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W19B320ATBBH

Flash, 2MX16, 70ns, PBGA48, 6 X 8 MM, 0.80 MM PITCH, LEAD FREE, TFBGA-48

器件类别:存储    存储   

厂商名称:Winbond(华邦电子)

厂商官网:http://www.winbond.com.tw

器件标准:

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器件参数
参数名称
属性值
是否Rohs认证
符合
厂商名称
Winbond(华邦电子)
零件包装代码
BGA
包装说明
6 X 8 MM, 0.80 MM PITCH, LEAD FREE, TFBGA-48
针数
48
Reach Compliance Code
unknown
ECCN代码
3A991.B.1.A
最长访问时间
70 ns
备用内存宽度
8
启动块
TOP
JESD-30 代码
R-PBGA-B48
JESD-609代码
e1
长度
8 mm
内存密度
33554432 bit
内存集成电路类型
FLASH
内存宽度
16
功能数量
1
端子数量
48
字数
2097152 words
字数代码
2000000
工作模式
ASYNCHRONOUS
最高工作温度
85 °C
最低工作温度
-20 °C
组织
2MX16
封装主体材料
PLASTIC/EPOXY
封装代码
TFBGA
封装形状
RECTANGULAR
封装形式
GRID ARRAY, THIN PROFILE, FINE PITCH
并行/串行
PARALLEL
峰值回流温度(摄氏度)
NOT SPECIFIED
编程电压
3 V
认证状态
Not Qualified
座面最大高度
1.2 mm
最大供电电压 (Vsup)
3.6 V
最小供电电压 (Vsup)
2.7 V
标称供电电压 (Vsup)
3 V
表面贴装
YES
技术
CMOS
温度等级
OTHER
端子面层
TIN SILVER COPPER
端子形式
BALL
端子节距
0.8 mm
端子位置
BOTTOM
处于峰值回流温度下的最长时间
NOT SPECIFIED
类型
NOR TYPE
宽度
6 mm
文档预览
W19B320AT/B Data Sheet
4M
×
8/2M
×
16 BITS
3V FLEXIBLE BANK FLASH MEMORY
Table of Contents-
1.
2.
3.
4.
5.
6.
GENERAL DESCRIPTION ......................................................................................................... 4
FEATURES ................................................................................................................................. 4
PIN CONFIGURATIONS ............................................................................................................ 5
BLOCK DIAGRAM ...................................................................................................................... 6
PIN DESCRIPTION..................................................................................................................... 6
FUNCTIONAL DESCRIPTION ................................................................................................... 7
6.1
Device Bus Operation..................................................................................................... 7
6.1.1
6.1.2
6.1.3
6.1.4
6.1.5
6.1.6
6.1.7
6.1.8
6.1.9
6.1.10
6.1.11
6.1.12
6.1.13
6.1.14
Word/Byte Configuration ..................................................................................................7
Reading Array Data ..........................................................................................................7
Writing Commands/Command Sequences.......................................................................7
Simultaneous Read/Write Operations with Zero Latency .................................................8
Standby Mode ..................................................................................................................8
Automatic Sleep Mode .....................................................................................................8
#RESET: Hardware Reset Pin..........................................................................................9
Output Disable Mode........................................................................................................9
Autoselect Mode...............................................................................................................9
Sector/Sector Block Protection and Unprotection...........................................................9
Write Protect (#WP) .....................................................................................................10
Temporary Sector Unprotect ........................................................................................10
Security Sector Flash Memory Region .........................................................................10
Hardware Data Protection ............................................................................................11
Reading Array Data ........................................................................................................12
Reset Command.............................................................................................................12
AUTOSELECT Command Sequence .............................................................................13
Byte/Word Program Command Sequence......................................................................13
Unlock Bypass Command Sequence .............................................................................14
Chip Erase Command Sequence ...................................................................................14
Sector Erase Command Sequence ................................................................................14
Erase Suspend/Erase Resume Commands ...................................................................15
DQ7: #Data Polling.........................................................................................................16
RY/#BY: Ready/#Busy ...................................................................................................16
DQ6: Toggle Bit I............................................................................................................16
6.2
Command Definitions ................................................................................................... 12
6.2.1
6.2.2
6.2.3
6.2.4
6.2.5
6.2.6
6.2.7
6.2.8
6.3
Write Operation Status ................................................................................................. 16
6.3.1
6.3.2
6.3.3
-1-
Publication Release Date: December 27, 2005
Revision A4
W19B320AT/B
6.3.4
6.3.5
6.3.6
6.3.7
DQ2: Toggle Bit II...........................................................................................................17
Reading Toggle Bits DQ6/DQ2 ......................................................................................17
DQ5: Exceeded Timing Limits ........................................................................................17
DQ3: Sector Erase Timer ...............................................................................................18
7.
TABLE OF OPERATION MODES ............................................................................................ 19
7.1
7.2
7.3
7.4
7.5
Device Bus Operations ................................................................................................. 19
AUTOSELECT Codes (High Voltage Method) ............................................................. 19
Sector Address Table (Top Boot Block) ....................................................................... 20
Sector Address Table (Bottom Boot Block) .................................................................. 22
CFI Query Identification String...................................................................................... 26
7.5.1
7.5.2
7.5.3
7.5.4
7.5.5
System Interface String ..................................................................................................26
Device Geometry Definition ............................................................................................27
Primary Vendor-Specific Extended Query ......................................................................28
Command Definitions .....................................................................................................29
Write Operation Status ...................................................................................................30
7.6
7.7
7.8
7.9
7.10
7.11
7.12
8.
8.1
8.2
8.3
8.4
Temporary Sector Unprotect Algorithm ........................................................................ 31
In-System Sector Protect/Unprotect Algorithms........................................................... 32
Security Sector Protect Verify....................................................................................... 33
Program Algorithm........................................................................................................ 33
Erase Algorithm ............................................................................................................ 34
Data Polling Algorithm .................................................................................................. 34
Toggle Bit Algorithm ..................................................................................................... 35
Absolute Maximum Ratings .......................................................................................... 36
Operating Ranges......................................................................................................... 36
DC Characteristics........................................................................................................ 37
8.3.1
8.4.1
8.4.2
CMOS Compatible..........................................................................................................37
Test Condition ................................................................................................................38
AC Test Load and Waveforms .......................................................................................38
ELECTRICAL CHARACTERISTICS......................................................................................... 36
AC Characteristics ........................................................................................................ 38
8.5
8.6
8.7
8.8
8.9
8.10
9.
9.1
Read-Only Operations .................................................................................................. 39
Hardware Reset (#RESET) .......................................................................................... 39
Word/Byte Configuration (#BYTE)................................................................................ 39
Erase and Program Operation...................................................................................... 40
Temporary Sector Unprotect ........................................................................................ 40
Alternate #CE Controlled Erase and Program Operations........................................... 41
AC Read Waveform...................................................................................................... 42
-2-
TIMING WAVEFORMS ............................................................................................................. 42
W19B320AT/B
9.2
9.3
9.4
9.5
9.6
9.7
9.8
9.9
9.10
9.11
9.12
9.13
9.14
10.
11.
12.
13.
Reset Waveform ........................................................................................................... 42
#BYTE Waveform for Read Operation ......................................................................... 43
#BYTE Waveform for Write Operation ......................................................................... 43
Programming Waveform............................................................................................... 44
Accelerated Programming Waveform........................................................................... 44
Chip/Sector Erase Waveform ....................................................................................... 45
Back-to back Read/Write Cycle Waveform .................................................................. 45
#Data Polling Waveform (During Embedded Algorithms) ............................................ 46
Toggle Bit Waveform (During Embedded Algorithms) ................................................. 46
DQ 2 vs. DQ6 Waveform .............................................................................................. 47
Temporary Sector Unprotect Timing Diagram.............................................................. 47
Sector/Sector Block Protect and Unprotect Timing Diagram ....................................... 47
Alternate #CE Controlled Write (Erase/Program) Operation Timing............................ 48
LATCHUP CHARACTERISTICS .............................................................................................. 49
CAPACITANCE......................................................................................................................... 49
ORDERING INFORMATION .................................................................................................... 50
PACKAGE DIMENSIONS ......................................................................................................... 51
13.1
13.2
TFBGA48ball (6X8 mm^2, Ø=0.40mm)........................................................................ 51
48-Pin Standard Thin Small Outline Package .............................................................. 52
14.
VERSION HISTORY ................................................................................................................. 53
-3-
Publication Release Date: December 27, 2005
Revision A4
W19B320AT/B
1. GENERAL DESCRIPTION
The W19B320AT/B is a 32Mbit, 2.7~3.6-volt flexible bank CMOS flash memory organized as 4M x 8
or 2M
×
16 bits. The word-wide (× 16) data appears on DQ15-DQ0, and byte-wide (x 8) data appears
on DQ7-DQ0. The device can be programmed and erased in-system with a standard 3.0-volt power
supply. A 12-volt V
PP
is not required. The unique cell architecture of the W19B320AT/B results in fast
program/erase operations with extremely low current consumption (compared to other comparable
3-volt flash memory products). The device can also be programmed and erased by using standard
EPROM programmers.
2. FEATURES
Performance
2.7~3.6-volt write (program and erase)
operations
Fast write operation
Sector erases time: 0.4 Sec (typical)
Chip erases time: 49 Sec (typical)
Byte programming time: 5
μs
(typical)
Read access time: 70 ns
Typical program/erase cycles:
100K
Twenty-year data retention
Ultra low power consumption
Active current (Read): 10 mA (typical)
Active current (Read while Erase/Program):
21 mA (typical)
Standby current: 0.2
μA
(typical)
Architecture
Flexible Bank architectures
Consist of four banks that customer can
group the bank size as they needed
Bank 1: 4M; Bank 2: 12M;
Bank 3: 12M; Bank 4: 4M
Security Sector Size: 256 Bytes
The Security Sector is an OTP; once the
sector is programmed, it cannot be erased
Simultaneous Read/write operation
Data can be continuously read from one bank
while processing erase/program functions in
other bank with zero latency
JEDEC standard byte-wide and word-wide
pinouts
Manufactured on WinStack 0.18μm process
technology
Available packages: 48-pin TSOP and 48-ball
TFBGA (6x8mm)
Software Features
Compatible with common Flash Memory
Interface (CFI) specification
Flash device parameters stored directly on
the device
Allows software driver to identify and use a
variety of different current and future Flash
products
Erase Suspend/Erase Resume
Suspends erase operations to allow
programming in same bank
End of program detection
Software method: Toggle bit/Data polling
Unlock Bypass Program command
Reduces overall programming time when
issuing multiple program command
sequences
Hardware Features
Ready/#Busy output (RY/#BY)
Detect program or erase cycle completion
Hardware reset pin (#RESET)
Reset the internal state machine to the read
mode
-4-
W19B320AT/B
#WP/ACC input pin
Write protect (#WP) function allows
protection of two outermost boot sectors,
regardless of sector protection status
Acceleration (ACC) function accelerates
program timing
Sector Protection
Sectors can be locked in-system or via
programmer
Temporary Sector Unprotect allows changing
data in protected sectors in-system
3. PIN CONFIGURATIONS
(Top View, Balls Face Down)
A6
A13
48-Ball TFBGA
C6
A14
B6
A12
D6
A15
E6
A16
F6
#BYTE
G6
DQ15/A-1
H6
Vss
A5
A9
B5
A8
C5
A10
D5
A11
E5
DQ7
F5
DQ14
G5
DQ13
H5
DQ6
A4
#WE
B4
#RESET
C4
NC
D4
A19
E4
DQ5
F4
DQ12
G4
V
DD
H4
DQ4
A3
RY/#BY
B3
#WP/ACC
C3
A18
D3
A20
E3
DQ2
F3
DQ10
G3
DQ11
H3
DQ3
A2
A7
B2
A17
C2
A6
D2
A5
E2
DQ0
F2
DQ8
G2
DQ9
H2
DQ1
A1
A3
B1
A4
C1
A2
D1
A1
E1
A0
F1
#CE
G1
#OE
H1
Vss
A15
A14
A13
A12
A11
A10
A9
A8
A19
A20
#WE
#RESET
NC
#WP/ACC
RY/#BY
A18
A17
A7
A6
A5
A4
A3
A2
A1
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
48
47
46
45
44
43
42
48-pin
TSOP
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
A16
#BYTE
Vss
DQ15/A-1
DQ7
DQ14
DQ6
DQ13
DQ5
DQ12
DQ4
V
DD
DQ11
DQ3
DQ10
DQ2
DQ9
DQ1
DQ8
DQ0
#OE
Vss
#CE
A0
-5-
Publication Release Date: December 27, 2005
Revision A4
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