W25X10A, W25X20A, W25X40A, W25X80A
1M-BIT, 2M-BIT, 4M-BIT AND 8M-BIT
SERIAL FLASH MEMORY WITH
4KB SECTORS AND DUAL OUTPUT SPI
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Publication Release Date: August 7, 2009
Revision F
W25X10A, W25X20A, W25X40A, W25X80A
Table of Contents
1.
2.
3.
4.
5.
6.
7.
GENERAL DESCRIPTION ......................................................................................................... 4
FEATURES ................................................................................................................................. 4
PIN CONFIGURATION SOIC 150-MIL ....................................................................................... 5
PIN CONFIGURATION SOIC 208-MIL ....................................................................................... 5
PIN CONFIGURATION PDIP 300-MIL ....................................................................................... 5
PAD CONFIGURATION WSON 6X5-MM .................................................................................. 6
PIN DESCRIPTION..................................................................................................................... 6
7.1
7.2
7.3
7.4
7.5
7.6
7.7
8.
9.
Package Types ............................................................................................................... 7
Chip Select (/CS) ............................................................................................................ 7
Serial Data Output (DO) ................................................................................................. 7
Write Protect (/WP) ......................................................................................................... 7
HOLD (/HOLD) ............................................................................................................... 7
Serial Clock (CLK) .......................................................................................................... 7
Serial Data Input / Output (DIO) ..................................................................................... 7
BLOCK DIAGRAM ...................................................................................................................... 8
FUNCTIONAL DESCRIPTION ................................................................................................... 9
9.1
SPI OPERATIONS ......................................................................................................... 9
9.1.1
9.1.2
9.1.3
SPI Modes ........................................................................................................................9
Dual Output SPI ...............................................................................................................9
Hold Function ...................................................................................................................9
Write Protect Features....................................................................................................10
9.2
10.
WRITE PROTECTION.................................................................................................. 10
9.2.1
CONTROL AND STATUS REGISTERS ................................................................................... 11
10.1
STATUS REGISTER .................................................................................................... 11
10.1.1
10.1.2
10.1.3
10.1.4
10.1.5
10.1.6
10.1.7
BUSY............................................................................................................................11
Write Enable Latch (WEL) ............................................................................................11
Block Protect Bits (BP2, BP1, BP0) ..............................................................................11
Top/Bottom Block Protect (TB) .....................................................................................11
Reserved Bits ...............................................................................................................11
Status Register Protect (SRP) ......................................................................................12
Status Register Memory Protection ..............................................................................13
Manufacturer and Device Identification ........................................................................14
Instruction Set ..............................................................................................................15
Write Enable (06h)........................................................................................................16
Write Disable (04h) .......................................................................................................16
Read Status Register (05h) ..........................................................................................17
Write Status Register (01h) ..........................................................................................18
10.2
INSTRUCTIONS ........................................................................................................... 14
10.2.1
10.2.2
10.2.3
10.2.4
10.2.5
10.2.6
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W25X10A, W25X20A, W25X40A, W25X80A
10.2.7
10.2.8
10.2.9
10.2.10
10.2.11
10.2.12
10.2.13
10.2.14
10.2.15
10.2.16
10.2.17
Read Data (03h) ...........................................................................................................19
Fast Read (0Bh) ...........................................................................................................20
Fast Read Dual Output (3Bh) .......................................................................................21
Page Program (02h) ...................................................................................................22
Sector Erase (20h) .....................................................................................................23
Block Erase (D8h) ......................................................................................................24
Chip Erase (C7h or 60h) .............................................................................................25
Power-down (B9h) ......................................................................................................26
Release Power-down / Device ID (ABh) .....................................................................27
Read Manufacturer / Device ID (90h) .........................................................................29
JEDEC ID (9Fh) .........................................................................................................30
11.
ELECTRICAL CHARACTERISTICS ......................................................................................... 31
11.1
11.2
11.3
11.4
11.5
11.6
11.7
11.8
11.9
11.10
Absolute Maximum Ratings .......................................................................................... 31
Operating Ranges......................................................................................................... 31
Power-up Timing and Write Inhibit Threshold .............................................................. 31
DC Electrical Characteristics ........................................................................................ 33
AC Measurement Conditions ........................................................................................ 34
AC Electrical Characteristics ........................................................................................ 35
AC Electrical Characteristics (cont’d) ........................................................................... 36
Serial Output Timing ..................................................................................................... 37
Input Timing .................................................................................................................. 37
Hold Timing ................................................................................................................. 37
8-Pin SOIC 150-mil (Package Code SN)...................................................................... 38
8-Pin SOIC 208-mil (Package Code SS) ...................................................................... 39
8-Pin PDIP 300-mil (Package Code DA) ...................................................................... 40
8-Contact 6x5mm WSON (Package Code ZP) ............................................................ 41
12.
PACKAGE SPECIFICATION .................................................................................................... 38
12.1
12.2
12.3
12.4
8-Pad WSON 6x5mm Cont’d. ................................................................................................... 42
13.
14.
ORDERING INFORMATION .................................................................................................... 43
13.1
Valid Part Numbers and Top Side Marking .................................................................. 44
REVISION HISTORY ................................................................................................................ 45
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Publication Release Date: August 7, 2009
Revision F
W25X10A, W25X20A, W25X40A, W25X80A
1. GENERAL DESCRIPTION
The W25X10A (1M-bit), W25X20A (2M-bit), W25X40A (4M-bit) and W25X80A (8M-bit) Serial Flash
memories provide a storage solution for systems with limited space, pins and power. The 25X series
offers flexibility and performance well beyond ordinary Serial Flash devices. They are ideal for code
download applications as well as storing voice, text and data. The devices operate on a single 2.7V to
3.6V power supply with current consumption as low as 5mA active and 1µA for power-down. All
devices are offered in space-saving packages.
The W25X10A/20A/40A/80A array is organized into 512/1024/2048/4096 programmable pages of
256-bytes each. Up to 256 bytes can be programmed at a time using the Page Program instruction.
Pages can be erased in groups of 16 (sector erase), groups of 256 (block erase) or the entire chip
(chip erase). The W25X10A/20A/40A/80A has 32/64/128/256 erasable sectors and 2/4/8/16 erasable
blocks respectively. The small 4KB sectors allow for greater flexibility in applications that require data
and parameter storage. (See figure 2.)
The W25X10A/20A/40A/80A supports the standard Serial Peripheral Interface (SPI), and a high
performance dual output SPI using four pins: Serial Clock, Chip Select, Serial Data I/O and Serial
Data Out. SPI clock frequencies of up to 100MHz are supported allowing equivalent clock rates of
200MHz when using the Fast Read Dual Output instruction. These transfer rates are comparable to
those of 8 and 16-bit Parallel Flash memories.
A Hold pin, Write Protect pin and programmable write protect, with top or bottom array control
features, provide further control flexibility. Additionally, the device supports JEDEC standard
manufacturer and device identification.
2. FEATURES
Family of Serial Flash Memories
– W25X10A: 1M-bit / 128K-byte (131,072)
– W25X20A: 2M-bit / 256K-byte (262,144)
– W25X40A: 4M-bit / 512K-byte (524,288)
– W25X80A: 8M-bit / 1M-byte (1,048,576)
– 256-bytes per programmable page
– Uniform 4K-byte Sectors / 64K-byte Blocks
SPI with Single or Dual Outputs
– Clock, Chip Select, Data I/O, Data Out
– Optional Hold function for SPI flexibility
Data Transfer up to 200M-bits / second
– Clock operation to 100MHz
– Fast Read Dual Output instruction
– Auto-increment Read capability
Software and Hardware Write Protection
– Write-Protect all or portion of memory
– Enable/Disable protection with /WP pin
– Top or bottom array protection
Flexible Architecture with 4KB sectors
– Sector Erase (4K-bytes)
– Block Erase (64K-byte)
– Page program up to 256 bytes <2ms
– More than 100,000 erase/write cycles
– More than 20-year data retention
Low Power Consumption, Wide
Temperature Range
– Single 2.7 to 3.6V supply
– 5mA active current, 1µA Power-down (typ)
– -40° to +85°C operating range
Space Efficient Packaging
– 8-pin SOIC 150-mil
(1)
– 8-pin SOIC 208-mil (W25X40A/80A)
– 8-pin PDIP 300-mil
– 8-pad WSON 6x5-mm
.
Note 1: See “Valid Part Number and Top Side Marking” Section, Note 2 for special ordering information.
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W25X10A, W25X20A, W25X40A, W25X80A
3. PIN CONFIGURATION SOIC 150-MIL
Figure 1a. W25X10A, W25X20A, W25X40A and W25X80A Pin Assignments, 8-pin SOIC (Package Code SN)
4. PIN CONFIGURATION SOIC 208-MIL
Figure 1b. W25X40A and W25X80A Pin Assignments, 8-pin SOIC (Package Code SS)
5. PIN CONFIGURATION PDIP 300-MIL
Figure 1c. W25X40A and W25X80A Pin Assignments, 8-pin PDIP (Package Code DA)
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Publication Release Date: August 7, 2009
Revision F
模拟与混合信号
