W9464G6KH
1M
4 BANKS
16 BITS DDR SDRAM
Table of Contents-
1.
2.
3.
4.
5.
6.
7.
8.
GENERAL DESCRIPTION ......................................................................................................... 4
FEATURES ................................................................................................................................. 4
ORDER INFORMATION ............................................................................................................. 4
KEY PARAMETERS ................................................................................................................... 5
PIN CONFIGURATION ............................................................................................................... 6
PIN DESCRIPTION..................................................................................................................... 7
BLOCK DIAGRAM ...................................................................................................................... 8
FUNCTIONAL DESCRIPTION.................................................................................................... 9
8.1
Power Up Sequence ....................................................................................................... 9
8.2
Command Function ...................................................................................................... 10
8.2.1
Bank Activate Command ........................................................................... 10
8.2.2
Bank Precharge Command........................................................................ 10
8.2.3
Precharge All Command ............................................................................ 10
8.2.4
Write Command ......................................................................................... 10
8.2.5
Write with Auto-precharge Command ........................................................ 10
8.2.6
Read Command ......................................................................................... 10
8.2.7
Read with Auto-precharge Command ....................................................... 10
8.2.8
Mode Register Set Command.................................................................... 11
8.2.9
Extended Mode Register Set Command ................................................... 11
8.2.10
No-Operation Command ............................................................................ 11
8.2.11
Burst Read Stop Command ....................................................................... 11
8.2.12
Device Deselect Command ....................................................................... 11
8.2.13
Auto Refresh Command ............................................................................ 11
8.2.14
Self Refresh Entry Command .................................................................... 12
8.2.15
Self Refresh Exit Command....................................................................... 12
8.2.16
Data Write Enable /Disable Command ...................................................... 12
8.3
Read Operation............................................................................................................. 12
8.4
Write Operation ............................................................................................................. 13
8.5
Precharge ..................................................................................................................... 13
8.6
Burst Termination ......................................................................................................... 13
8.7
Refresh Operation ........................................................................................................ 13
8.8
Power Down Mode ....................................................................................................... 14
8.9
Input Clock Frequency Change during Precharge Power Down Mode ........................ 14
8.10 Mode Register Operation .............................................................................................. 14
8.10.1
Burst Length field (A2 to A0) ...................................................................... 14
8.10.2
Addressing Mode Select (A3) .................................................................... 15
8.10.3
CAS Latency field (A6 to A4) ..................................................................... 16
8.10.4
DLL Reset bit (A8) ..................................................................................... 16
8.10.5
Mode Register /Extended Mode register change bits (BA0, BA1)............. 16
Publication Release Date: Nov. 14, 2014
Revision: A02
-1-
W9464G6KH
8.10.6
Extended Mode Register field .................................................................... 16
8.10.7
Reserved field ............................................................................................ 16
OPERATION MODE ................................................................................................................. 17
9.1
Simplified Truth Table ................................................................................................... 17
9.2
Function Truth Table ..................................................................................................... 18
9.3
Function Truth Table for CKE ....................................................................................... 21
9.4
Simplified Stated Diagram ............................................................................................ 22
ELECTRICAL CHARACTERISTICS ......................................................................................... 23
10.1 Absolute Maximum Ratings .......................................................................................... 23
10.2 Recommended DC Operating Conditions .................................................................... 23
10.3 Capacitance .................................................................................................................. 24
10.4 Leakage and Output Buffer Characteristics .................................................................. 24
10.5 DC Characteristics ........................................................................................................ 25
10.6 AC Characteristics and Operating Condition ................................................................ 26
10.7 AC Test Conditions ....................................................................................................... 27
SYSTEM CHARACTERISTICS FOR DDR SDRAM ................................................................. 29
11.1 Table 1: Input Slew Rate for DQ, DQS, and DM .......................................................... 29
11.2 Table 2: Input Setup & Hold Time Derating for Slew Rate ........................................... 29
11.3 Table 3: Input/Output Setup & Hold Time Derating for Slew Rate ............................... 29
11.4 Table 4: Input/Output Setup & Hold Derating for Rise/Fall Delta Slew Rate ................ 29
11.5 Table 5: Output Slew Rate Characteristics (x16 Devices only) .................................... 29
11.6 Table 6: Output Slew Rate Matching Ratio Characteristics ......................................... 30
11.7 Table 7: AC Overshoot/Undershoot Specification for Address and Control Pins ......... 30
11.8 Table 8: Overshoot/Undershoot Specification for Data, Strobe, and Mask Pins .......... 31
11.9 System Notes:............................................................................................................... 32
TIMING WAVEFORMS ............................................................................................................. 34
12.1 Command Input Timing ................................................................................................ 34
12.2 Timing of the CLK Signals ............................................................................................ 34
12.3 Read Timing (Burst Length = 4) ................................................................................... 35
12.4 Write Timing (Burst Length = 4) .................................................................................... 36
12.5 DM, DATA MASK (W9464G6KH) ................................................................................. 37
12.6 Mode Register Set (MRS) Timing ................................................................................. 38
12.7 Extend Mode Register Set (EMRS) Timing .................................................................. 39
12.8 Auto-precharge Timing (Read Cycle, CL = 2) .............................................................. 40
12.9 Auto-precharge Timing (Read cycle, CL = 2), continued ............................................. 41
12.10 Auto-precharge Timing (Write Cycle) .......................................................................... 42
12.11 Read Interrupted by Read (CL = 2, BL = 2, 4, 8) ........................................................ 43
12.12 Burst Read Stop (BL = 8) ............................................................................................ 43
12.13 Read Interrupted by Write & BST (BL = 8) .................................................................. 44
12.14 Read Interrupted by Precharge (BL = 8) ..................................................................... 44
12.15 Write Interrupted by Write (BL = 2, 4, 8) ..................................................................... 45
12.16 Write Interrupted by Read (CL = 2, BL = 8) ................................................................ 45
12.17 Write Interrupted by Read (CL = 3, BL = 4) ................................................................ 46
12.18 Write Interrupted by Precharge (BL = 8) ..................................................................... 46
12.19 2 Bank Interleave Read Operation (CL = 2, BL = 2) ................................................... 47
Publication Release Date: Nov. 14, 2014
Revision: A02
-2-
9.
10.
11.
12.
W9464G6KH
12.20 2 Bank Interleave Read Operation (CL = 2, BL = 4) ................................................... 47
12.21 4 Bank Interleave Read Operation (CL = 2, BL = 2) ................................................... 48
12.22 4 Bank Interleave Read Operation (CL = 2, BL = 4) ................................................... 48
12.23 Auto Refresh Cycle ..................................................................................................... 49
12.24 Precharge/Activate Power Down Mode Entry and Exit Timing ................................... 49
12.25 Input Clock Frequency Change during Precharge Power Down Mode Timing .......... 49
12.26 Self Refresh Entry and Exit Timing ............................................................................. 50
Package Specification ............................................................................................................... 51
REVISION HISTORY ................................................................................................................ 52
13.
14.
Publication Release Date: Nov. 14, 2014
Revision: A02
-3-
W9464G6KH
1. GENERAL DESCRIPTION
W9464G6KH is a CMOS Double Data Rate synchronous dynamic random access memory (DDR
SDRAM); organized as 1M words
4 banks
16 bits. W9464G6KH delivers a data bandwidth of up to
400M words per second. To fully comply with the personal computer industrial standard, W9464G6KH
is sorted into two speed grades: -5 and -5I. The -5 and -5I is compliant to the DDR400/CL3
specification (the -5I industrial grade which is guaranteed to support -40°C ~ 85°C).
All Inputs reference to the positive edge of CLK (except for DQ, DM and CKE). The timing reference
point for the differential clock is when the CLK and
CLK
signals cross during a transition. Write and
Read data are synchronized with the both edges of DQS (Data Strobe).
By having a programmable Mode Register, the system can change burst length, latency cycle,
interleave or sequential burst to maximize its performance. W9464G6KH is ideal for any high
performance applications.
2. FEATURES
2.5V ± 0.2V Power Supply for DDR400
Up to 200 MHz Clock Frequency
Double Data Rate architecture; two data transfers per clock cycle
Differential clock inputs (CLK and
CLK
)
DQS is edge-aligned with data for Read; center-aligned with data for Write
CAS Latency: 2, 2.5 and 3
Burst Length: 2, 4 and 8
Auto Refresh and Self Refresh
Precharged Power Down and Active Power Down
Write Data Mask
Write Latency = 1
15.6µS Refresh interval (4K/64 mS Refresh)
Maximum burst refresh cycle: 8
Interface: SSTL_2
Packaged in TSOP II 66-pin, using Lead free materials with RoHS compliant
3. ORDER INFORMATION
PART NUMBER
SPEED
SELF REFRESH
CURRENT (MAX.)
OPERATING
TEMPERATURE
W9464G6KH-5
W9464G6KH-5I
DDR400/CL3
DDR400/CL3
2 mA
2 mA
0°C ~ 70°C
-40°C ~ 85°C
Publication Release Date: Nov. 14, 2014
Revision: A02
-4-
W9464G6KH
4. KEY PARAMETERS
SYMBOL
DESCRIPTION
CL = 2
Max.
Min.
t
CK
Clock Cycle Time
CL = 2.5
Max.
Min.
CL = 3
Max.
t
RAS
t
RC
I
DD0
I
DD1
I
DD2F
I
DD2Q
I
DD4R
I
DD4W
I
DD5
I
DD6
Active to Precharge Command Period
Active to Ref/Active Command Period
Operating Current: One Bank Active-Precharge
Operating Current: One Bank Active-Read-Precharge
Precharge floating standby current
Precharge quiet standby current
Burst Operation Read Current
Burst Operation Write Current
Auto Refresh Current
MIN./MAX.
Min.
-5/-5I
7.5 nS
10 nS
6 nS
10 nS
5 nS
10 nS
40 nS
55 nS
45 mA
55 mA
25 mA
25 mA
100 mA
95 mA
60 mA
2 mA
Min.
Min.
Max.
Max.
Max.
Max.
Max.
Max.
Max.
Max.
Self Refresh Current
Publication Release Date: Nov. 14, 2014
Revision: A02
-5-
嵌入式系统
