DDR DRAM, 32MX64, 0.65ns, CMOS, PBGA208, 16 X 20 MM, 1 MM PITCH, PLASTIC, BGA-208
厂商名称:Microsemi
厂商官网:https://www.microsemi.com
下载文档型号 | W3H32M64E-667SBC | W3H32M64E-667SBM | W3H32M64E-400SBC | W3H32M64E-533SBI |
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描述 | DDR DRAM, 32MX64, 0.65ns, CMOS, PBGA208, 16 X 20 MM, 1 MM PITCH, PLASTIC, BGA-208 | DDR DRAM, 32MX64, 0.65ns, CMOS, PBGA208, 16 X 20 MM, 1 MM PITCH, PLASTIC, BGA-208 | DDR DRAM, 32MX64, 0.6ns, CMOS, PBGA208, 16 X 20 MM, 1 MM PITCH, PLASTIC, BGA-208 | DDR DRAM, 32MX64, 0.65ns, CMOS, PBGA208, 16 X 20 MM, 1 MM PITCH, PLASTIC, BGA-208 |
是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | Microsemi | Microsemi | Microsemi | Microsemi |
包装说明 | BGA, BGA208,11X19,40 | BGA, | BGA, BGA208,11X19,40 | 16 X 20 MM, 1 MM PITCH, PLASTIC, BGA-208 |
Reach Compliance Code | unknown | unknown | unknown | unknown |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 |
访问模式 | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST |
最长访问时间 | 0.65 ns | 0.65 ns | 0.6 ns | 0.65 ns |
其他特性 | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH |
JESD-30 代码 | R-PBGA-B208 | R-PBGA-B208 | R-PBGA-B208 | R-PBGA-B208 |
内存密度 | 2147483648 bit | 2147483648 bit | 2147483648 bit | 2147483648 bit |
内存集成电路类型 | DDR DRAM | DDR DRAM | DDR DRAM | DDR DRAM |
内存宽度 | 64 | 64 | 64 | 64 |
功能数量 | 1 | 1 | 1 | 1 |
端口数量 | 1 | 1 | 1 | 1 |
端子数量 | 208 | 208 | 208 | 208 |
字数 | 33554432 words | 33554432 words | 33554432 words | 33554432 words |
字数代码 | 32000000 | 32000000 | 32000000 | 32000000 |
工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
最高工作温度 | 70 °C | 125 °C | 70 °C | 85 °C |
组织 | 32MX64 | 32MX64 | 32MX64 | 32MX64 |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | BGA | BGA | BGA | BGA |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY |
峰值回流温度(摄氏度) | 225 | 225 | 225 | 225 |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
自我刷新 | YES | YES | YES | YES |
最大供电电压 (Vsup) | 1.9 V | 1.9 V | 1.9 V | 1.9 V |
最小供电电压 (Vsup) | 1.7 V | 1.7 V | 1.7 V | 1.7 V |
标称供电电压 (Vsup) | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
表面贴装 | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | MILITARY | COMMERCIAL | INDUSTRIAL |
端子形式 | BALL | BALL | BALL | BALL |
端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
处于峰值回流温度下的最长时间 | 30 | 30 | 30 | 30 |
零件包装代码 | BGA | BGA | - | BGA |
针数 | 208 | 208 | - | 208 |