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VSM150637K900TCR2TBT

RESISTOR, METAL FOIL, 0.2 W, 0.01 %, 2 ppm, 37900 ohm, SURFACE MOUNT, 1506, CHIP

器件类别:无源元件    电阻器   

厂商名称:Vishay(威世)

厂商官网:http://www.vishay.com

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器件参数
参数名称
属性值
是否无铅
含铅
是否Rohs认证
不符合
厂商名称
Vishay(威世)
包装说明
, 1506
Reach Compliance Code
unknown
ECCN代码
EAR99
其他特性
HIGH PRECISION, NON-INDUCTIVE
JESD-609代码
e0
制造商序列号
VSM
安装特点
SURFACE MOUNT
端子数量
2
最高工作温度
150 °C
最低工作温度
-55 °C
封装形状
RECTANGULAR PACKAGE
包装方法
TR
额定功率耗散 (P)
0.2 W
额定温度
70 °C
电阻
37900 Ω
电阻器类型
FIXED RESISTOR
尺寸代码
1506
表面贴装
YES
技术
METAL FOIL
温度系数
2 ppm/°C
端子面层
Tin/Lead (Sn/Pb)
端子形状
WRAPAROUND
容差
0.01%
文档预览
VSM Series (0805, 1206, 1506, 2010, 2512)
Vishay Foil Resistors
Foil Wrap Around Surface Mount Chip Resistor with
TCR of ± 2 ppm/°C and Load Life Stability of ± 0.01%
FEATURES
TCR: ± 2.0 ppm/°C typical (see Table 1)
Pb-free
Load Life Stability (70°C for 2000 hours):
Available
± 0.01%
RoHS*
Power Rating to: 400 mW at +70°C
COMPLIANT
Resistance Range: 10Ω to 150KΩ (for higher
and lower values, please contact us)
Tolerance: to ± 0.01%
Shelf Life Stability: 0.005%
Low Current Noise: - 40dB “Noise free component”
Low Voltage Coefficient < 0.1 ppm/V
Non Inductive: < 0.08µH
Thermal EMF: < 0.05µV/°C
Terminal Finishes Available:
Lead (Pb)-Free (Sn 99.3% Cu 0.7%)
Tin/Lead Alloy (Sn 62% Pb 36% Ag 2%)
Matched sets are available per request
For higher performances please review
VSMP
and
VFCP
Series datasheets
Top View
INTRODUCTION
Bulk Metal
®
Foil (BMF) Technology out-performs all other
resistor technologies available today for applications that
require high precision and high stability.
This technology has been invented, patented and pioneered
by Vishay. Products based on this technology are the most
suitable for a wide range of applications.
BMF technology allows to produce customer oriented
products designed to satisfy challenging and specific
technical requirements.
The BMF provides inherently a low and predictable
Temperature Coefficient of Resistance (TCR) and excellent
load life stability for high precision analog applications.
N
E
W
Model VSM offers low TCR, excellent load life stability, tight
tolerance, excellent shelf life stability, low thermal EMF, low
current noise and low voltage coefficient, all in the same
resistor.
The VSM has a full wrap around termination which insures
safe handling during the manufacturing process, as well as
providing stability during multiple thermal cyclings.
Our Application Engineering Department is available to
advise and make recommendations for non-standard
technical requirements and special applications, please
contact us using the e-mail addresses in the footer below.
* Pb containing terminations are not RoHS compliant, exemptions may apply
SALES
• ASIA/JAPAN: foilsales.asia@vishay.com
• UK/HOLLAND/SCANDINAVIA: foilsales.eunorth@vishay.com
• AMERICAS: foilsales.usa@vishay.com
• GERMANY/CZECH REPUBLIC/AUSTRIA: foilsales.eucentral@vishay.com • FRANCE/SWITZERLAND/SOUTHERN EUROPE: foilsales.eusouth@vishay.com • ISRAEL: foilsales.israel@vishay.com
www.vishay.com
1
Document Number: 63070
For technical questions in the Americas, contact: foilsupport1@vishay.com
For technical questions in Asia/Japan/Europe/Africa/Israel, contact: foilsupport2@vishay.com
Revision: 18-Apr-06
P
R
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C
T
TABLE 1 - TOLERANCE AND TCR VS
RESISTANCE VALUE**
RESISTANCE
VALUE
(Ω)
250 to 150K
100 to < 250
50 to < 100
25 to < 50
10 to < 25
TOLERANCE
(%)
± 0.01
± 0.02
± 0.05
± 0.1
± 0.25
**For Tighter performances, please contact Vishay Application
Engineering using the e-mail addresses in the footer below.
TYPICAL TCR AND
MAX. SPREAD
(ppm/°C)
±2±2
±2±3
±2±3
±2±4
±2±6
APPLICATIONS
Automatic Test Equipment (ATE)
High Precision Instrumentation
Laboratory, Industrial and Medical
Audio
EB Applications (electron beam scanning and recording
equipment, electron microscopes)
Military and Space
Airborne
Down Hole instrumentation
Communication
VSM Series (0805, 1206, 1506, 2010, 2512)
Foil Wrap Around Surface Mount Chip Resistor with
Vishay Foil Resistors
TCR of ± 2 ppm/°C and Load Life Stability of ± 0.01%
TABLE 2 - SPECIFICATIONS
CHIP SIZE
0805
1206
1506
2010
(*)
2512
(*)
(*)
RATED POWER (mW)
at +70°C
100
150
200
RESISTANCE RANGE (Ω)
10 to 12K
10 to 30K
10 to 40K
MAXIMUM WEIGHT (mg)
6
11
12
VSM2010 and VSM2512 data are preliminary, for more details please contact Application Engineering using the e-mail addresses in the
footer below.
TABLE 3 - ENVIRONMENTAL PERFORMANCE SPECIFICATIONS
TEST
Thermal Shock
Low Temperature Operation
Short Time Overload
High Temperature Exposure
Resistance to Soldering Heat
Moisture Resistance
Load Life Stability +70°C for 2000 hours
Maximum Working Voltage (V)
**As shown + 0.01Ω to allow for measurement errors at low values.
TABLE 4 - DIMENSIONS AND LAND PATTERN
in inches (millimeters)
N
E
W
Bottom
View
for Mounting
L
Uncoated
Ceramic
T
D
CHIP
SIZE
0805
1206
1506
2010
2512
L
± 0.005 (0.13)
0.080 (2.03)
0.126 (3.2)
0.150 (3.81)
0.198 (5.03)
0.249 (6.32)
W
± 0.005 (0.13)
0.050 (1.27)
0.062 (1.57)
0.062 (1.57)
0.097 (2.46)
0.127 (3.22)
***Land Pattern Dimensions are per IPC-782
SALES
• ASIA/JAPAN: foilsales.asia@vishay.com
• UK/HOLLAND/SCANDINAVIA: foilsales.eunorth@vishay.com
• AMERICAS: foilsales.usa@vishay.com
• GERMANY/CZECH REPUBLIC/AUSTRIA: foilsales.eucentral@vishay.com • FRANCE/SWITZERLAND/SOUTHERN EUROPE: foilsales.eusouth@vishay.com • ISRAEL: foilsales.israel@vishay.com
Document Number: 63070
Revision: 18-Apr-06
For technical questions in the Americas, contact: foilsupport1@vishay.com
For technical questions in Asia/Japan/Europe/Africa/Israel, contact: foilsupport2@vishay.com
P
R
O
D
U
C
T
300
(*)
400
(*)
10 to 100K
10 to 150K
27
40
MIL-PRF-55342 H
CHARACTERISTIC E
ΔR
LIMITS
± 0.1%
VSM
MAXIMUM
ΔR
LIMITS**
± 0.02%
± 0.1%
± 0.02%
± 0.1%
± 0.02%
± 0.1%
± 0.03%
± 0.2%
± 0.01%
± 0.2%
± 0.03%
± 0.5%
± 0.01%
PxR
Recommended Land Pattern
X
W
G
Z
Footprint
THICKNESS
MAXIMUM
0.025 (0.64)
0.025 (0.64)
0.025 (0.64)
0.025 (0.64)
0.025 (0.64)
D
± 0.005 (0.13)
0.015 (0.38)
0.020 (0.50)
0.020 (0.50)
0.025 (0.64)
0.032 (0.81)
Z***
MAXIMUM
0.122 (3.10)
0.175 (4.4)
0.199 (5.05)
0.247 (6.27)
0.291 (7.40)
G***
MINIMUM
0.028 (0.70)
0.059 (1.5)
0.083 (2.1)
0.115 (2.92)
0.150 (3.8)
X***
MAXIMUM
0.050 (1.27)
0.071 (1.80)
0.071 (1.80)
0.103 (2.63)
0.127 (3.22)
www.vishay.com
2
VSM Series (0805, 1206, 1506, 2010, 2512)
Vishay Foil Resistors
Foil Wrap Around Surface Mount Chip Resistor with
TCR of ± 2 ppm/°C and Load Life Stability of ± 0.01%
FIGURE 1 -POWER DERATING CURVE
Percent of Rated Power
–55°C
100
75
50
25
0
-75
FIGURE 2 - RECOMMENDED MOUNTING
+70°C
25% to
85%
of T
A low profile solder fillet is
recommended to avoid
unnecessary
stresses along top edge of
metallization. IR and
vapor
phase
reflow are
best.
Avoid the
use
of
cleaning agents
which
could attack
epoxy resins,
which
form part of the
resistor construction.
–50
–25
0
+25
+50
+75
+100 +125 +150 +175
Ambient Temperature (°C)
FIGURE 3 - TYPICAL TCR CURVE
(For more details, see Table 1)
+150
+100
R
+50
0
R
(ppm)
-50
-100
-150
-200
-50
-55
Note: The TCR values for < 100Ω are influenced by the termination composition and result in deviation from this curve
TABLE 5 - ORDERING INFORMATION
MODEL
VSM
CHIP
SIZE
0805
1206
1506
2010
RESISTANCE VALUE
RESISTANCE
LETTER
RANGE
DESIGNATOR
10Ω to < 1KΩ
R
K
N
E
W
Example: 249R00 = 249Ω
2512
1KΩ to 150KΩ
X 10
3
Example: 10K000 = 10.0KΩ
Example:
VSM0805 10K000 TCR2 TSW
Model: VSM0805
Value: 10KΩ
TCR2: 2 ppm/°C typical refers to any value in the resistance range (see table 1)
Tolerance: ± 0.01%
Termination: Lead (Pb)-Free
Packaging: Waffle Pack
SALES
• ASIA/JAPAN: foilsales.asia@vishay.com
• UK/HOLLAND/SCANDINAVIA: foilsales.eunorth@vishay.com
• AMERICAS: foilsales.usa@vishay.com
• GERMANY/CZECH REPUBLIC/AUSTRIA: foilsales.eucentral@vishay.com • FRANCE/SWITZERLAND/SOUTHERN EUROPE: foilsales.eusouth@vishay.com • ISRAEL: foilsales.israel@vishay.com
www.vishay.com
3
Document Number: 63070
For technical questions in the Americas, contact: foilsupport1@vishay.com
For technical questions in Asia/Japan/Europe/Africa/Israel, contact: foilsupport2@vishay.com
Revision: 18-Apr-06
P
R
O
D
U
C
T
± 2ppm/
°
C (+25°C reference)
-25
0
+25
+50
+75
+100
+125
Ambient Temperature (°C)
TCR
TOLERANCE
T = 0.01%
TERMINATION
PACKAGING
MULTIPLIER
FACTOR
X 1.0
TCR2
S = Lead (Pb)-Free
B = Tin/Lead
T = Tape and Reel
Q = 0.02%
A = 0.05%
B = 0.1%
C = 0.25%
D = 0.5%
F = 1.0%
W = Waffle Pack
Legal Disclaimer Notice
Vishay
Notice
Specifications of the products displayed herein are subject to change without notice. Vishay Intertechnology, Inc.,
or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied, by
estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Vishay's
terms and conditions of sale for such products, Vishay assumes no liability whatsoever, and disclaims any express
or implied warranty, relating to sale and/or use of Vishay products including liability or warranties relating to fitness
for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or selling these products for use in such applications do so at their own risk and agree to fully
indemnify Vishay for any damages resulting from such improper use or sale.
Document Number: 91000
Revision: 08-Apr-05
www.vishay.com
1
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