thJC
;
Pd = forward power loss = I
F(AV)
x V
FM
at (I
F(AV)
/D) (see fig. 6);
Pd
REV
= inverse power loss = V
R1
x I
R
(1 - D); I
R
at V
R1
= 80 % rated V
R
Revision: 03-May-17
Document Number: 94966
4
For technical questions within your region:
DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
VS-VSKDS200/045
www.vishay.com
ORDERING INFORMATION TABLE
Device code
Vishay Semiconductors
VS-VS KD
1
2
S
3
20
4
0
5
/
045
6
1
2
3
4
5
6
-
-
-
-
-
-
Vishay Semiconductors product
Circuit configuration:
KD = ADD-A-PAK - 2 diodes doubler circuit
S = Schottky diode
Average current rating (20 = 200 A)
Product silicon identification
Voltage rating (045 = 45 V)
CIRCUIT CONFIGURATION
(1)
~
(2)
+
(3)
-
LINKS TO RELATED DOCUMENTS
Dimensions
www.vishay.com/doc?95369
Revision: 03-May-17
Document Number: 94966
5
For technical questions within your region:
DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
查看更多>
谷歌IO对Androd的架构和运行机理分析
谷歌IO对Androd的架构和运行机理分析 Android Anatomy and Physiolo...
clark 嵌入式系统
阻抗匹配设计原理及方法
阻抗匹配(Impedance matching)是微波电子学里的一部分,主要用于传输线上,来达至...
btty038 RF/无线
求助:单片机串口接收
大家好,我是刚来的,也是一个新手,有个问题想请教一下,哪位大虾帮我看看, …… if(RI)...
starliu 嵌入式系统
嵌入式爱好者的学习笔记连载(三)
嵌入式爱好者的学习笔记连载(三) 1 U-Boot简介 U-Boot,全称Universal...
cable1201 嵌入式系统
S6SAE101A00SA1002 PSOC BLE GPIO测试
打开 EH_Motherboard.cyprj 工程 拖动右边 Ports and Pin...
littleshrimp 单片机
按键的下降沿和低电平的问题
请教各位,按键原来是下降沿有效,但我想把按键改为低电平有效,应该怎么改呢,是把原来的下降沿中断去掉吗...
crysislove 微控制器 MCU
热门器件
热门资源推荐
器件捷径:
A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ
需要登录后才可以下载。
登录取消